GSEF 2019 Advisory Board Ralph Lauxmann, Senior Vice President Systems & Technology, Continental Automotive Hans Adlkofer, Vice President Systems Group, The Automotive Division, Infineon Technologies Hai Wang, Senior Vice President, Global Technology Innovation, NXP Semiconductors Wei-Chung Wang, Executive Vice President, Manufacturing and Operations, Cypress Semiconductor Michael Campbell, Senior Vice President Engineering, Qualcomm Incorporated Qi Bi, Senior Vice President, China Telecom Technology Innovation Centre Dr Guanshan Tong, Senior Vice President and Former Chief Technology Officer, BOE Technology Group Co Eiji Fujii, Executive Officer, Panasonic Corporation and Vice President Chief Technology Officer, Automotive & Industrial Systems Company Ross Jatou, Vice President & General Manager, Automotive Solutions Division, ON Semiconductor Day One 13 March 2019 14:00-18:00 Event Registration 18:00-21:00 Drinks Reception and Welcome Dinner Day Two 14 March 2019 08:00-08:50 Event Registration and Collection of Meeting schedules 08:50-09:00 Chair s opening remarks: Sandeep Kumar, Senior Vice President, Worldwide Operations, Silicon Labs 09:00-09:30 Opening Address: Hans Storks, Chief Technology Officer, On Semiconductor Managing Big Data: Convergence in the cloud for IoT Examining the exponential growth of artificial intelligence adoption in the cloud and at the edge 09:30-10:00 The value of pre-processing at the edge to optimising the cloud environment Raghu Nambiar, Corporate Vice President and Chief Technology Officer, AMD
10:00-10:30 Application of Big Data and Machine Learning in Global Manufacturing Chains to Control IC Quality, Yield, and Manufacturing Excellence Implementation of end-to-end IC-level traceability for automotive quality control Automated cross-supply-chain data analytics for smart manufacturing Smart data sharing in collaborative manufacturing ecosystems Going from big data to instant manufacturing insights and action Dr. Paul Simon - Executive VP and co-founder, Qualtera 10:35-11:05 Business Meeting 1 11:10-11:40 Business Meeting 2 GSF: Chair Sandeep Kumar, Senior Vice President, Worldwide Operations, Silicon Labs 11:45-12:15 12:15-12:45 Business Meeting 3 Keynote presentation: Semiconductors for Safe and Secure Mobility Automotive is driving the next wave of semiconductor growth as global megatrends result in tripling the IC content per car With this growth, comes a new set of disruptive challenges in automotive IC manufacturing To ensure quality, safety and security, a new more holistic approach is needed GEF: Chair John T. Kelley, Senior Director, International Programs, Consumer Technology Association Keynote Presentation: Automotive: Autonomous driving systems Exploring the advancement of new features, connectivity, and intelligence in modern vehicle Optimising IVI systems to enhance user experience How to successful integrate of smart technology to meet customer needs The role of artificial intelligence and machine learning in personalising the driving experience Ralph Lauxmann, Senior Vice President Systems & Technology, Continental Automotive Business Meeting 4
12:45-13:15 13:15-14:15 14:15-14:45 14:45-15:15 15:15-15:45 This session will address the manufacturing considerations and requirements for future car electronics Hai Wang, Senior Vice President, Global Technology Innovations, NXP Semiconductors E-mobility and Electric Vehicles: GM s Zero emission strategy Overcoming challenges to battery technology and charging Business Meeting 5 infrastructure How existing supply chain support EV battery production Maximising car lifetime value through IOT and data analytics Lunch and Networking Chair: Chris Foster: Vice President Fellow, FAB25 Product Engineering and Integration, Cypress corporation Live interview: The Future of displays LCD, OLED, or MicroLED Which will dominate the industry LCD, OLED or MicroLED What will emerge after MicroLED Business Meeting 6 Acknowledging how OLED will influence the smartphone, smart TVs and flexible electronics industry PANEL DISCUSSION: The future of semiconductor test systems Options for testing complex semiconductor devices Traditional design and test cycles High Volume MEMS Production Test Speakers: Astronics Test Systems Chair: John T. Kelley, Senior Director, International Programs, Consumer Technology Association Flexible displays for future technology: Unlocking innovative product designs How will flexible displays and sensors promote innovative products How will they facilitate greater user experience and compatibility with the user s lifestyle
15:50-16:20 Advanced Materials: Role of materials in addressing new challenges in developing devices with advanced performance Business Meeting 7 16:20-16:50 16:50-17:20 Best Practice: Samsung Advanced Package Solution What is "Advanced Package"? Mobile package trend and solution path for future premium mobile products AI/Network package solution using interposer and future application Samsung Package solution you may not know! Dae-Woo Kim, Vice President of advanced package solution, package development team, Samsung Semiconductor R&D Center The end of Moore s law: Assessing the Path forward for IC manufacturing PR (Chidi) Chidambaram, Vice President, QCT Process Technology & Foundry Engineering, Qualcomm, Incorporated New Technology innovation and brand protection Understanding the next level of consumer technology Brand protection and the development of unique products Business Meeting 8 17:20-18:00 PANEL DISCUSSION: 5G world- Growth in high bandwidth communication: the move from 4G to 5G Research shows that 5G connections will provide a number of enhanced capabilities over 4G which include increased data rates, reduced latency and enhanced reliability. This panel aims to assess the progress of 5G connection. Establishing infrastructure to withstand 5G capabilities Overcoming challenges surrounding power and the security risk brought on by connections Exploring how 5G will push forward innovation in autonomous vehicles, smartphones and VR/AR industries Examining the future of 5G: Will there be 6G in the near future Qi Bi, Senior Vice Present, China Telecom Technology Innovation Centre 18:00 Chair s Closing Remarks: John T. Kelley, Senior Director, International Programs, Consumer Technology Association 18:00-20:00 Drinks Reception and Networking Sponsored by Nordson 08:00-09:00 Event Registration and Collection of Meeting Schedules Day Three 15 March 2019
09:00-09:10 Chair s Opening Remarks: John T. Kelley, Senior Director, International Programs, Consumer Technology Association 09:10-09:40 Keynote speech: 09:40-10:10 Sponsored presentation by Linde 10:10-10:40 Business Meeting 9 10:40-11:10 Business Meeting 10 11:10-11:40 Maximising Industry 4.0 to achieve efficiency and save cost How to successfully deploy machine learning and robotics for labour intensive tasks Combining lean manufacturing and industry 4.0 principles to achieve operational excellence Prevention maintenance: Implementing advanced analytics to assess machine function in real-time and predict failure Leveraging incoming data to improve day-to-day operations GSF:Chair Raghu Nambiar, Corporate Vice President and Chief Technology Officer, GEF: Chair John T. Kelley, Senior Director, International Programs, Consumer Technology Association AMD 11:45-12:15 Business Meeting 11 Open standards for VR/AR and AI How to best utilise VR tech and mainstream VR adoption to further your business goals and increase revenue Integrating augmented reality to personalise user experience Leveraging VR and AR in other industries 12:15-12:45 Lithography: Movement from 7nm to 5nm IoT Security be part of the solution Lithography at 5nm - Will EUVL have a prominent role at 5nm? How to successfully mitigate the increased security risks of Identifying new innovative methods for heat management connecting several devices to the internet Analysing the power density and physical limits of 5nm chips Latest policies and planning of IoT security such as internet Overcoming the manufacturing cost barriers: Alternative to EUV security law of the People's Republic of China How quantum effects will impact designs below 5nm Designing chips that protect themselves: Protecting data, embedded systems and software Recognising the long-term cost benefits of this approach Understanding the rapidly evolving cyber-threat landscape 12:45-13:45 Lunch and Networking
13:45-14:15 14:15-14:45 14:45-15:15 15:15-15:55 Business Meeting 12 Memory/NAND application in the Internet of Things world Addressing new applications Exploring the 3D NAND Flash memory demand for smartphones, laptops and tablets John Scaramuzzo, SVP, Advanced Storage Technology Office, Western Digital Automotive and telecom industry partnerships in driving forward innovation in mobility and 5G The benefits of collaborations in the development of future mobility and 5G services Security considerations and future forecasts Business Meeting 13 Business Meeting 14 PANEL DISCUSSION: The growth of autonomous driving: Achieving level four - highly autonomous vehicles by 2020-25. Autonomous vehicles can be viewed as a blend of semiconductor driven technology, the list includes: 3-D mapping applications, augmented reality, enhanced LIDAR sensors and improved camera based sensors. These developments have changed the way vehicle manufacturers interact with their suppliers and increased the demands from the semiconductor industry. What will it take to achieve success and encourage the journey towards full-autonomous vehicles? How will the industry address the fundamental concerns around safety How to bridge the impeding gap between expectations and demands between the automotive industry and their suppliers Understanding the regulation and policies that underpin the movement to build driverless cars Evaluation to the practicality of the 2020-25 time frame 15:55-16:00 Chair s Closing Remarks: Raghu Nambiar, Corporate Vice President and Chief Technology Officer, AMD 16:00-17:00 Farewell Drinks and Close of GSEF 2019