SN74ALVCH V 20-BIT BUS-INTERFACE FLIP-FLOP WITH 3-STATE OUTPUTS

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Member of the Texas Instruments Widebus Family EPIC (Enhanced-Performance Implanted CMOS) Submicron Process ESD Protection Exceeds 200 Per MIL-STD-883, Method 3015; Exceeds 20 Using Machine Model (C = 200 pf, R = 0) Latch-Up Performance Exceeds 250 ma Per JESD 17 Bus Hold on Data s Eliminates the Need for External Pullup/Pulldown Resistors Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages description This 20-bit bus-interface flip-flop is designed for 1.65-V to 3.6-V V CC operation. The can be used as two 10-bit flip-flops or one 20-bit flip-flop. The 20 flip-flops are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the device provides true data at the Q outputs. A buffered output-enable (OE) input can be used to place the ten outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. DGG OR DL PACKAGE (TOP VIEW) 1OE 1Q1 1Q2 1Q3 1Q4 V CC 1Q5 1Q6 1Q7 1Q8 1Q9 1Q10 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 V CC 2Q7 2Q8 2Q9 2Q10 2OE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1CLK 1D1 1D2 1D3 1D4 V CC 1D5 1D6 1D7 1D8 1D9 1D10 2D1 2D2 2D3 2D4 2D5 2D6 V CC 2D7 2D8 2D9 2D10 2CLK OE does not affect the internal operation of the flip-flops. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to V CC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. The is characterized for operation from 40 C to 85 C. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC and Widebus are trademarks of Texas Instruments Incorporated. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1999, Texas Instruments Incorporated POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1

logic symbol FUNCTION TABLE (each 10-bit flip-flop) INPUTS OUTPUT OE CLK D Q L H H L L L L H or L X Q0 H X X Z 1OE 1CLK 2OE 2CLK 1 56 28 29 EN2 C1 EN4 C3 1D1 1D2 1D3 1D4 1D5 1D6 1D7 1D8 1D9 1D10 2D1 2D2 2D3 2D4 2D5 2D6 2D7 2D8 2D9 2D10 55 54 52 51 49 48 47 45 44 43 42 41 40 38 37 36 34 33 31 30 1D 3D 2 4 2 3 5 6 8 9 10 12 13 14 15 16 17 19 20 21 23 24 26 27 1Q1 1Q2 1Q3 1Q4 1Q5 1Q6 1Q7 1Q8 1Q9 1Q10 2Q1 2Q2 2Q3 2Q4 2Q5 2Q6 2Q7 2Q8 2Q9 2Q10 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

logic diagram (positive logic) 1OE 1 1CLK 56 1D1 55 One of Ten Channels 1D C1 2 1Q1 To Nine Other Channels 2OE 28 2CLK 29 2D1 42 One of Ten Channels 1D C1 15 2Q1 To Nine Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC......................................................... 0.5 V to 4.6 V voltage range, V I (see Note 1)................................................. 0.5 V to 4.6 V voltage range, V O (see Notes 1 and 2).................................. 0.5 V to V CC + 0.5 V clamp current, I IK (V I < 0)........................................................... 50 ma clamp current, I OK (V O < 0)........................................................ 50 ma Continuous output current, I O............................................................. ±50 ma Continuous current through each V CC or............................................. ±100 ma Package thermal impedance, θ JA (see Note 3): DGG package................................ 81 C/W DL package.................................. 74 C/W Storage temperature range, T stg................................................... 65 C to 150 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. This value is limited to 4.6 V maximum. 3. The package thermal impedance is calculated in accordance with JESD 51. POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3

recommended operating conditions (see Note 4) MIN MAX UNIT Supply voltage 1.65 3.6 V = 1.65 V to 1.95 V 0.65 VIH High-level input voltage = 2.3 V to 2.7 V 1.7 V = 2.7 V to 3.6 V 2 = 1.65 V to 1.95 V 0.35 VIL Low-level input voltage = 2.3 V to 2.7 V 0.7 V = 2.7 V to 3.6 V 0.8 VI voltage 0 V VO voltage 0 V = 1.65 V 4 IOH High-level output current = 2.3 V 12 = 2.7 V 12 ma = 3 V 24 = 1.65 V 4 IOL Low-level output current = 2.3 V 12 = 2.7 V 12 ma = 3 V 24 t/ v transition rise or fall rate 10 ns/v TA Operating free-air temperature 40 85 C NOTE 4: All unused control inputs of the device must be held at or to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS s, literature number SCBA004. 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT IOH = 100 µa 1.65 V to 3.6 V 0.2 IOH = 4 ma 1.65 V 1.2 IOH = 6 ma 2.3 V 2 2.3 V 1.7 V IOH = 12 ma 2.7 V 2.2 3 V 2.4 IOH = 24 ma 3 V 2 IOL = 100 µa 1.65 V to 3.6 V 0.2 IOL = 4 ma 1.65 V 0.45 IOL = 6 ma 2.3 V 0.4 IOL =12mA 2.3 V 0.7 2.7 V 0.4 IOL = 24 ma 3 V 0.55 II VI = or 3.6 V ±5 µa VI = 0.58 V 1.65 V 25 VI = 1.07 V 1.65 V 25 VI = 0.7 V 2.3 V 45 II(hold) ( VI = 1.7 V 2.3 V 45 µa VI = 0.8 V 3 V 75 VI = 2 V 3 V 75 VI = 0 to 3.6 V 3.6 V ±500 IOZ VO = or 3.6 V ±10 µa ICC VI = or, IO = 0 3.6 V 40 µa ICC One input at 0.6 V, Other inputs at or 3 V to 3.6 V 750 µa Ci Control inputs Data inputs VI = or Co s VO = or 3.3 V 7 pf All typical values are at = 3.3 V, TA = 25 C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. 33V 3.3 3.5 6 V pf timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figures 1 through 3) = 1.8 V = 2.5 V ± 0.2 V = 2.7 V = 3.3 V ± 0.3 V UNIT MIN MAX MIN MAX MIN MAX MIN MAX fclock Clock frequency 150 150 150 MHz tw Pulse duration, CLK high or low 3.3 3.3 3.3 ns tsu Setup time, data before CLK 4.4 3.9 3.4 ns th Hold time, data after CLK 0 0 0 ns This information was not available at the time of publication. POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5

switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figures 1 through 3) FROM TO = 1.8 V = 2.5 V PARAMETER ± 0.2 V = 2.7 V = 3.3 V ± 0.3 V UNIT (INPUT) (OUTPUT) MIN TYP MIN MAX MIN MAX MIN MAX fmax 150 150 150 MHz tpd CLK Q 1 5.8 5.3 1 4.5 ns ten OE Q 1 6.6 6.2 1 5.1 ns tdis OE Q 1 5.7 5 1 4.6 ns This information was not available at the time of publication. operating characteristics, T A = 25 C PARAMETER TEST CONDITIONS Power dissipation s enabled Cpdd =50pF f=10mhz capacitance CL pf, s disabled This information was not available at the time of publication. = 1.8 V = 2.5 V = 3.3 V TYP TYP TYP 36 40 22 24 UNIT pf 6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION V CC = 1.8 V From Under Test CL = 30 pf (see Note A) 1 kω 1 kω 2 TEST tpd tplz/tpzl tphz/tpzh 2 LOAD CIRCUIT tw Timing tsu th TAGE WAVEFORMS PULSE DURATION Data TAGE WAVEFORMS SETUP AND HOLD TIMES Control (low-level enabling) tpzl tplz Waveform 1 at 2 + 0.15 V tplh tphl Waveform 2 at tpzh tphz 0.15 V TAGE WAVEFORMS PROPAGATION DELAY TIMES TAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, tr 2 ns, tf 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tplz and tphz are the same as tdis. F. tpzl and tpzh are the same as ten. G. tplh and tphl are the same as tpd. Figure 1. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 DALLAS, TEXAS 75265 7

PARAMETER MEASUREMENT INFORMATION V CC = 2.5 V ± 0.2 V From Under Test CL = 30 pf (see Note A) 500 Ω 500 Ω 2 TEST tpd tplz/tpzl tphz/tpzh 2 LOAD CIRCUIT tw Timing tsu th TAGE WAVEFORMS PULSE DURATION Data TAGE WAVEFORMS SETUP AND HOLD TIMES Control (low-level enabling) tpzl tplz Waveform 1 at 2 + 0.15 V tplh tphl Waveform 2 at tpzh tphz 0.15 V TAGE WAVEFORMS PROPAGATION DELAY TIMES TAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, tr 2 ns, tf 2 ns. D. The outputs are measured one at a time with one transition per measurement. E. tplz and tphz are the same as tdis. F. tpzl and tpzh are the same as ten. G. tplh and tphl are the same as tpd. Figure 2. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

PARAMETER MEASUREMENT INFORMATION V CC = 2.7 V AND 3.3 V ± 0.3 V From Under Test CL = 50 pf (see Note A) 500 Ω 500 Ω 6 V TEST tpd tplz/tpzl tphz/tpzh 6 V LOAD CIRCUIT tw 2.7 V Timing tsu 1.5 V th 2.7 V 1.5 V 1.5 V TAGE WAVEFORMS PULSE DURATION Data 1.5 V 1.5 V TAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V Control (low-level enabling) 1.5 V 1.5 V 2.7 V tpzl tplz 1.5 V 1.5 V 2.7 V Waveform 1 at 6 V 1.5 V 3 V + 0.3 V tplh tphl 1.5 V 1.5 V Waveform 2 at tpzh 1.5 V tphz 0.3 V TAGE WAVEFORMS PROPAGATION DELAY TIMES TAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. E. tplz and tphz are the same as tdis. F. tpzl and tpzh are the same as ten. G. tplh and tphl are the same as tpd. Figure 3. Load Circuit and Voltage Waveforms POST OFFICE BOX 655303 DALLAS, TEXAS 75265 9

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ( CRITICAL APPLICATIONS ). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER S RISK. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 1999, Texas Instruments Incorporated