PRELIMINARY LuxiGen Horticulture Emitter Series LZP Multi Wavelength Horticulture LED Emitter LZP 00H100 Key Features Ultra high Photosynthetic Photon Flux (PPF) surface mount ceramic package LED with integrated glass lens Blue 453nm, Deep Red 660nm, Far Red 740nm and Green 517nm in a single LED package for optimum overall plant growth 70W power dissipation in a compact 12.0mm x 12.0mm emitter footprint Industry lowest thermal resistance per package footprint (0.5 C/W) In source mixing based on smart die positioning for optimum wavelength uniformity Electrically neutral thermal path JEDEC Level 1 for Moisture Sensitivity Level Lead (Pb) free and RoHS compliant Emitter available on 4 channel Star and Connectorized MCPCB (optional) Full suite of TIR secondary optics family available Typical Applications Horticulture lighting Description The LZP 00H100 horticulture LED emitter incorporates multiple wavelengths critical for optimum plant growth: Blue 453nm, Deep Red 660nm, Far Red 740nm and Green 517nm. From a compact 12.0mm x 12.0mm footprint, it produces an ultra high Photosynthetic Photon Flux (PPF) value of 106umol/s, maximizing the Photosynthetic Photon Flux Density (PPFD) in a given area. The emitter s smart die positioning pre mixes the colors in the emitter level for optimum wavelength uniformity on the plant surface. The ultra low thermal resistance of the package dissipates 70W of heat efficiently resulting in excellent flux output and flux maintenance over time. The glass primary lens and other high quality materials used in the package are designed to deliver monumental robustness in challenging grow environment with high ambient temperature and humidity.
Part Number Options Base part number Part number LZP 00H100 xxxx LZP L0H100 xxxx LZP W0H100 xxxx Description LZP Horticulture emitter LZP Horticulture emitter on 4 channel Star MCPCB LZP Horticulture emitter on 4 channel Connectorized MCPCB Bin kit option codes: H1, Horticulture Kit number suffix Description 0000 Full distribution flux; full distribution wavelength 2
Radiant Flux Bins Bin Code Ch 1/ Ch 3 4 Deep Red + 2 Far Red Table 1: Minimum Maximum Radiant Flux (Φ) Radiant Flux (Φ) @ I F = 700mA [1] @ I F = 700mA [1] (W) (W) Ch 2/ Ch 4 Ch 1/ Ch 3 4 Blue + 4 Deep Red + 2 Green 2 Far Red R231 2.8 5.2 Ch 2/ Ch 4 4 Blue + 2 Green BG1 3.7 5.3 Notes for Table 1: 1. Radiant flux performance is measured at 10ms pulse, T c = 25 o C; with all LED dice with the same color connected in series. LED Engin maintains a tolerance of ±10% on flux measurements. Forward Voltage Bin Bin Code Table 3: Minimum Maximum Forward Voltage (V F ) Forward Voltage (V F ) @ I F = 700mA [1,2] @ I F = 700mA [1,2] (V) (V) Ch 1/ Ch 3 4 Deep Red + 2 Far Red Ch 2/ Ch 4 4 Blue + 2 Green Ch 1/ Ch 3 4 Deep Red + 2 Far Red Ch 2/ Ch 4 4 Blue + 2 Green 0 12.0 17.6 17.4 23.6 Notes for Table 3: 1. Forward voltage is measured at 10ms pulse, T C = 25 o C with all LED dice with the same color connected in series. 2. LED Engin maintains a tolerance of ± 0.24V for forward voltage measurements for 6 LEDs. Typical Wavelength Range 1 Deep Red: 655 670nm peak wavelength @I F = 700mA Far Red: 723 745nm peak wavelength Blue: 453 460nm dominant wavelength 2 Green: 520 530nm dominant wavelength 3 Notes: 1. Wavelength for individual colors cannot be measured because there are 2 different wavelength dies connected within a series string. 2. Predicted typical peak wavelength equivalent: 447 457nm 3. Predicted typical peak wavelength equivalent: 510 526nm 3
Absolute Maximum Ratings Table 4: Parameter Symbol Value Unit DC Forward Current [1] I F 1000 ma Peak Pulsed Forward Current [2] I FP 1500 ma Reverse Voltage V R See Note 3 V Storage Temperature T stg 40 ~ +150 C Junction Temperature T J 125 C Soldering Temperature [4] T sol 260 C Notes for Table 4: 1. Maximum DC forward current is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 11 for current derating. 2: Pulse forward current conditions: Pulse Width 10msec and Duty Cycle 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5. 5. LED Engin recommends taking reasonable precautions towards possible ESD damages and handling the LZP 00H100 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ T C = 25 C Table 5: Parameter Symbol Typical 8 Deep Red 4 Far Red 8 Blue [1] 4 Green Total Unit PF 280 800nm (@ I F = 700mA) 31.2 12.6 28.7 5.7 78.2 umol/s PF 280 800nm (@ I F = 1000mA) 43.6 16.2 38.7 7.5 106.0 umol/s Radiant Flux (@ I F = 700mA) Φ 5.7 2.1 7.6 1.3 16.7 W Radiant Flux (@ I F = 1000mA) Φ 8.0 2.7 10.3 1.7 22.7 W Peak Wavelength λ P 660 740 453 517 nm Viewing Angle [2] 2Θ ½ 125 Degrees Total Included Angle [3] Θ 0.9 140 Degrees Notes for Table 5: 1. When operating the Blue LED, observe IEC 62471 Risk Group 2 rating. Do not stare into the beam. 2. Viewing Angle is the off axis angle from emitter centerline where the luminous intensity is ½ of the peak value. 3. Total Included Angle is the total angle that includes 90% of the total luminous flux. Electrical Characteristics @ T C = 25 C Table 6: Parameter Symbol Typical 8 Deep Red 4 Far Red 8 Blue 4 Green Unit Forward Voltage (@ I F = 700mA) [1] V F 18.8 8.2 25.6 14.4 V Forward Voltage (@ I F = 1000mA) [1] V F 20.6 8.8 26.4 15.0 V Temperature Coefficient of Forward Voltage ΔV F /ΔT J 36.8 8.0 16.0 11.6 mv/ C Thermal Resistance (Junction to Case) RΘ J C 0.5 C/W Notes for Table 6: 1. Forward Voltage typical value is for all LED dice from the same color dice connected in series. 4
IPC/JEDEC Moisture Sensitivity Level Table 7 IPC/JEDEC J STD 20 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 unlimited 30 C/ 60% RH 168 +5/ 0 85 C/ 60% RH Notes for Table 7: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor s facility. n/a n/a Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long term HTOL testing, LED Engin projects that the LZP Series will deliver, on average, above 70% Lumen Maintenance at 20,000 hours of operation at a forward current of 700mA. This projection is based on constant current operation with junction temperature maintained at or below 120 C for LZP product. 5
Mechanical Dimensions (mm) Figure 1: Package outline drawing. Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal slug is electrically isolated 3. Ts is a thermal reference point Recommended Solder Pad Layout (mm) Pin Out Ch. Pad Die Color Function 1 2 3 4 18 B Deep Red Anode + I Deep Red na K Deep Red na R Deep Red na T Far Red na 2 U Far Red Cathode 17 E Blue Anode + F Blue na H Blue na O Blue na Q Green na 3 X Green Cathode 15 A Deep Red Cathode C Deep Red na J Deep Red na L Deep Red na S Far Red na 5 V Far Red Anode + 14 D Blue Anode + G Blue na M Blue na N Blue na P Green na W Green na 6 Y N/A Cathode DNC pins: 1,4,7,8,9,10,11,12,13,16,19,20,21,22,23,24. Note: DNC = Do Not Connect (Electrically Non Isolated) Figure 2a: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Notes: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. LED Engin recommends the use of copper core MCPCB s which allow for the emitter thermal slug to be soldered directly to the copper core (so called pedestal design). Such MCPCB technologies eliminate the high thermal resistance dielectric layer that standard MCPCB technologies use in between the emitter thermal slug and the metal core of the MCPCB, thus lowering the overall system thermal resistance. 3. LED Engin recommends x ray sample monitoring for solder voids underneath the emitter thermal slug. The total area covered by solder voids should be less than 20% of the total emitter thermal slug area. Excessive solder voids will increase the emitter to MCPCB thermal resistance and may lead to higher failure rates due to thermal over stress. 6
Recommended Solder Mask Layout (mm) Note for Figure 2b: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. Figure 2b: Recommended solder mask opening for anode, cathode, and thermal pad Recommended 8 mil Stencil Apertures Layout (mm) Figure 2c: Recommended 8mil stencil apertures layout for anode, cathode, and thermal pad Note for Figure 2c: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 7
Reflow Soldering Profile Figure 3: Reflow soldering profile for lead free soldering. Typical Radiation Pattern 100% 90% 80% 70% Relative Intensity 60% 50% 40% 30% 20% 10% 0% 90 80 70 60 50 40 30 20 10 0 10 20 30 40 50 60 70 80 90 Angular Displacement (Degrees) Figure 4: Typical representative spatial radiation pattern. 8
Typical Relative Spectral Power Distribution 1.00 0.90 0.80 Relative Spectral Power 0.70 0.60 0.50 0.40 0.30 0.20 0.10 Deep Red Far Red Blue Green 0.00 400 450 500 550 600 650 700 750 800 850 Wavelength (nm) Figure 5: Typical relative spectral power vs. wavelength @ T C = 25 C. Typical Forward Current Characteristics 1,200 1,000 I F Forward Current (ma) 800 600 400 8 Deep Red 4 Far Red 200 8 Blue 4 Green 0 5.0 10.0 15.0 20.0 25.0 30.0 V F Forward Voltage (V) Figure 6: Typical forward current vs. forward voltage @ T C = 25 C 9
Typical Normalized Radiant Flux over Current 1.6 1.4 Normalized Radiant Flux 1.2 1.0 0.8 0.6 0.4 Far Red Deep Red Blue Green 0.2 0.0 0 200 400 600 800 1000 1200 I F Forward Current (ma) Figure 7: Typical normalized radiant flux vs. forward current @ T C = 25 C. Typical Normalized Radiant Flux over Temperature 1.2 1.0 Normalized Radiant Flux 0.8 0.6 0.4 0.2 0.0 Deep Red Far Red Green Blue 0 20 40 60 80 100 120 T C Case Temperature ( C) Figure 8: Typical normalized radiant flux vs. case temperature. 10
Typical Peak Wavelength Shift over Current 10.0 8.0 6.0 Peak Wavelength Shift (nm) 4.0 2.0 0.0 2.0 4.0 6.0 8.0 10.0 Deep Red/Far Red Green Blue 0 200 400 600 800 1000 1200 I F Forward Current (ma) Figure 9: Typical peak wavelength shift vs. forward current @ T C = 25 C. Typical Peak Wavelength Shift over Temperature 20.0 15.0 Peak Wavelength Shift (nm) 10.0 5.0 0.0 5.0 10.0 15.0 20.0 0 20 40 60 80 100 120 T C Case Temperature ( C) Far Red Deep Red Green Blue Figure 10: Typical peak wavelength shift vs. case temperature. 11
Current De rating 1200 1000 I F Forward Current (ma) 800 700 (Rated) 600 400 200 RΘ JA = 0.8 C/W RΘ JA = 1.0 C/W RΘ JA = 1.2 C/W 0 0 25 50 75 100 125 T A Ambient Temperature ( C) Figure 11: Maximum forward current vs. ambient temperature based on T J(MAX) = 125 C Notes for Figure 11: 1. Maximum current assumes that all 24 LED dies are operating concurrently at the same current. 2. RΘ J C [Junction to Case Thermal Resistance] for LZP 00H100 is typically 0.5 C/W. 3. RΘ J A [Junction to Ambient Thermal Resistance] = RΘ J C + RΘ C A [Case to Ambient Thermal Resistance]. 12
LZP MCPCB Family Part number Type of MCPCB Diameter (mm) Emitter + MCPCB Thermal Resistance ( o C/W) Typical V F (V) Typical I F (ma) LZP Lxxxxx 4 channel 28.3 0.5 + 0.1 = 0.6 13.5 20.0 4 x 700 LZP Wxxxxx 4 channel (Connectorized) 50.0 0.5 + 0.1 = 0.6 13.5 20.0 4 x 700 13
LZP Lxxxxx 4 Channel MCPCB Mechanical Dimensions (mm) Note: Unless otherwise noted, the tolerance = ± 0.20 mm. Slots in MCPCB are for M3 or #4 40 mounting screws. The thermal resistance of the MCPCB is: RΘC B 0.1 C/W Components used MCPCB: MHE 301 copper (Rayben) ESD chips: BZX884 B39 (NXP, for 6 7 LED dies in series) NTC: NCP15XH103F03RC (Murata) Ch. 1 (D. Red + F. Red) 2 (Blue + Green) 3 (D. Red + F. Red) 4 (Blue + Green) NTC Pad layout MCPCB Pad String/die Function 8 1/ Anode + 1 BIKRTU Cathode 7 2/ Anode + 2 EFHOQX Cathode 3 3/ Anode + 6 ACJLSV Cathode 5 4/ Anode + 4 DGMNPWY Cathode 1 RT 10kohm NTCA 2 RT NTC NTCB 14
LZP Wxxxxx 4 Channel 50mm Connectorized MCPCB Mechanical Dimensions (mm) Note: Unless otherwise noted, the tolerance = ± 0.20 mm. Mating connector: ZHR 8 (JST) for the 8 pin connector and ZHR 2 (JST) for the 2 pin connector. It is recommended to strain relief the mating connector. LED Engin standard screw refers to M3 or #4 40 screw. The thermal resistance of the MCPCB is: RΘC B 0.1 C/W Components used MCPCB: MHE 301 copper (Rayben) Connectors 1 : S8B ZR SM4A TF (JST) S2B ZR SM4A TF (JST) Jumper: RC1206JR 070RL (Yageo) ESD/TVS diode: SPHV36 01ETG (Littelfuse) Thermistor: NCP15XH103F03RC (Murata) Note: 1. Max connector temp is 105 C. MCPCB Pin Out (at J1 connector) Ch. Connector Pin String/die Function 1 1 1/ Anode + (D. Red + F. Red) 2 BIKRTU Cathode 2 3 2/ Anode + (Blue + Green) 4 EFHOQX Cathode 3 5 3/ Anode + (D. Red + F. Red) 6 ACJLSV Cathode 4 8 4/ Anode + (Blue + Green) 7 DGMNPWY Cathode MCPCB Pin Out (at J2 connector) Ch. Connector Pin String Function NTC 1 NTCA 10kohm NTC 2 NTCB 15
Application Guidelines MCPCB Assembly Recommendations A good thermal design requires an efficient heat transfer from the MCPCB to the heat sink. In order to minimize air gaps in between the MCPCB and the heat sink, it is common practice to use thermal interface materials such as thermal pastes, thermal pads, phase change materials and thermal epoxies. Each material has its pros and cons depending on the design. Thermal interface materials are most efficient when the mating surfaces of the MCPCB and the heat sink are flat and smooth. Rough and uneven surfaces may cause gaps with higher thermal resistances, increasing the overall thermal resistance of this interface. It is critical that the thermal resistance of the interface is low, allowing for an efficient heat transfer to the heat sink and keeping MCPCB temperatures low. When optimizing the thermal performance, attention must also be paid to the amount of stress that is applied on the MCPCB. Too much stress can cause the ceramic emitter to crack. To relax some of the stress, it is advisable to use plastic washers between the screw head and the MCPCB and to follow the torque range listed below. For applications where the heat sink temperature can be above 50 o C, it is recommended to use high temperature and rigid plastic washers, such as polycarbonate or glass filled nylon. LED Engin recommends the use of the following thermal interface materials: 1. Bergquist s Gap Pad 5000S35, 0.020in thick Part Number: Gap Pad 5000S35 0.020in/0.508mm Thickness: 0.020in/0.508mm Thermal conductivity: 5 W/m K Continuous use max temperature: 200 C Using M3 Screw (or #4 screw), with polycarbonate or glass filled nylon washer (#4) the recommended torque range is: 20 to 25 oz in (1.25 to 1.56 lbf in or 0.14 to 0.18 N m) 2. 3M s Acrylic Interface Pad 5590H Part number: 5590H @ 0.5mm Thickness: 0.020in/0.508mm Thermal conductivity: 3 W/m K Continuous use max temperature: 100 C Using M3 Screw (or #4 screw), with polycarbonate or glass filled nylon washer (#4) the recommended torque range is: 20 to 25 oz in (1.25 to 1.56 lbf in or 0.14 to 0.18 N m) Mechanical Mounting Considerations The mounting of MCPCB assembly is a critical process step. Excessive mechanical stress build up in the MCPCB can cause the MCPCB to warp which can lead to emitter substrate cracking and subsequent cracking of the LED dies LED Engin recommends the following steps to avoid mechanical stress build up in the MCPCB: o Inspect MCPCB and heat sink for flatness and smoothness. o Select appropriate torque for mounting screws. Screw torque depends on the MCPCB mounting method (thermal interface materials, screws, and washer). o Always use three M3 or #4 40 screws with #4 washers. o When fastening the three screws, it is recommended to tighten the screws in multiple small steps. This method avoids building stress by tilting the MCPCB when one screw is tightened in a single step. o Always use plastic washers in combinations with the three screws. This avoids high point contact stress on the screw head to MCPCB interface, in case the screw is not seated perpendicular. o In designs with non tapped holes using self tapping screws, it is common practice to follow a method of three turns tapping a hole clockwise, followed by half a turn anti clockwise, until the appropriate torque is reached. 16
Wire Soldering To ease soldering wire to MCPCB process, it is advised to preheat the MCPCB on a hot plate of 125 150 o C. Subsequently, apply the solder and additional heat from the solder iron will initiate a good solder reflow. It is recommended to use a solder iron of more than 60W. It is advised to use lead free, no clean solder. For example: SN 96.5 AG 3.0 CU 0.5 #58/275 from Kester (pn: 24 7068 7601) 17
Company Information LED Engin, Inc., based in California s Silicon Valley, specializes in ultra bright, ultra compact solid state lighting solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient lighting experiences. The LuxiGen Platform an emitter and lens combination or integrated module solution, delivers superior flexibility in light output, ranging from 3W to 90W, a wide spectrum of available colors, including whites, multi color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small size combined with powerful output allows for a previously unobtainable freedom of design wherever high flux density, directional light is required. LED Engin s packaging technologies lead the industry with products that feature lowest thermal resistance, highest flux density and consummate reliability, enabling compact and efficient solid state lighting solutions. LED Engin is committed to providing products that conserve natural resources and reduce greenhouse emissions. LED Engin reserves the right to make changes to improve performance without notice. Please contact sales@ledengin.com or (408) 922 7200 for more information. 18
Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: LED Engin: LZP-L0H100-0000 LZP-00H100-0000 LZP-W0H100-0000