JU Electronic Components and Systems for European Leadership (ECSEL) Johann Massoner Infineon Technologies Austria AG
Electronics everywhere and indispensible 10.6.2013 Page 2
Speech: Electronics for Europe: faster, smarter, cheaper It's a strategy with a very clear goal. To reverse the declining market share of the European semiconductor industry. To double our chip production by 2020, to around one fifth of the global total, overtaking the United States. In short, there are three goals: to make chips faster, smarter, and cheaper. We need to do all three Neelie Kroes Vice-President of the European Commission responsible for the Digital Agenda Speech on May 29. 2013 in Brussels set date Page 3
ECSEL - JU Electronic Components and Systems for European Leadership The scope of work for the ECSEL Joint Undertaking should include the following main areas: ENIAC ARTEMIS EPOSS design technologies, process and integration, equipment, materials and manufacturing for micro- and nanoelectronics while targeting miniaturisation, diversification and differentiation, heterogeneous integration; processes, methods, tools and platforms, reference designs and architectures, for software and/or control-intensive embedded/cyberphysical systems, addressing seamless connectivity and interoperability, functional safety, high availability, and security for professional and consumer type applications, and connected services; multi-disciplinary approaches for smart systems, supported by developments in holistic design and advanced manufacturing to realise self-reliant and adaptable smart systems having sophisticated interfaces and offering complex functionalities based on e.g. the seamless integration of sensing, actuating, processing, energy provision and networking. Proposal for a COUNCIL REGULATION on the ECSEL Joint Undertaking - 5/2013 set date Page 4
Joint Undertaking - research, collaboration and pilot activities on European level AENEAS µ-n-electronics Industry EU e.g.electronics strategy ARTEMISIA Systems SW Industry TP - EPOSS Systems HW Industry ECSEL JU Electronic Components and Systems for European Leadership KET s e.g. µ-n-electronics Manufacturing Pilot Activities Public Autorities (National) PRELIMINARY - as known to date 6/2013 set date Page 5
Pilot activities: Important step to strengthen European semiconductor manufacturing Semiconductor manufacturing is among the most capital intense industry segments Infineon is a globally acting enterprise and is facing regional funding behaviours (Asia, US ) which mostly lead to competitive disadvantage of European companies The ENIAC project EPT300 researches basic capabilities to produce power technologies based on 300mm wafers along the full value chain The ENAIC project EPPL will establish a realistic environment to develop and manufacture world leading technologies for advanced power devices based on large 300mm silicon wafers. EPT300 EPPL # of partners in the consortia 23 32 # of applications 2 4 Total Person Months 3445 5580 Total eligible Cost ~43'0 ~74' Total funding, all partners ~16'2 ~23'7 + April 25, 2013 Page 6