STD5NM50 STD5NM50-1 N-CHANNEL 500V - 0.7Ω - 7.5A DPAK/IPAK MDmesh Power MOSFET

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Transcription:

STD5NM50 STD5NM50-1 N-CHANNEL 500V - 0.7Ω - 7.5A DPAK/IPAK MDmesh Power MOSFET TYPE V DSS R DS(on) I D STD5NM50 STD5NM50-1 500V 500V <0.8Ω <0.8Ω 7.5 A 7.5 A n TYPICAL R DS (on) = 0.7Ω n HIGH dv/dt AND AVALANCHE CAPABILITIES n 100% AVALANCHE TESTED n LOW INPUT CAPACITANCE AND GATE CHARGE n LOW GATE INPUT RESISTANCE n TIGHT PROCESS CONTROL AND HIGH MANUFACTURING YIELDS 1 DPAK TO-252 3 3 2 1 IPAK TO-251 (Add Suffix -1 ) DESCRIPTION The MDmesh is a new revolutionary MOSFET technology that associates the Multiple Drain process with the Company s PowerMESH horizontal layout. The resulting product has an outstanding low on-resistance, impressively high dv/dt and excellent avalanche characteristics. The adoption of the Company s proprietary strip technique yields overall dynamic performance that is significantly better than that of similar competition s products. INTERNAL SCHEMATIC DIAGRAM APPLICATIONS The MDmesh family is very suitable for increasing power density of high voltage converters allowing system miniaturization and higher efficiencies. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V DS Drain-source Voltage (V GS = 0) 500 V V DGR Drain-gate Voltage (R GS = 20 kω) 500 V V GS Gate- source Voltage ±30 V I D Drain Current (continuous) at T C = 25 C 7.5 A I D Drain Current (continuous) at T C = 100 C 4.7 A I DM (l) Drain Current (pulsed) 30 A P TOT Total Dissipation at T C = 25 C 100 W Derating Factor 0.8 W/ C dv/dt (1) Peak Diode Recovery voltage slope 15 V/ns T stg Storage Temperature T j Max. Operating Junction Temperature 55 to 150 C ( )Pulse width limited by safe operating area (1) I SD 5A, di/dt 400A/μs, V DD V (BR)DSS, T j T JMAX. September 2002 1/10

THERMAL DATA Rthj-case Thermal Resistance Junction-case Max 1.25 C/W Rthj-amb Thermal Resistance Junction-ambient Max 100 C/W T l Maximum Lead Temperature For Soldering Purpose 300 C AVALANCHE CHARACTERISTICS Symbol Parameter Max Value Unit I AR Avalanche Current, Repetitive or Not-Repetitive 2.5 A (pulse width limited by T j max) E AS Single Pulse Avalanche Energy (starting T j = 25 C, I D = I AR, V DD = 50 V) 300 mj ELECTRICAL CHARACTERISTICS (T CASE = 25 C UNLESS OTHERWISE SPECIFIED) OFF V (BR)DSS Drain-source I D = 250 μa, V GS = 0 500 V Breakdown Voltage I DSS Zero Gate Voltage V DS = Max Rating 1 μa Drain Current (V GS = 0) V DS = Max Rating, T C = 125 C 10 μa I GSS Gate-body Leakage Current (V DS = 0) V GS = ±30V ±100 na ON (1) V GS(th) Gate Threshold Voltage V DS = V GS, I D = 250μA 3 4 5 V R DS(on) Static Drain-source On Resistance V GS = 10V, I D = 2.5A 0.7 0.8 Ω DYNAMIC g fs (1) Forward Transconductance V DS = 25V x, I D = 2.5A 3.5 S C iss Input Capacitance V DS = 25V, f = 1 MHz, V GS = 0 415 pf C oss Output Capacitance 88 pf C rss Reverse Transfer 12 pf Capacitance C oss eq. (2) Equivalent Output V GS = 0V, V DS = 0V to 400V 50 pf Capacitance R G Gate Input Resistance f=1 MHz Gate DC Bias = 0 Test Signal Level = 20mV Open Drain 3 Ω 1. Pulsed: Pulse duration = 300 μs, duty cycle 1.5 %. 2. C oss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS. 2/10

ELECTRICAL CHARACTERISTICS (CONTINUED) SWITCHING ON t d(on) Turn-on Delay Time V DD = 250V, I D = 2.5A 16 ns t r Rise Time R G =4.7Ω V GS = 10V (see test circuit, Figure 3) 8 ns Q g Total Gate Charge V DD = 400V, I D = 7.5A 13 nc Q gs Gate-Source Charge V GS = 10V 5 nc Q gd Gate-Drain Charge 6 nc SWITCHING OFF t r(voff) Off-voltage Rise Time V DD = 400V, I D = 5A, 14 ns t f Fall Time R G =4.7Ω, V GS = 10V (see test circuit, Figure 5) 6 ns t c Cross-over Time 13 ns SOURCE DRAIN DIODE I SD Source-drain Current 7.5 A I SDM (2) Source-drain Current (pulsed) 30 A V SD (1) Forward On Voltage I SD = 7.5A, V GS = 0 1.5 V t rr Reverse Recovery Time I SD = 5A, di/dt = 100A/μs, 185 ns Q rr Reverse Recovery Charge V DD = 100V, T j = 25 C (see test circuit, Figure 5) 1.1 μc I RRM Reverse Recovery Current 11.5 A t rr Q rr I RRM Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current Note: 1. Pulsed: Pulse duration = 300 μs, duty cycle 1.5 %. 2. Pulse width limited by safe operating area. Safe Operating Area I SD = 5A, di/dt = 100A/μs, V DD = 100V, T j = 150 C (see test circuit, Figure 5) Thermal Impedance 270 1.6 12 ns μc A 3/10

Output Characteristics Transfer Characteristics Transconductance Static Drain-source On Resistance Gate Charge vs Gate-source Voltage Capacitance Variations 4/10

Normalized Gate Threshold Voltage vs Temperature Normalized On Resistance vs Temperature Source-drain Diode Forward Characteristics Normalized BVDSS vs Temperature 5/10

Fig. 1: Unclamped Inductive Load Test Circuit Fig. 2: Unclamped Inductive Waveform Fig. 3: Switching Times Test Circuit For Resistive Load Fig. 4: Gate Charge test Circuit Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/10

TO-252 (DPAK) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.20 2.40 0.087 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.213 C 0.45 0.60 0.018 0.024 C2 0.48 0.60 0.019 0.024 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.252 0.260 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.398 L2 0.8 0.031 L4 0.60 1.00 0.024 0.039 V2 0 o 8 o 0 o 0 o P032P_B 7/10

TO-251 (IPAK) MECHANICAL DATA DIM. mm inch MIN. TYP. MAX. MIN. TYP. MAX. A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A3 0.7 1.3 0.027 0.051 B 0.64 0.9 0.025 0.031 B2 5.2 5.4 0.204 0.212 B3 0.85 0.033 B5 0.3 0.012 B6 0.95 0.037 C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023 D 6 6.2 0.236 0.244 E 6.4 6.6 0.252 0.260 G 4.4 4.6 0.173 0.181 H 15.9 16.3 0.626 0.641 L 9 9.4 0.354 0.370 L1 0.8 1.2 0.031 0.047 L2 0.8 1 0.031 0.039 H A1 C2 A3 A C L2 D L E = = B2 = = 1 2 3 G = = B3 B6 B B5 L1 0068771-E 8/10

DPAK FOOTPRINT TUBE SHIPMENT (no suffix)* All dimensions are in millimeters All dimensions are in millimeters TAPE AND REEL SHIPMENT (suffix T4 )* REEL MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0.795 G 16.4 18.4 0.645 0.724 N 50 1.968 T 22.4 0.881 TAPE MECHANICAL DATA DIM. mm inch MIN. MAX. MIN. MAX. A0 6.8 7 0.267 0.275 B0 10.4 10.6 0.409 0.417 B1 12.1 0.476 D 1.5 1.6 0.059 0.063 D1 1.5 0.059 E 1.65 1.85 0.065 0.073 F 7.4 7.6 0.291 0.299 K0 2.55 2.75 0.100 0.108 P0 3.9 4.1 0.153 0.161 P1 7.9 8.1 0.311 0.319 P2 1.9 2.1 0.075 0.082 R 40 1.574 W 15.7 16.3 0.618 0.641 BASE QTY BULK QTY 2500 2500 * on sales type 9/10

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics 2002 STMicroelectronics - Printed in Italy - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 10/10