Product features AEC-Q qualified High current carrying capacity in a compact standard 8 ( metric) footprint Magnetically shielded, Low EMI Rugged construction Self resonant frequency (SRF) greater than MHz Inductance range from. μh to 4.7 μh Current range from. A to 7. A.7 mm x. mm footprint surface mount package in. mm,. mm heights Moisture Sensitivity Level (MSL): Applications Body electronics Central body control module Vehicle access control system Headlamps, tail lamps, interior lighting and LED lighting Doors, window lift and seat control Advanced driver assistance systems 77 GHz radar system Basic and smart surround, and rear and front view camera Adaptive cruise control (ACC) Automatic parking control Car black box system Infotainment and cluster electronics Active noise cancellation (ANC) Audio subsystem: head unit and trunk amp Digital instrument cluster In-vehicle infotainment (IVI) and navigation Environmental data Storage temperature range (Component): - C to + C Operating temperature range: - C to + C (ambient plus self-temperature rise) Solder reflow temperature: J-STD- (latest revision) compliant Halogen free, lead free, RoHS compliant Pb HALOGEN HF FREE
Product specifications Part Number OCL (μh) ±% I rms (A) I sat (A) DCR (mω) typical @ + C DCR (mω) maximum @ + C SRF (MHz) typical K-factor 4. mm height MPIAV-R-R. 4.8 6.6 66 MPIAV-R47-R.47 4.4 6. 9 9 MPIAV-R68-R.68. 4. 7 44 8 7 MPIAV-R-R.. 4. 4 7 MPIAV-R-R... 6 8 4 469 MPIAV-R-R...8 88 4 87 MPIAV-R-R..6. 7 89 MPIAV-4R7-R 4.7..8 6 66. mm height MPIAV-R-R.. 7. 4 9 6 MPIAV-R47-R.47 4.9 6.7 7 68 MPIAV-R68-R.68.4 6. 9 7 6 MPIAV-R-R.. 4.4 6 44 7 8 MPIAV-R-R... 64 77 4 48 MPIAV-R-R... 7 87 94 MPIAV-R-R..8.8 96 MPIAV-4R7-R 4.7.4.9 96 8. Open Circuit Inductance (OCL) Test Parameters:. MHz,. Vrms,. Adc, + C.. I rms : DC current for an approximate temperature rise of C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed + C under worst case operating conditions verified in the end application.. I sat : Peak current for approximately % rolloff @ + C. Dimensions (mm) 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in uh), ΔI (Peak to peak ripple current in Amps).. Part Number Definition: MPIAxxV-xxx-R MPIA = Product code xx= Height indicator V=Version indicator xxx= inductance value in μh, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimension A MPIAV. maximum MPIAV. maximum, No marking All soldering surfaces to be coplanar within. millimeters Tolerances are ±. millimeters unless stated otherwise Pad layout tolerances are ±. millimeters unless stated otherwise Do not route traces or vias underneath the inductor
Packaging information (mm) Supplied in tape and reel packaging, parts per 7 diameter reel Core loss vs. Bp-p (+ C) MPIAV-R-R MHz MHz MPIAV-R47-R MHz MHz khz khz
Core loss vs. Bp-p (+ C) MPIAV-R68-R MPIAV-R-R MHz MHz khz MHz MHz khz MPIAV-R-R MPIAV-R-R MHz MHz MHz MHz khz khz MPIAV-R-R MHz MHz MPIAV-4R7-R MHz MHz khz khz 4
Core loss vs. Bp-p (+ C) MPIAV-R-R MPIAV-R47-R MHz MHz MHz MHz khz khz MPIAV-R68-R MHz MHz MPIAV-R-R MHz MHz khz khz MPIAV-R-R MHz MHz khz MPIAV-R-R MHz MHz khz
Core loss vs. Bp-p (+ C) MPIAV-R-R MHz MPIAV-4R7-R MHz MHz MHz khz khz Inductance and Q vs. Frequency MPIAV-R-R MPIAV-R47-R.4.7.............,. 4.6..4.... MPIAV-R68-R. 7.8.6.4.. MPIAV-R-R..8.6.4...8.6.4....... 6
Inductance and Q vs. Frequency MPIAV-R-R MPIAV-R-R............. 4. 4.............. MPIAV-R-R 9 4 8 7 6 4. MPIAV-4R7-R. 9. 8. 7. 6.. 4.......... MPIAV-R-R.4. 9. 8. 7....... MPIAV-R47-R.8.7 9 8.6 7..4.... 7
Inductance and Q vs. Frequency. MPIAV-R68-R 8. MPIAV-R-R..8.6.4. 7.8.6.4...8.6.4..... Frequency (MHz). MPIAV-R-R 4. MPIAV-R-R 4 4 4... value Q..... MPIAV-R-R MPIAV-4R7-R 9 8 7 6 4 9 8 7 6 4.. 8
Inductance and temperature rise vs. Current. MPIAV-R-R.6 MPIAV-R47-R........ 4 6 7 8 9 8 7..4.... 4 6 7 8 9 8 7 MPIAV-R68-R MPIAV-R-R.8.7.6..4... 9 8 7...8.6.4. 9 8 7. 4 6. 4 MPIAV-R-R MPIAV-R-R.6.4...8.6.4. 9 8 7..... 9 8 7. 4..... 4 9
Inductance and temperature rise vs. Current. MPIAV-R-R. MPIAV-4R7-R. 9 8 4. 4. 9 8..... 7....... 7........ MPIAV-R-R MPIAV-R47-R........ 4 6 7 8 9 8 7..4......... 4 6 7 8 9 8 7 MPIAV-R68-R MPIAV-R-R.8.7.6..4... 9 8 7...8.6.4. 9 8 7. 4 6 7. 4 6
Inductance and temperature rise vs. Current.6 MPIAV-R-R. MPIAV-R-R.4 9 9...8.6.4. 8 7.... 8 7. 4..... 4........ MPIAV-R-R.... 4 9 8 7 6.. 4..... MPIAV-4R7-R... 9 8 7
Solder reflow profile T P Max. Ramp Up Rate = C/s Max. Ramp Down Rate = 6 C/s t P T C - C Table - Standard SnPb Solder (T c ) Package Thickness Volume mm < Volume mm T L <.mm) C C Temperature T smax T smin Preheat A ts t.mm C C Table - Lead (Pb) Free Solder (T c ) Package Thickness Volume mm < Volume mm - Volume mm > <.6mm C C C.6.mm C C 4 C >.mm C 4 C 4 C C Time C to Peak Time Reference JDEC J-STD- Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) C C Temperature max. (T smax ) C C Time (T smin to T smax ) (t s ) - Seconds - Seconds Average ramp up rate T smax to T p C/ Second Max. C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 8 C - Seconds Peak package body temperature (T P )* Table Table 7 C - Seconds Time (t p )** within C of the specified classification temperature (T c ) Seconds** Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division Eaton Boulevard Cleveland, OH 44 United States 8 Eaton All Rights Reserved Printed in USA Publication No. BU-MC846 July 8 Eaton is a registered trademark. All other trademarks are property of their respective owners.