Background Statement for SEMI Draft Document #5375 Line Item Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers Notice: This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this Document. Notice: Recipients of this Document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, patented technology is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided. Background: Following the approval and publication of the standard for 450 mm FOSB as SEMI M80, the International 450 mm Shipping Box Task Force and joint Silicon Wafer and PIC GCS has agreed on the modifications per this line item ballot to further improve the quality of the standard and to ensure better alignment between the different 450 mm wafer carrier standards. The proposed line item changes to SEMI M80 are summarized below: Line Item 1: Text edits to clarify descriptions and to match existing figures Correct the text description in 8.1.4 for the specific locations of the notches on the Automation Flange to match Figure 2. Minor editorial change of Kinematic Coupling Pin surface roughness locations description in 9.1. Correct grammar in 17.7.3 for the description of wafer position expectation when 450 FOSB door is opened. Remove reference to currently undefined load port hold-down forces from Related Information R3-1.1. Line Item 2: Modify shape of Carrier Frame Pin Hole to address tolerance conflicts between pin hole and load port pin diameters Correct text description in 14.8. Update relevant Figures (Figs. 1, 19, 20, 22, and 23). Update Table 1. Line Item 3: Enhance the text description of the bounds of the COG volume to match the Figure 6 Modify 8.2. i
Line Item 4: Minor corrections Add missing text for Center Line of carrier door to the Reference Planes Specification section. Correct Table 1 feature measurement locations to match figures. Line Item 5: Error Corrections in Figures Correct z11 to z11 in Figure 9. Error correction in Figure R1-2. Line Item 6: Ensure precision & unit of specification in Figures Ensure consistent precision between target values and tolerances of x32, and specification unit of θ3 in Figure 2. Ensure specification unit of θ6 in Figure 7. Ensure specification of z24 in Figure 14. Ensure specification unit of r12 in Figure 34. This line item ballot includes the purpose, scope, limitations, and terminology sections, along with the full text of any section to which revisions are being balloted per SEMI Standards Procedure Guide 3.4.4.3.1. Throughout the document, additions are indicated by underline and deletions are indicated by strikethrough. Review and Adjudication Information Task Force Review Committee Adjudication Group: International 450 mm Shipping Box Task Force North America Physical Interfaces & Carriers Technical Committee Date: Monday, April 2, 2012 Wednesday, April 4, 2012 Time & Timezone: 8:00 AM to 10:00 AM, Pacific Time 8:00 AM to 12:00 Noon, Pacific Time Location: Intel Robert Noyce Building Executive Briefing Center Intel Robert Noyce Building Executive Briefing Center City, State/Country: Santa Clara, California Santa Clara, California Leader(s): Standards Staff: Yasuhiro Shimizu (Consult) Thomas Quinn (Intel) Paul Trio (SEMI NA) 408.943.7041 ptrio@semi.org Mutaz Haddadin (Intel) Matt Fuller (Entegris) Paul Trio (SEMI NA) 408.943.7041 ptrio@semi.org The details of these meetings are subject to change, and additional review sessions may be scheduled if necessary. Contact SEMI Standards staff for confirmation. Telephone and web information will be distributed to interested parties as the meeting date approaches. If you will not be able to attend these meetings in person but would like to participate by telephone/web, please contact SEMI Standards staff. ii
SEMI Draft Document #5375 Line Item Revisions to SEMI M80-1111, Mechanical Specification for Front-Opening Shipping Box Used to Transport and Ship 450 mm Wafers 1 Purpose 1.1 This Standard specifies the front-opening shipping box (FOSB) used to ship 450 mm wafers from wafer suppliers to their customers (typically IC manufacturers), while maintaining wafer quality. 2 Scope 2.1 This Standard is intended to set an appropriate level of specification that places minimal limits on innovation while ensuring interoperability at all mechanical interfaces. 2.2 This Standard assumes that the 450 FOSB is used in loading raw silicon wafers to 450 FOSB after inspection in Si suppliers and also used in acceptance and inspection and transfer to another carrier at device makers. The 450 FOSB is not intended to be used in IC manufacturing processes. It is recommended that wafers be transferred from the 450 FOSB to a 450 FOUP using automated methods. NOTE 1: The carrier dimensions and door force have been developed based on the assumption for shipping system and drop height as called out in ISTA-2A (individual carton) and ISTA-3E (unitized). 1 NOTICE: SEMI Standards and Safety Guidelines do not purport to address all safety issues associated with their use. It is the responsibility of the users of the Documents to establish appropriate safety and health practices, and determine the applicability of regulatory or other limitations prior to use. 3 Limitations 3.1 The detailed methods and mechanisms inside a 450 FOSB door as to how a carrier door may be engaged to and disengaged from the carrier shell are not specified by this Document. 4 Referenced Standards and Documents 4.1 SEMI Standards and Safety Guidelines SEMI E144 Provisional Specification for RF Air Interface Between RFID Tags in Carriers and RFID Reader in Semiconductor Production and Material Handling Equipment SEMI E154 Mechanical Interface Specification for 450 mm Load Port NOTE 2: Mechanical Interface Specification for 450 mm FOSB Load Port is under development. SEMI E158 Mechanical Specification for FAB Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling SEMI M74 Specification for 450 mm Diameter Mechanical Handling Polished Wafers NOTE 3: SEMI is developing a Standard for 450 mm Wafer Shipping System intended to be used in conjunction with this Document. 4.2 ISO Standards 2 ISO 4287 Geometrical Product Specifications (GPS) Surface Texture: Profile Method Terms, Definitions and Surface Texture Parameters ISO/IEC 16022 International Symbology Specification Data Matrix 1 International Safe Transit Association, 1400 Abbott Road, Suite 160, East Lansing, Michigan, 48823, USA. Telephone: 517.333.3437; Fax: 517.333.3813; http:www.ista.org 2 International Organization for Standardization, ISO Central Secretariat, 1 rue de Varembé, Case postale 56, CH-1211 Geneva 20, Switzerland. Telephone: 41.22.749.01.11; Fax: 41.22.733.34.30; http://www.iso.ch Page 1 Doc. 5375 SEMI
4.3 Other Documents SEMI AUX016 List of Carrier Maker Identification Codes NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions. 5 Terminology 5.1 Abbreviations and Acronyms 5.1.1 2D two dimensional 5.1.2 BP bilateral plane 5.1.3 CL center line 5.1.4 EE end effector 5.1.5 FOSB front-opening shipping box 5.1.6 FP facial plane 5.1.7 HP horizontal plane 5.1.8 KC kinematic coupling 5.1.9 KCP kinematic coupling pin 5.1.10 OHT overhead hoist transport 5.1.11 RFID radio frequency identification 5.1.12 TIR total indicator runout 5.2 Definitions 5.2.1 2D code a code identifying elements such as maker, model, version and serial number of a 450 FOSB, by using a data matrix ECC200 symbol according to ISO/IEC 16022. 5.2.2 2D code placement area an area on the door and another area on top of the shell, where a 2D code can be placed. 5.2.3 450 FOSB used generally as a term only within this document to identify the front opening shipping box. NOTE 4: Unless otherwise specified, the word shipping box or carrier used herein means 450 FOSB. 5.2.4 bilateral plane (BP) a vertical plane, defining x = 0 of a system with three orthogonal planes (HP, BP, FP), coincident with nominal location of the rear primary kinematic coupling pin (KCP), and midway between the nominal location of the front primary KCPs. [SEMI E154] 5.2.5 Carrier-related Definitions 5.2.5.1 box a protective portable container for a cassette and/or substrate(s). [SEMI E1.9] 5.2.5.2 carrier any cassette, box, or pod that is used to transport and store substrates. 5.2.5.3 cassette an open structure that holds one or more substrates. [SEMI E1.9] 5.2.5.4 pod a box having a standardized mechanical interface. [SEMI E19] 5.2.5.5 secondary packaging a protective portable container for carriers that is used to ship wafers in a carrier. 5.2.5.6 substrate the basic unit of material, processed by semiconductor equipment, such as wafers, CDs, flat panels, or masks. [SEMI E30.1] 5.2.6 center line (CL) a horizontal line centered vertically on the carrier door used as the reference for z dimensions of door features. 5.2.7 end effector wafer transfer device for transferring wafers to or from the carrier. Page 2 Doc. 5375 SEMI
5.2.8 facial plane (FP) a vertical plane, defining y=0 of a system with three orthogonal planes (HP, BP, FP), y33=194 ± 0 mm in front of the nominal location of the rear primary KCP. [SEMI E154] 5.2.9 front (of shipping box) the part of the shipping box closest to the door. 5.2.10 front-opening unified pod (FOUP) a box with a nonremovable cassette and with a front-opening interface (that mates with a FIMS port that complies with SEMI E154). 5.2.11 horizontal plane (HP) a horizontal plane, defining z=0 of a system with three orthogonal planes (HP, BP, FP), coincident with the nominal location of the uppermost points (tips) of the three KCPs. [SEMI E154] 5.2.12 human readable label area an area on the door and another area on the rear surface of the shell, where a label can be placed for human interface. 5.2.13 nominal location the value a dimension would have if its tolerance were reduced to zero. 5.2.14 nominal wafer seating plane a horizontal plane that bisects the wafer pickup volume. [SEMI E1.9] 5.2.15 origin the intersection of the BP and FP. 5.2.16 plane a theoretical surface that has infinite width and length, zero thickness and zero curvature. 5.2.17 rear (of FOSB) the part of the FOSB farthest from its door. 5.2.18 shipping box a protective portable carrier that is used to ship wafers from the wafer suppliers to their customers. 5.2.19 wafer deflection change in wafer shape (TIR) due to gravity while the wafer is resting in a horizontal position on the carrier wafer supports with the carrier door open. 5.2.20 wafer extraction volume the open space for extracting a wafer from the FOSB. 5.2.21 wafer pick-up volume the space that contains entire bottom of a wafer once the door is removed from the FOSB for wafer transfer. 5.2.22 wafer seating plane the bottom surface of an ideally rigid flat disk that meets the diameter specification for 450 mm wafers, with negligible droop due to gravity, as it rests on the wafer supports. 5.2.23 wafer set-down volume the open space for inserting and setting down a wafer in the shipping box. 5.2.24 wafer mapping exclusion volume a space inside the carrier reserved for break-the-beam type wafer mapping. Page 3 Doc. 5375 SEMI
1. Line Item 1: Text edits to clarify descriptions and to match existing figures 1.1 Proposal: Correct the text description in 8.1.4 for the specific locations of the notches on the Automation Flange to match Figure 2. 8.1.4 The flange has a pattern of notches on all sides. Notches on the front and back have a depth of y31 and those on the sides shall have a depth of x56. The notches shall have an angle of θ5. The four corners shall have chamfers with size of x32 and y28. Notches are located at x30, x31, x63 on the front, and x33 on the back, and at y29 on the right side and at y54 on both the right and left side. The flange shall have a thickness of z13, and the carrier shall have no obstructions around the flange for a height of z9, except for the door frame as shown by y30 in Figure 4. 1.2 Proposal: Minor editorial change of Kinematic Coupling Pin surface roughness locations description in 9.1. 9.1 KCP Shape The physical alignment interface on the bottom of the wafer carrier consists of features (specified in 10) that mate with six pins underneath. As shown in Figure 8 and defined in Table 1, each pin is radially symmetric about its vertical center axis line and can be seen as the intersection of a cylinder of radius r1 and a sphere of radius r4 (which establishes the tip of the pin and might contact a flat plate). The radius r4 is centered on the axis of symmetry at a height z3 below the HP. An additional radius r3 establishes the contact with the angled mating groove surface on the carrier. The center of the radius r3 is defined by the intersection of a vertical plane through the axis of symmetry of the pin with the horizontal circle of radius r2 at the height z4 below the HP. A blend radius of r5 is applied at the intersection of r1 and r3, and at the intersection of r3 and r4. The minimum height of the pin is given by z4. Ra1 is the surface finish roughness, as defined by ISO 4287, of all features given defined by r1, r3, r4, and r5. Dimensions r2, z3, and z4 have zero tolerance because they only define offsets and not physical features. 1.3 Proposal: Correct grammar in 17.7.3 for the description of wafer position expectation when 450 FOSB door is opened. 17.7.3 The implications of the tolerance on r12 for wafer positioning are as follows. The wafers shall be placed in the carrier within a circle of radius corresponding to the smaller bound on r12 to avoid touching the edge of the wafer to the side of the carrier. Once the wafer has been placed, the carrier shall not allow a wafer to move outside of a circle of radius corresponding to the larger bound on r12. See Figures 31 and 32. Expect that wwhen the carrier door is closed and reopened, the wafer seating plane shall be within the wafer pick-up volume (see 17.7.7). 1.4 Proposal: Remove reference to currently undefined load port hold-down forces from Related Information R3-1.1. R3-1.1 Load Port Hold-Down Interactions The load port is the primary user of the hold-down feature. In this Related Information, the Standards team felt it was important for prospective users of the Standard to understand what the hold-down function WAS and WAS NOT. The hold-down is NOT intended to be a work-around for an otherwise nonfunctional KC; that is, in the presence of only gravity, the carrier is always expected to slide down to the proper seated position without the need for other external forces. For example, following a small upset force (human push, cart bumping the load port, etc.) the 450 FOSB should return to its proper seating on the pins without the need for external forces beyond gravity. This statement is also expected to be true for the case where the carrier is docked with its door OPEN and the (optional?) seal between the load port frame and carrier shell is maintained; any maintenance downward force exerted by the load-port hold-down device onto the carrier hold-down feature is expected to be small (actual values are not yet defined, but expected to no more than 20 to 40 N, or well under 10% of the loaded carrier weight). This force is meant to be kept relatively small so that neither the carrier shell nor the wafer support plane is altered by the hold-down. Page 4 Doc. 5375 SEMI
2 Line Item 2: Modify shape of Carrier Frame Pin Hole to address tolerance conflicts between pin hole and load port pin diameters 2.1 Proposal: In 14.8, remove description of the circular frame pin opening on the left and the slotted frame pin opening on the right. Add description of frame pin slots on the left and right of carrier. 14.8 The openings for the frame pins are open-ended slots on both the circular on the left side with diameter d5, and are slots on the and right sides. The slot features are located at x39, x40 and x41 from the BP and z39 from the CL of the door. The corners of the slot features have a radius of r19 and the depth of the features is y41. See Figure 22 and 23. 2.2 Proposal: Modify Figure 1 to include open-ended frame pin slots. FROM: Change both frame pin holes from a circular hole and slotted hole to openended slots Page 5 Doc. 5375 SEMI
TO: 2.3 Proposal: Modify Figure 19 to include open ended frame pin slots. FROM: Change both frame pin features from a circle and slot to open-ended slots Page 6 Doc. 5375 SEMI
TO: 2.4 Proposal: Modify Figure 20 to include open ended frame pin slots. FROM: Page 7 Doc. 5375 SEMI
TO: 2.5 Proposal: Modify Figure 22 to include open ended frame pin slots. FROM: Change representation of frame pin feature from close-ended to open-ended. Page 8 Doc. 5375 SEMI
TO: 2.6 Proposal: Modify Figure 23 to include open ended frame pin slots. Page 9 Doc. 5375 SEMI
TO: 2.7 Proposal: Revise Table 1. Table 1 Carrier and KC Dimensions Symbol Used Figure Value Specified Datum Measured From Feature Measured To d5 20 6.5 ± 0.5 x46, CL Diameter of frame pin opening d6 23 6.5 ± 0.5 (x40 and x41), CL Diameter of slot for frame pin r19 23 3 Origin Radius of frame pin slot corners x39 23 267.9 ± 0.5 BP Inside edge of frame pin slots x40 23 1.0(272) Centered at x41bp Length of slot for frame pincenters of frame pin diameter x41 23 272.00 ± 0.50 274 BP Center of opening for frame pin, r24tangency of frame pin slots outer radius x46 20 272.0 ± 0.5 BP Center of left frame pin opening z39 23 3.7 ± 0.5 CL Outer edge of frame pin slots Page 10 Doc. 5375 SEMI
3 Line Item 3: Enhance the text description of the bounds of the COG volume to match Figure 6 3.1 Proposal: Modify 8.2. 8.2 Center of Gravity Volume The carrier s center of gravity in the x and y direction with the door closed shall be in front of the FP and within a cylinder of radius r40 on the BP extending to y72 from the FP exist within the volume, whose profile in the x-y plane is defined by either of the two regions described below.: a) The region in front of the FP and within a rectangle centered about the BP and bound by sides of length (r40 x 2) parallel to the FP and (y72-r40) parallel to the BP. b) The region within a semicircle of radius r40 centered about the BP with side parallel to FP, located at (y72-r40) along the BP. c) The center of gravity shall be within this volume whether the carrier is empty, partly filled with wafers, or fully occupied. See Figure 6. Page 11 Doc. 5375 SEMI
4 Line Item 4: Minor corrections 4.1 Proposal: Add missing text for Center Line of carrier door to the Reference Planes Specification section. 6 Reference Planes (HP, FP, BP) Specification 6.1 The HP, FP, and BP as described in the terminology section are ideal planes, which are intended to be used to depict the position of certain features relatively to these planes. These planes are at position zero (x, y, z, defined as the origin) with no tolerance associated, since these ideal planes do not represent a physical feature. Only positive numbers are used to define coordinates within this system of three planes. No negative numbers are used in order to be as close as possible to standard mechanical drawing practices. Necessary clarification on the position of a feature usually will be achieved via figures. 6.2 FP and BP are defined as vertical planes parallel to gravity when resting on the KC interface (horizontal wafer orientation.). These planes are perpendicular. NOTE 5: The top surfaces of the KCPs are not the surfaces on which the carrier rests. Appendix 1 shows how test fixtures can be made to rest on the KCPs to duplicate the position of a carrier. 6.3 Reference Baselines One center line is defined: CL Center line for the carrier door. It passes through the centers of the openings for the door pins. All the z- dimensions of door features are symmetric to the CL. 4.2 Proposal: Correct Table 1 feature measurement locations to match figures. Table 1 Carrier and KC Dimensions Symbol Used Figure Value Specified Datum Measured From Feature Measured To θ3 17 30.0 ± 2.0 degrees HP Incline of hold-down feature x10 13 193 ± 1 BP Outer Ccenter of placement sense area x11 20, 28 259 BP Opening for carrier doorinner edge of frame seal area x21 13 141 ± 1 BP Outer Ccenter of invalid placement sense areapad x23 13 55 ± 1 BP Center of rear placement sense areapad y29 2 90.0 ± 0.5 FPFront of automation flange Automation flange notch y54 2 150.0 ± 0.5 Front of automation flange NotchAutomation Flange notch z31 21 129 CL Center of spacearea reserved for vacuum pads Page 12 Doc. 5375 SEMI
5 Line Item 5: Error Corrections in Figures 5.1 Proposal: Correct z11 in Figure 9. FROM Change Z12=20.0 ± 1.0 to Z11 21 TO Page 13 Doc. 5375 SEMI
5.2 Proposal: Error correction in Figure R1-2. FROM Latch key Change MAC door cover to FOSB door cover MAC door cover Latch key hole block Front View Top View Cross-Section TO Front View Latch key FOSB door cover Latch key hole block Top View Cross-Section Page 14 Doc. 5375 SEMI
6 Line Item 6: Ensure precision & unit of specification in Figures 6.1 Proposal: Ensure consistent precision between target values and tolerances of x32, and specification unit of θ3 in Figure 2. FROM From " x32=12.0+/-1 " to " x32=12.0+/-1.0 " From " θ5=45.0+/-0.5 " to " θ5=45.0 +/-0.5 " Page 15 Doc. 5375 SEMI
TO Page 16 Doc. 5375 SEMI
6.2 Proposal: Ensure specification unit of θ6 in Figure 7. FROM From " θ6=45.0 +/-0.5 " to " θ6=45.0 +/-0.5 " TO Page 17 Doc. 5375 SEMI
6.3: Ensure specification of z24 in Figure 14. FROM TO Edit z24 <= 15.0 to z24 <= 15 Page 18 Doc. 5375 SEMI
6.4: Ensure specification unit of r12 in Figure 34. FROM From " r12=227+1/-0(for y14=0) " to " r12=r227+1/-0(for y14=0) " From " r12=227+1/-0(for y14=3) " to " r12=r227+1/-0(for y14=3) " TO Page 19 Doc. 5375 SEMI
NOTICE: (SEMI) makes no warranties or representations as to the suitability of the Standards and Safety Guidelines set forth herein for any particular application. The determination of the suitability of the Standard or Safety Guideline is solely the responsibility of the user. Users are cautioned to refer to manufacturer s instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. Standards and Safety Guidelines are subject to change without notice. By publication of this Standard or Safety Guideline, SEMI takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this Standard or Safety Guideline. Users of this Standard or Safety Guideline are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility. Page 20 Doc. 5375 SEMI