Robust low noise broadband pre-matched RF bipolar transistor

Similar documents
The BFP840FESD is a discrete RF heterojunction bipolar transistor (HBT) with an integrated ESD protection suitable for 5 GHz band applications.

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Internally matched general purpose LNA MMIC for 50 MHz- 3.5 GHz applications

For broadband amplifiers up to 1 GHz at collector currents from 1 ma to 20 ma For mixers and oscillators in sub-ghz applications

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22.

Type Marking Pin Configuration Package BFR193 RCs 1 = B 2 = E 3 = C SOT23

BF776. High Performance NPN Bipolar RF Transistor

Type Marking Pin Configuration Package BFP520F APs 1=B 2=E 3=C 4=E - - TSFP-4

ESD (Electrostatic discharge) sensitive device, observe handling precaution!

Type Marking Pin Configuration Package BFP196 RIs 1 = C 2 = E 3 = B 4 = E - - SOT143

Type Marking Pin Configuration Package BFP540ESD AUs 1=B 2=E 3=C 4=E - - SOT343

Type Marking Pin Configuration Package BFR92P GFs 1=B 2=E 3=C SOT23

BGA855N6 BGA855N6. Low Noise Amplifier for Lower L-Band GNSS Applications GND. Features

BFG235. NPN Silicon RF Transistor*

ESD (Electrostatic discharge) sensitive device, observe handling precaution!

ESD (Electrostatic discharge) sensitive device, observe handling precaution!

Small Footprint Ultra Low Current Low Noise Amplifier for Global Navigation Satellite Systems (GNSS)

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

BGA5L1BN6 BGA5L1BN6. 18dB High Gain Low Noise Amplifier for LTE Lowband VCC GND. Features

BFP620. Low Noise SiGe:C Bipolar RF Transistor

BFP420. NPN Silicon RF Transistor

Type Marking Pin Configuration Package BFP520 APs 1=B 2=E 3=C 4=E - - SOT343

Type Marking Pin Configuration Package BFP540 ATs 1=B 2=E 3=C 4=E - - SOT343

Type Marking Pin Configuration Package BFR380F FCs 1 = B 2 = E 3 = C TSFP-3

Data Sheet, Rev. 2.1, Sept BGA612. Silicon Germanium Broadband MMIC Amplifier. RF & Protection Devices

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

TVS (transient voltage suppressor) Bi-directional, 5.5 V, 0.1 pf, 0201, 0402, RoHS and halogen free compliant

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

TVS (transient voltage suppressor) Bi-directional, 18 V (AC), 13 V (DC), 0.3 pf, 0201, RoHS and halogen free compliant

BGB741L7ESD. ESD-Robust and Easy-To-Use Broadband LNA MMIC. RF & Protection Devices. Data Sheet, Rev. 1.0, April 2009

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

Qualified for industrial applications according to the relevant tests of JEDEC47/20/22

Data Sheet, Rev. 2.2, April 2008 BGA622L7. Silicon Germanium Wide Band Low Noise Amplifier with 2 kv ESD Protection. Small Signal Discretes

Data Sheet, Rev. 2.3, Sept BGA428. Gain and PCS Low Noise Amplifier. RF & Protection Devices

ESD (Electrostatic discharge) sensitive device, observe handling precaution!

BFP420. NPN Silicon RF Transistor

Type Marking Pin Configuration Package BCR08PN WFs 1=E1 2=B1 3=C2 4=E2 5=B2 6=C1 SOT363

NPN wideband silicon germanium RF transistor

ESD (Electrostatic discharge) sensitive device, observe handling precaution!

BFP405. NPN Silicon RF Transistor

BCR129 BCR129S BCR129W

BCR BCR183 BCR183W BCR183S BCR183U. Type Marking Pin Configuration Package BCR183 BCR183S BCR183U SOT23 SOT363 SC74 SOT323.

Type Marking Pin Configuration Package BCR112 BCR112W 1=B 1=B 2=E 2=E 3=C 3=C

BCR Type Marking Pin Configuration Package BCR133 BCR133S BCR133W Pb-containing package may be available upon special request C 3

NPN 25 GHz wideband transistor

NPN wideband silicon RF transistor

ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type Package Configuration L S (nh) Marking BAT15-02EL BAT15-02ELS

Type Marking Pin Configuration Package BCR405U L5s 1 = GND 2;3;5 = I out 4 = V S 6 = R ext SC74

Dual NPN wideband silicon RF transistor

Silicon NPN Planar RF Transistor

NPN wideband silicon RF transistor. NPN silicon RF transistor for high speed, low noise applications in a plastic, 4-pin dual-emitter SOT143B package.

NPN 4 GHz wideband transistor IMPORTANT NOTICE. use

NPN wideband silicon RF transistor

BCR BCR112/F BCR112W. Type Marking Pin Configuration Package BCR112 BCR112F BCR112W. WFs WFs WFs 3=C 3=C 3=C 2=E 2=E 2=E - - -

BFP840ESD. Data Sheet. RF & Protection Devices. Robust Low Noise Silicon Germanium Bipolar RF Transistor. Revision 1.2,

BFP843. Data Sheet. RF & Protection Devices. Robust Low Noise Broadband Pre-Matched Bipolar RF Transistor. Revision 1.

BAT17... Silicon Schottky Diode For mixer applications in VHF/UHF range For high-speed switching application Pb-free (RoHS compliant) package

BAS40.../BAS140W BAS40-05 BAS40-05W BAS40-06 BAS40-06W BAS40-02L BAS40-07 BAS40-07W

BCR BCR108/F BCR108T/W BCR108S. Type Marking Pin Configuration Package BCR108 BCR108F 2=E 2=E SOT23 TSFP-3 BCR108S BCR108W 3=C 3=C - - 1=B 1=B

Qualified for Automotive Applications. Product Validation according to AEC-Q100/101

BFQ67 / BFQ67R / BFQ67W

BFP520. NPN Silicon RF Transistor

Preliminary Data Sheet, Rev.2.2, Oct BGM681L11. GPS Front-End with high Out-of-Band Attenuation. Small Signal Discretes

BAT68... Silicon Schottky Diodes For mixer applications in the VHF / UHF range For high-speed switching applications Pb-free (RoHS compliant) package

PNP 5 GHz wideband transistor IMPORTANT NOTICE. use

NPN 9 GHz wideband transistor. High power gain Low noise figure High transition frequency Gold metallization ensures excellent reliability.

65 V, 100 ma NPN/NPN general-purpose transistor. Type number Package PNP/PNP NPN/PNP complement complement

NPN 9 GHz wideband transistor. The transistor is encapsulated in a plastic SOT23 envelope.

Data sheet, BGA614, Nov BGA614. Silicon Germanium Broadband MMIC Amplifier MMIC. Secure Mobile Solutions Silicon Discretes. Never stop thinking.

Part Ordering code Marking Remarks Package BFR90A BFR90AGELB-GS08 BFR90A Packed in Bulk TO-50(3)

IRS SOT-23 High-Side Gate Driver IC IRS10752LPBF. Features. Description. Package Options. Applications. Typical Connection Diagram

NPN 9 GHz wideband transistor. High power gain Low noise figure High transition frequency Gold metallization ensures excellent reliability.

AUTOMOTIVE GRADE. A I DM Pulsed Drain Current -44 P A = 25 C Maximum Power Dissipation 3.8 P C = 25 C Maximum Power Dissipation 110

OPTIREG Linear TLE4262

BCR401R LED Driver Features Applications General Description

Part Number Order Number Package Quantity Supplying Form. (Pb-Free)

60 V, 1 A PNP medium power transistors

ESD: Electrostatic discharge sensitive device, observe handling precautions! Type Marking Ordering Code Pin Configuration Package

DISCRETE SEMICONDUCTORS DATA SHEET M3D124. BFG480W NPN wideband transistor. Product specification Supersedes data of 1998 Jul 09.

BGB420, Aug BGB420. Active Biased Transistor MMIC. Wireless Silicon Discretes. Never stop thinking.

NPN 5 GHz wideband transistor IMPORTANT NOTICE. use

DISCRETE SEMICONDUCTORS DATA SHEET. BFR520 NPN 9 GHz wideband transistor. Product specification File under Discrete Semiconductors, SC14

Data Sheet, Rev.3.2, Oct BGM781N11. GPS Front-End Module. RF & Protection Devices

DATA SHEET. BFS540 NPN 9 GHz wideband transistor DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1997 Dec 05.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

TRENCHSTOP TM IGBT4 Low Power Chip IGC13T120T8L

DISCRETE SEMICONDUCTORS DATA SHEET. BFG541 NPN 9 GHz wideband transistor

NPN 5 GHz wideband transistor. The transistor is encapsulated in a 3-pin plastic SOT23 envelope.

January 2009 TLE4906K / TLE4906L. High Precision Hall Effect Switch. Data Sheet V 2.0. Sensors

AUTOMOTIVE GRADE. Thermal Resistance Symbol Parameter Typ. Max. Units R JC Junction-to-Case 1.9 R JA Junction-to-Ambient ( PCB Mount) 50 C/W

BFP842ESD. Data Sheet. RF & Protection Devices. Robust Low Noise Silicon Germanium Bipolar RF Transistor. Revision 1.1,

NPN low V CEsat Breakthrough In Small Signal (BISS) transistor in a SOT223 (SC-73) small Surface-Mounted Device (SMD) plastic package.

TLE4916-1K. Datasheet. Sense & Control. Low Power Automotive Hall Switch. Rev.1.0,

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

BCR401U. LED Driver Features LED drive current of 10mA Output current adjustable up to 65mA with external resistor 4 5. Supply voltage up to 40V

BFG520; BFG520/X; BFG520/XR

Transcription:

Product description The is a robust low noise broadband pre-matched RF heterojunction bipolar transistor (HBT). Feature list Unique combination of high end RF performance and robustness: dbm maximum RF input power,.5 kv HBM ESD hardness High transition frequency enables best in class noise performance at high frequencies: NF min =. db at 5.5 GHz,.8 V, 8 ma High gain G ma = 7 db at 5.5 GHz,.8 V, 5 ma OIP 3 = 9.5 dbm at 5.5 GHz,.8 V, 5 ma Suitable for low voltage applications e.g. V CC =. V and.8 V (.85 V, 3.3 V, 3.6 V require a corresponding collector resistor) Product validation Qualified for industrial applications according to the relevant tests of JEDEC7//. Potential applications WLAN, WiMAX and UWB Satellite communication systems: satellite radio (SDARs, DAB) and navigation systems (e.g. GPS, GLONASS, BeiDou, Galileo) Device information Table Part information Product name / Ordering code Package Pin configuration Marking Pieces / Reel / H637XTSA SOT33 = B = E 3 = C = E Ts 3 Attention: ESD (Electrostatic discharge) sensitive device, observe handling precautions Datasheet Please read the Important Notice and Warnings at the end of this document v. www.infineon.com

Table of contents Table of contents Product description.................................................................... Feature list............................................................................. Product validation..................................................................... Potential applications.................................................................. Device information..................................................................... Table of contents....................................................................... Absolute maximum ratings..............................................................3 Thermal characteristics................................................................. 3................................................................ 5 3. DC characteristics....................................................................... 5 3. General AC characteristics................................................................ 5 3.3 Frequency dependent AC characteristics...................................................6 3. Characteristic DC diagrams.............................................................. 3.5 Characteristic AC diagrams.............................................................. 3 Package information SOT33...........................................................9 Revision history....................................................................... Disclaimer............................................................................ Datasheet v.

Absolute maximum ratings Absolute maximum ratings Table Absolute maximum ratings at T A = 5 C (unless otherwise specified) Min. Max. Collector emitter voltage V CEO.5 V Open base. T A = -55 C, open base Collector emitter voltage ) V CES.5 E-B short circuited. T A = -55 C, E-B short circuited Collector base voltage ) V CBO.9 Open emitter Base current I B -5 5 ma Collector current I C 55 RF input power P RFin dbm.6 T A = -55 C, open emitter ESD stress pulse V ESD -.5.5 kv HBM, all pins, acc. to JESD-A Total power dissipation 3) P tot 5 mw T S 99 C Junction temperature T J 5 C Storage temperature T Stg -55 Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Exceeding only one of these values may cause irreversible damage to the integrated circuit. V CES is similar to V CEO due to design. V CBO is similar to V CEO due to design. 3 T S is the soldering point temperature. T S is measured on the emitter lead at the soldering point of the PCB. Datasheet 3 v.

Thermal characteristics Thermal characteristics Table 3 Thermal resistance Junction - soldering point R thjs 5 K/W P tot [mw] 3 9 8 7 6 5 3 5 5 75 5 5 T S [ C] Figure Total power dissipation P tot = f(t S ) Datasheet v.

3 3. DC characteristics Table DC characteristics at T A = 5 C Collector emitter breakdown voltage V (BR)CEO.5.6 V I C = ma, I B =, open base Collector emitter leakage current I CES ) na V CE =.5 V, V BE =, E-B short circuited Collector base leakage current I CBO ) V CB =.5 V, I E =, open emitter Emitter base leakage current I EBO ) μa V EB =.5 V, I C =, open collector DC current gain h FE 5 6 5 V CE =.8 V, I C = 5 ma, pulse measured 3. General AC characteristics Table 5 General AC characteristics at T A = 5 C Collector base capacitance ) C CB 5.3.6 pf f = MHz, f = GHz, V CB =.8 V, V BE =, emitter grounded Collector emitter capacitance C CE.5 f = MHz, V CE =.8 V, V BE =, base grounded Emitter base capacitance C EB.73 f = MHz, V EB =. V, V CB =, collector grounded Maximum values not limited by the device but by the short cycle time of the % test Including integrated feedback capacitance Datasheet 5 v.

3.3 Frequency dependent AC characteristics Measurement setup is a test fixture with Bias-T s in a 5 Ω system, T A = 5 C. Top View VC Bias-T OUT E C VB IN Bias-T B (Pin ) E Figure Testing circuit Table 6 AC characteristics, V CE =.8 V, f = 5 MHz Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output G ma S.5.5 NF min.9 G ass OIP 3 OP db 7 db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Datasheet 6 v.

Table 7 AC characteristics, V CE =.8 V, f = 9 MHz Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output Table 8 G ma S NF min.9 G ass OIP 3 3.5 OP db 8 AC characteristics, V CE =.8 V, f =.5 GHz db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output Table 9 G ma S 3.5 3 NF min.95 G ass OIP 3.5 OP db 6 AC characteristics, V CE =.8 V, f =.9 GHz db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output G ma S.5 NF min.95 G ass OIP 3 OP db 8.5 db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Datasheet 7 v.

Table AC characteristics, V CE =.8 V, f =. GHz Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output Table G ma S.5 NF min. G ass 9.5 OIP 3 OP db 6.5 AC characteristics, V CE =.8 V, f = 3.5 GHz db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output Table G ma S 9.5 9 NF min. G ass 7.5 OIP 3.5 OP db 7 AC characteristics, V CE =.8 V, f = 5.5 GHz db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output G ma S 7 5.5 NF min. G ass 5 OIP 3 9.5 OP db db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Datasheet 8 v.

Table 3 AC characteristics, V CE =.8 V, f = GHz Power gain Maximum power gain Transducer gain Noise figure Minimum noise figure Associated gain Linearity 3rd order intercept point at output db gain compression point at output G ma S 3.5 8.5 NF min.85 G ass 9 OIP 3 6 OP db db dbm I C = 5 ma I C = 8 ma I C = 5 ma, Z S = Z L = 5 Ω Note: G ms = IS / S I for k < ; G ma = IS / S I(k-(k -) / ) for k >. In order to get the NF min values stated in this chapter, the test fixture losses have been subtracted from all measured results. OIP 3 value depends on termination of all intermodulation frequency components. Termination used for this measurement is 5 Ω from. MHz to GHz. Datasheet 9 v.

3. Characteristic DC diagrams I C [ma] 8 6 8 6 8µA 7µA 6µA 5µA µa 3µA µa µa.5.5.5 V CE [V] Figure 3 Collector current vs. collector emitter voltage I C = f(v CE ), I B = parameter 3 h FE I c [ma] Figure DC current gain h FE = f(i C ), V CE =.8 V Datasheet v.

I C [ma] 3 5.5.55.6.65.7.75.8.85.9 V BE [V] Figure 5 Collector current vs. base emitter forward voltage I C = f(v BE ), V CE =.8 V I B [ma] 3 5 6 7.5.55.6.65.7.75.8.85.9 V BE [V] Figure 6 Base current vs. base emitter forward voltage I B = f(v BE ), V CE =.8 V Datasheet v.

6 7 8 I B [A] 9.3.35..5.5.55.6.65.7 V EB [V] Figure 7 Base current vs. base emitter reverse voltage I B = f(v EB ), V CE =.8 V Datasheet v.

3.5 Characteristic AC diagrams 8 6 OIP 3 [dbm] 8 6.5V, MHz.8V, MHz.5V, 55MHz.8V, 55MHz 5 5 5 3 35 I C [ma] Figure 8 3rd order intercept point at output OIP 3 = f(i C ), Z S = Z L = 5 Ω, V CE, f = parameters I C [ma] 35 3 5 8 5 9 6 3 3 5 7 8 9 55 6 6 7 7 8 9 8 9 7 8 9 5 6 6 6 7 8 9 6 3 3 5 5...6.8 V CE [V] 5 7 7 8 8 9 5 3 7 9 8 9 Figure 9 3rd order intercept point at output OIP 3 [dbm] = f(i C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz Datasheet 3 v.

35 3 3 33 5 6 5 6 5 7 7 I C [ma] 5 3 3 6 5 3 5 3 6 5 3 6 5 3 3 5 5...6.8 V CE [V] 6 Figure Compression point at output OP db [dbm] = f(i C, V CE ), Z S = Z L = 5 Ω, f = 5.5 GHz G [db] 6 8 6 8 6 S G ma 3 5 6 7 8 9 f [GHz] Figure Gain G ma, IS I = f(f), V CE =.8 V, I C = 5 ma Datasheet v.

G max [db] 8 6 8 6 8 6.5GHz.9GHz.5GHz.9GHz.GHz 3.5GHz 5.5GHz.GHz 5 5 5 3 35 5 5 55 6 65 7 I C [ma] Figure Maximum power gain G max = f(i C ), V CE =.8 V, f = parameter in GHz 8 G max [db] 6 8 6.5GHz.9GHz.5GHz.9GHz.GHz 3.5GHz 5.5GHz.GHz.5.5.5 V CE [V] Figure 3 Maximum power gain G max = f(v CE ), I C = 5 ma, f = parameter in GHz Datasheet 5 v.

.5...3..5 7. 6. 8. 9. 7. 6. 5..3 to GHz. 5....3..5 3..5 3 5... 8....... 9. 3 5.. 3....3.3 5.3 3..5.5 8mA 5mA Figure Input reflection coefficient S = f(f), V CE =.8 V, I C = 8 / 5 ma.5.5..3 3. 5..5 to GHz. 3.5..9...3..5.5.5.9.5 3 5 5.5 5.5 3.5.. 5.3. 3..5.5 8mA 5mA Figure 5 Source impedance for minimum noise figure Z S,opt = f(f), V CE =.8 V, I C = 8 / 5 ma Datasheet 6 v.

.5.....3.5 6... 6. 5..3..5 5...5 3 5 3....3.. 7. 8....... 9. 9.. 8. 7. 3...3 to GHz..3.3 3 5 5 3.5.5 8mA 5mA Figure 6 Output reflection coefficient S = f(f), V CE =.8 V, I C = 8 / 5 ma NF min [db].8.6...8.6.. I C = 5mA I C = 8mA 3 5 6 7 8 9 f [GHz] Figure 7 Noise figure NF min = f(f), V CE =.8 V, Z S = Z S,opt, I C = 8 / 5 ma Datasheet 7 v.

NF min [db] 3.8.6...8.6...8.6.. f = GHz f = 5.5GHz f = 3.5GHz f =.GHz f =.9GHz 5 5 5 I C [ma] Figure 8 Noise figure NF min = f(i C ), V CE =.8 V, Z S = Z S,opt, f = parameter in GHz NF 5 [db] 3.5 3.5.5 f = GHz f = 5.5GHz f = 3.5GHz f =.GHz f =.9GHz.5 5 5 5 I C [ma] Figure 9 Note: Noise figure NF 5 = f(i C ), V CE =.8 V, Z S = 5 Ω, f = parameter in GHz The curves shown in this chapter have been generated using typical devices but shall not be considered as a guarantee that all devices have identical characteristic curves. T A = 5 C. Datasheet 8 v.

Package information SOT33 +..5-.5 A.5±..9±.. MAX.. MIN... A.±. +..6-.5 +..3-.5 ±..3 3.5. 3x 8 Package information SOT33. MOLD FLASH, PROTRUSION OR GATE BURRS OF. MM MAXIMUM PER SIDE ARE NOT INCLUDED ALL DIMENSIONS ARE IN UNITS MM THE DRAWING IS IN COMPLIANCE WITH ISO 8 & PROJECTION METHOD [ ] Figure Package outline Figure Foot print TYPE CODE MONTH NOTE OF MANUFACTURER YEAR Figure Marking layout example..3 PIN INDEX MARKING.5. ALL DIMENSIONS ARE IN UNITS MM THE DRAWING IS IN COMPLIANCE WITH ISO 8 & PROJECTION METHOD [ ] Figure 3 Tape dimensions Datasheet 9 v.

Revision history Revision history Document version Date of release Description of changes. 8-6-9 New datasheet layout. Datasheet v.

Trademarks All referenced product or service names and trademarks are the property of their respective owners. Edition Published by Infineon Technologies AG 876 Munich, Germany 8 Infineon Technologies AG All Rights Reserved. Do you have a question about any aspect of this document? Email: erratum@infineon.com Document reference IFX-yak587859 IMPORTANT NOTICE The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics ( Beschaffenheitsgarantie ). With respect to any examples, hints or any typical values stated herein and/or any information regarding the application of the product, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. In addition, any information given in this document is subject to customer s compliance with its obligations stated in this document and any applicable legal requirements, norms and standards concerning customer s products and any use of the product of Infineon Technologies in customer s applications. The data contained in this document is exclusively intended for technically trained staff. It is the responsibility of customer s technical departments to evaluate the suitability of the product for the intended application and the completeness of the product information given in this document with respect to such application. WARNINGS Due to technical requirements products may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies office. Except as otherwise explicitly approved by Infineon Technologies in a written document signed by authorized representatives of Infineon Technologies, Infineon Technologies products may not be used in any applications where a failure of the product or any consequences of the use thereof can reasonably be expected to result in personal injury