Soft Electronics Enabled Ergonomic Human-Computer Interaction for Swallowing Training

Similar documents
Low-power carbon nanotube-based integrated circuits that can be transferred to biological surfaces

Supplementary Materials for

EG2605 Undergraduate Research Opportunities Program. Large Scale Nano Fabrication via Proton Lithography Using Metallic Stencils

KMPR 1010 Process for Glass Wafers

Major Fabrication Steps in MOS Process Flow

Chapter 3 Fabrication

MICROSTRUCTURING OF METALLIC LAYERS FOR SENSOR APPLICATIONS

Supplementary Information

Electrical Impedance Spectroscopy for Microtissue Spheroid Analysis in Hanging-Drop Networks

Part 5-1: Lithography

Flip Chip Bonding Using Sony Anisotropic Conductive Film (ACF) FP1526Y

SUPPLEMENTARY INFORMATION

Conformal Electronics Wrapped Around Daily-life Objects. Using Original Method: Water Transfer Printing.

Transparent p-type SnO Nanowires with Unprecedented Hole Mobility among Oxide Semiconductors

The Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics

This writeup is adapted from Fall 2002, final project report for by Robert Winsor.

Machine-Aligned Fabrication of Submicron SIS Tunnel Junctions Using a Focused Ion Beam

AZ 1512 RESIST PHOTOLITHOGRAPHY

i- Line Photoresist Development: Replacement Evaluation of OiR

FINDINGS. REU Student: Philip Garcia Graduate Student Mentor: Anabil Chaudhuri Faculty Mentor: Steven R. J. Brueck. Figure 1

Super-resolution imaging through a planar silver layer

Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography

Rapid and inexpensive fabrication of polymeric microfluidic devices via toner transfer masking

Supplementary information for Stretchable photonic crystal cavity with

Topic 3. CMOS Fabrication Process

Nanofluidic Diodes based on Nanotube Heterojunctions

Fabrication Techniques of Optical ICs

Dr. Dirk Meyners Prof. Wagner. Wagner / Meyners Micro / Nanosystems Technology

SUPPLEMENTARY INFORMATION

State-of-the-art device fabrication techniques

SILICON BASED VERTICAL MICRO-COAXIAL TRAN- SITION FOR HIGH FREQUENCY PACKAGING TECH- NOLOGIES

High throughput ultra-long (20cm) nanowire fabrication using a. wafer-scale nanograting template

POLYMER MICROSTRUCTURE WITH TILTED MICROPILLAR ARRAY AND METHOD OF FABRICATING THE SAME

Supplementary Information. The origin of discrete current fluctuations in a fresh single molecule junction

Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator

Layout of a Inverter. Topic 3. CMOS Fabrication Process. The CMOS Process - photolithography (2) The CMOS Process - photolithography (1) v o.

Development of a Capacitive Humidity Sensor for Physiological Activity Monitoring Applications

Photolithography Technology and Application

Supporting Information. for. Visualization of Electrode-Electrolyte Interfaces in LiPF 6 /EC/DEC Electrolyte for Lithium Ion Batteries via In-Situ TEM

Photolithography I ( Part 1 )

Microlens formation using heavily dyed photoresist in a single step

Micro- and Nano- Fabrication and Replication Techniques

Supporting Information. High-Resolution Organic Light Emitting Diodes Patterned via Contact Printing

Electronic Supplementary Information. Self-assembled Gold Nanorime Mesh Conductor for Invisible Stretchable Supercapacitor

3-5μm F-P Tunable Filter Array based on MEMS technology

Supporting Information for. Stretchable Microfluidic Radio Frequency Antenna

Supplementary information for

FABRICATION AND CHARACTERIZATION FOR InAs QUANTUM DOTS IN GaAs SOLAR CELLS.

Integrated Focusing Photoresist Microlenses on AlGaAs Top-Emitting VCSELs

Obducat NIL 6. Nanoimprinting with NRF s NIL 6

Caterpillar Locomotion inspired Valveless Pneumatic Micropump using Single Teardrop-shaped Elastomeric Membrane

High-yield Fabrication Methods for MEMS Tilt Mirror Array for Optical Switches

Supplementary Figure 1: Optical Properties of V-shaped Gold Nanoantennas a) Illustration of the possible plasmonic modes.

Lecture 13 Basic Photolithography

SUPPLEMENTARY INFORMATION

Supporting Information 1. Experimental

Supporting Information. Filter-free image sensor pixels comprising silicon. nanowires with selective color absorption

PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!

Development of gating foils to inhibit ion feedback using FPC production techniques

EXPERIMENT # 3: Oxidation and Etching Tuesday 2/3/98 and 2/5/98 Thursday 2/10/98 and 2/12/98

SU-8 Post Development Bake (Hard Bake) Study

Supporting Online Material for

Fabrication Methodology of microlenses for stereoscopic imagers using standard CMOS process. R. P. Rocha, J. P. Carmo, and J. H.

Chapter 2 Silicon Planar Processing and Photolithography

All-Glass Gray Scale PhotoMasks Enable New Technologies. Che-Kuang (Chuck) Wu Canyon Materials, Inc.

Lecture 22 Optical MEMS (4)

Monitoring of Galvanic Replacement Reaction. between Silver Nanowires and HAuCl 4 by In-Situ. Transmission X-Ray Microscopy

High Power RF MEMS Switch Technology

OPTI510R: Photonics. Khanh Kieu College of Optical Sciences, University of Arizona Meinel building R.626

Etching Small Samples and the Effects of Using a Carrier Wafer STS ICP-RIE

Fabrication and Characterization of Pseudo-MOSFETs

Fabrication of suspended micro-structures using diffsuser lithography on negative photoresist

High-Speed Scalable Silicon-MoS 2 P-N Heterojunction Photodetectors

AC : EXPERIMENTAL MODULES INTRODUCING MICRO- FABRICATION UTILIZING A MULTIDISCIPLINARY APPROACH

Fabrication of plastic microlens array using gas-assisted micro-hot-embossing with a silicon mold

Section 2: Lithography. Jaeger Chapter 2. EE143 Ali Javey Slide 5-1

Lecture 7. Lithography and Pattern Transfer. Reading: Chapter 7

Outline. 1 Introduction. 2 Basic IC fabrication processes. 3 Fabrication techniques for MEMS. 4 Applications. 5 Mechanics issues on MEMS MDL NTHU

Nano-structured superconducting single-photon detector

Fabrication of PVA Micropolarizer Arrays for a CMOS Image Sensor

EE143 Fall 2016 Microfabrication Technologies. Lecture 3: Lithography Reading: Jaeger, Chap. 2

Fabrication method of quartz aspheric microlens array for turning mask

Supporting Information

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process

Fabrication of micro structures on curve surface by X-ray lithography

A Laser-Based Thin-Film Growth Monitor

Supplementary Figures

Thin Film Resistor Integration into Flex-Boards

Department of Astronomy, Graduate School of Science, the University of Tokyo, Hongo, Bunkyo-ku, Tokyo , Japan;

High Spectral Resolution Plasmonic Color Filters with Subwavelength Dimensions Supplemental Information

EE 143 Microfabrication Technology Fall 2014

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1

Testing of Flexible Metamaterial RF Filters Implemented through Micromachining LCP Substrates. Jonathan Richard Robert Dean Michael Hamilton

Supplement: Fabrication protocol

Ultra-thin, highly flexible RF cables and interconnections

CHAPTER 2 Principle and Design

Flexible glass substrates for roll-to-roll manufacturing

CMOS Digital Integrated Circuits Lec 2 Fabrication of MOSFETs

Module 11: Photolithography. Lecture 14: Photolithography 4 (Continued)

HEX02 EMBOSSING SYSTEM

Transcription:

Supplementary Information Soft Electronics Enabled Ergonomic Human-Computer Interaction for Swallowing Training Yongkuk Lee 1,+, Benjamin Nicholls 2,+, Dong Sup Lee 1, Yanfei Chen 3, Youngjae Chun 3,4, Chee Siang Ang 2 & Woon-Hong Yeo 1,5,* 1 Department of Mechanical and Nuclear Engineering, School of Engineering, Virginia Commonwealth University, Richmond, VA 23284, USA. 2 School of Engineering and Digital Arts, University of Kent, Canterbury, United Kingdom. 3 Department of Industrial Engineering, University of Pittsburgh, Pittsburgh, PA 15261, USA. 4 Department of Bioengineering, University of Pittsburgh, Pittsburgh, PA 15261, USA. 5 Center for Rehabilitation Science and Engineering, School of Medicine, Virginia Commonwealth University, Richmond, VA 23284, USA + These authors contributed equally to this work. *Correspondence and requests for materials should be addressed to W.-H.Y. (email: whyeo@vcu.edu)

Supporting Note 1. Fabrication process of skin-like electrodes including conventional microfabrication techniques and processes of double transfer printing. a) Preparing of a carrier wafer 1. Clean a silicon wafer with acetone, IPA, and DI water. 2. Dehydrate it on a hot plate at 110 C for 3 min. 3. Apply O 2 plasma on it at 50 W for 60 sec. 4. Spincoat PMMA on it at 2000 rpm for 30 sec. 5. Bake it on a hot plate at 180 C for 2 min 30 sec. 6. Spincoat polyimide (PI) at 4000 rpm for 1 min. 7. Pre-bake it on a hot plate at 150 C for 5 min. 8. Hard bake it on a hot plate at 250 C for 40 min. b) Material deposition and photolithography 1. Deposit 300 nm-thick gold (Au) using sputtering systems. 2. Spincoat photoresist (AZ 4620) at 2000 rpm for 30 sec. 3. Bake it on a hot plate at 110 C for 5 min. 4. Align it with a photomask and expose UV light for 20 sec. 5. Develop patterns with a developer (AZ 400K, 1:3 dilution). 6. Etch Au using gold etchant. 7. Remove photoresist using acetone. 8. Etch PI using reactive ion etcher (RIE) at 150 W, 160 mtorr, and 20 sccm oxygen for 240 sec.

c) Preparation of a thin elastomeric membrane on PVA (polyvinyl alcohol; Haining Sprutop Chemical Tech, China) 1. Tape PVA onto a glass (75 x 50 mm) 2. Prepare 1:2 Ecoflex (part B is 2) and spincoat at 3000 rpm for 120 sec. 3. Cure it on a hotplate at 50 C for 5 min. d) Pick up and transfer printing of skin-like electrode onto the silicone/pva 1. Immerse fabricated skin-like electrodes on a wafer in acetone for overnight 2. Pick up the skin-like electrodes using water-soluble tape 3. Deposit Cr (5 nm)/sio 2 (50 nm) on the skin-like electrodes using an electron beam evaporator 4. Apply O 2 plasma on the silicone/pva at 50 W for 30 sec. 5. Transfer the skin-like electrodes on the silicone/pva substrate 6. Dissolve the water-soluble tape by gently applying water 7. Bonding a thin, flexible ribbon cable.

Supplementary Table 1 Table S1. Comparison of classification performance between three-part threshold and single-threshold techniques. Three Thresholds Single Threshold Subject Total attempts (Swallows) Successful detection False positives Successful detection False positives 1 15 15 0 15 7 2 15 15 1 15 2 3 15 15 1 15 3 4 15 15 0 15 0

Supplementary Figure 1 Figure S1. The design and structure for skin-like electrode for swallowing training in dysphagia rehabilitation. (a) Dimension of a skin-like electrode. (b) Close-up view of the electrode including circular cells (radius = 500 µm) and fractal interconnects (width = 50 µm). (c) Layer composition of the electrode.

Supplementary Figure 2 Figure S2. (a) Photo of an automated mechanical stretcher (top view) that places a sample in the middle. The biaxial stretcher, controlled by Arduino interface, can precisely apply strains to the sample, while a digital multimeter records the change of electrical resistance. (b) A series of microscopic images of a skin-like electrode with applied strains of 0, 50, 100, and 150%. The first fracture is observed in the structure when stretched up to 150%.

Supplementary Figure 3 Figure S3. Mechanical bending test. (a) Experimental setup for a bending test with the rotation from 0 to 180. (b) Optical image of a skin-like electrode with bending of 180. The radius of the curvature is 0.5 mm. (c) Summary of the bending test showing the change of electrical resistance with the maximum bending is negligible.

Supplementary Figure 4 Figure S4. (a) Skin-like electrode on a thin transparent elastomer. (b) Skin-like electrode attached with a flexible ribbon cable, which connects the electrode to a wireless recording device. (c) Bluetooth-based wireless transmitter connecting the electrode with the data acquisition system (DAQ) including a wireless receiver (dongle) and data processing software. (d) Photo of software interface.

Supplementary Figure 5 Figure S5. Measurement of average SNR values from swallowing EMG signals.

Supplementary Figure 6 Figure S6. A flow chart of the classification algorithm using the three-part threshold technique. The classification algorithm detects the start point of the activy signal segment which exceeds two magnitude thresholds (t1 and t2) and a duration threshold (D) (blue). Finally, the algorithm defines the active signal segment as finding its end point (orange). p = magnitude of the EMG signal; t1 = lower magnitude threshold; t2 = upper magnitude threshold which is larger than t1 and used to ensure a characteristic signal magnitude spike occurs during the active signal segment; i = EMG signal points; D = the duration threshold which is a minimum period of the signals to be an active signal segment.

Supplementary Figure 7 Figure S7. Classification results for swallowing RMS data acquired from rigid electrodes (a) and skin-like electrodes (b).

Supplementary Figure 8 Figure S8. (a) Skin-like electrode on an elastomer/silky fabric. (b) Skin-like electrode on a silky fabric attached with a flexible ribbon cable, which connects the electrode to a wireless recording device. (c) Skin-like electrodes on a silky fabric mounted on the neck (submental muscles). (d) Swallowing EMG signals acquired from the skin-like electrodes.

Supplementary Figure 9 Figure S9. Fabrication process of skin-like electrodes.

Supplementary Video Real-time play of a biofeedback game: swallowing training by jumping a white ball between moving plates.