QEE213 Plastic Infrared Light Emitting Diode

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Transcription:

QEE213 Plastic Infrared Light Emitting Diode Features Wavelength = 940 nm, GaAs Package Type: Sidelooker Medium Beam Angle, 50 Clear Plastic Package Matched Photosensors: QSE213 and QSE243 Package Dimensions 0.174 (4.44) 0.060 (1.50) R 0.030 (0.76) Description May 2005 The QEE213 is a 940nm GaAs LED encapsulated in a medium angle, thin plastic sidelooker package. 0.047 (1.20) 0.224 (5.71) 0.177 (4.51) 0.030 (0.76) 0.5 (12.7) MIN CATHODE 0.020 (0.51) SQ. (2X) Schematic 0.100 (2.54) ANODE CATHODE NOTES: 1. Dimensions for all drawings are in inches (millimeters). 2. Tolerance of ±.010 (.25) on all non nominal dimensions unless otherwise specified. 2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

Absolute Maximum Ratings (T A = 25 C unless otherwise specified) Parameter Symbol Rating Unit Operating Temperature T OPR -40 to + 100 C Storage Temperature T STG -40 to + 100 C Soldering Temperature (Iron) (2,3,4) T SOL-I 240 for 5 sec C Soldering Temperature (Flow) (2,3) T SOL-F 260 for 10 sec C Continuous Forward Current I F 100 ma Reverse Voltage V R 5 V Peak Forward Current (5) I FP 1 A Power Dissipation (1) P D 100 mw Electrical/Optical Characteristics (T A =25 C) Parameter Test Conditions Symbol Min Typ Max Units Peak Emission Wavelength I F = 100 ma l P 940 nm Emission Angle I F = 100 ma U ±25 Deg. Forward Voltage I F = 100 ma, t p = 20 ms V F 1.5 V Reverse Current V R = 5 V I R 10 µa Radiant Intensity I F = 100 ma, t p = 20 ms I e 2 mw/sr Rise Time I F = 100 ma t r 1 µs Fall Time tp = 100 µs, T = 10 ms t f 1 Notes 1. Derate power dissipation linearly 2.67 mw/ C above 25 C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16" (1.6 mm) minimum from housing. 5. Pulse conditions: tp = 100 µs, T = 10 ms. 2 www.fairchildsemi.com

Typical Performance Curves IF - FORWARD CURRENT (ma) IE - NORMALIZED RADIANT INTENSITY 10 3 10 2 10 1 Fig. 1 Forward Current vs. Forward Voltage I F Pulsed T A = 25 C 10 0 0 1 2 3 4 5 6 10 1 0.1 0.01 0.001 VF - FORWARD VOLTAGE (V) Fig. 3 Normalized Radiant Intensity vs. Forward Current Normalized to: I F = 100 ma Pulsed Duty Cycle = 0.1% T A = 25 C 0 10 100 1000 VF - FORWARD VOLTAGE (V) 160 170 150 Fig. 2 Forward Voltage vs. Ambient Temperature 2.0 1.5 1.0 0.5 0.0 I F Pulsed Duty Cycle = 0.1% 110 120 130 140 Fig. 4 Radiation Diagram 100 90 I F = 50 ma 180 0 1.0 0.8 0.6 0.4 0.2 0 0.2 0.4 0.6 0.8 1.0 80 70 60 I F = 100 ma I F = 20 ma -40-20 0 20 40 60 80 100 T A - AMBIENT TEMPERATURE ( C) 50 40 30 20 10 IF - FORWARD CURRENT (ma) 3 www.fairchildsemi.com

TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx ActiveArray Bottomless CoolFET CROSSVOLT DOME EcoSPARK E 2 CMOS EnSigna FACT FACT Quiet Series DISCLAIMER FAST FASTr FPS FRFET GlobalOptoisolator GTO HiSeC I 2 C i-lo ImpliedDisconnect Across the board. Around the world. The Power Franchise Programmable Active Droop IntelliMAX ISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect µserdes SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TinyLogic TINYOPTO TruTranslation UHC UltraFET UniFET VCX FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Datasheet Identification Product Status Definition Advance Information Preliminary No Identification Needed Formative or In Design First Production Full Production This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I15 4 www.fairchildsemi.com

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