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Transcription:

Product Data Sheet Spec No.: DS23-2016-0095 Effective Date: 12/03/2016 Revision: - LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto

1. Description The LiteOn White LED is a revolutionary, energy efficient and ultra-compact new light source, combining the lifetime and reliability advantages of Light Emitting Diodes with the brightness of conventional lighting. It gives you total design freedom and unmatched brightness, creating a new opportunities for solid state lighting to displace conventional lighting technologies Features I.C. compatible RoHS compliant and Pb free Lower operating costs Reduced maintenance costs 2. Outline Dimensions Part No. : Part No. : Notes : 1. All dimensions are in millimeters and dimension tolerances are ± 0.2mm except lens height and ceramic length / width dimension tolerance are ± 0.1mm 2. Thermal pad of the device is electrically neutral from the anode and cathode pads 1/14 Part No. :

3. Absolute Maximum Ratings at Ta=25 C Parameter Symbol Rating Unit DC Forward Current If 700 ma Power Consumption Po 2.8 W Operating Temp Range Topr -40 ~ +85 C Storage Temp Range Tstg -55 ~ +100 C Junction Temperature Tj 125 C Notes: Operating the LED under reverse bias condition long time might result in damage or failure of the component. 2/14 Part No. :

4. Electro-Optical Characteristics at Ta=25 C Parameter Symbol Values Test Condition Unit Min. 2.8 Forward Voltage Vf Typ. 3.3 If = 350mA V Max. 3.8 Min. 510 Radiant Flux Φe Typ. 600 If = 350mA mw Max 690 Dominant Wavelength Wd Min. 440 Max 460 If = 350mA nm Viewing Angle 2θ 1/2 Typ. 130 If = 350mA Thermal Resistance Rth jc Typ 9.5 --- C/W Notes: 1. Radiant flux (Φe) is the total Radiant flux output as measured with an integrating sphere. 2. Thermal resistance (Junction to case) measurement tolerance is ± 10% 3/14 Part No. :

5. Bin Code List Vf : Forward Voltage Spec. Table Vf Bin Vf (V) @ If = 350mA Min. Max. V1 2.8 3.0 V2 3.0 3.2 V3 3.2 3.4 V4 3.4 3.6 V5 3.6 3.8 Forward Voltage Tolerance: +/- 0.1 V Φe Radiant Flux Spec. Table Φe Bin Φe (mw) @ If = 350mA Min. Max. W1 510 540 W2 540 570 W3 570 600 W4 600 630 W5 630 660 W6 660 690 Radiant Flux Tolerance: +/- 10% Wd: Dominant Wavelength Spec table Wp Bin Wd (nm) @ If = 350mA Min. Max. D4I 440 445 D4J 445 450 D4K 450 455 D4L 455 460 Dominant Wavelength Tolerance: +/- 3nm Notes: Bin classification code is marked on each packing bag. 4/14 Part No. :

6. Typical Electrical / Optical Characteristics Curves (25 C Ambient Temperature Unless Otherwise Noted) Fig 1. Relative Radiant Flux vs. Forward Current Fig 2. Relative Spectral Distribution 5/14 Part No. :

Fig 3. Radiation Characteristics Fig 4. Forward Current vs. Forward Voltage 6/14 Part No. :

Fig.5 Relative Radiant Flux vs Junction Temperature 7/14 Part No. :

7. User Guide Suggested Reflow Soldering Characteristics Notes: 1. All temperatures refer to topside of the package, measured on the package body surface. 2. The soldering profile could be further referred to different soldering grease material characteristic. The grease vendor will provide this information. 3. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature. 4. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the lowest possible temperature is desirable for the LEDs. 5. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering method. 8/14 Part No. :

Recommend Printed Circuit Board Attachment Pad Notes: 1. The LEDs can be soldered using the reflow soldering or hand soldering method. The recommended hand soldering condition is 300 C max. and 2secs max. only once, and the operation of reflow soldering is only up to three times at maximum. 2. All temperatures refer to topside of the package, measured on the package body surface. 3. The soldering profile could be further referred to different soldering grease material characteristic. The grease vendor will provide this information. 4. A rapid-rate process is not recommended for the LEDs cooling down from the peak temperature. 5. Although the recommended reflow conditions are specified above, the reflow or hand soldering condition at the lowest possible temperature is desirable for the LEDs. 6. LiteOn cannot make a guarantee on the LEDs which have been already assembled using the dip soldering method. 9/14 Part No. :

Package Dimensions of Tape Package Dimensions of Reel Notes: 1. Empty component pockets sealed with top cover tape. 2. 7 inch reel-maximum 500 pieces per reel. 3. Minimum packing quantity is 100 pieces for remainders. 4. The maximum number of consecutive missing lamps is two. 5. In accordance with EIA-481-1-B specifications. 10/14 Part No. :

8. Cautions Cleaning Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED if necessary. Do not use unspecified chemical liquid to clean LED, it could harm the package. Drive Method An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit below. LED LED Circuit model A Circuit model B (A) Recommended circuit. (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs. This LED should be used under forward current, particularly not used under continuous reverse current to avoid the damage to LED. The electrode pads are plated with gold, but it is still not recommended to the use under any of the following conditions, please confirm the performance and reliability are well enough if you use it under any of the following conditions Do not use sulfur-containing materials in commercial products including the materials such as seals and adhesives that may contain sulfur. Do not put this product in a place with a lot of moisture (over 85% relative humidity), dew condensation, briny air, and corrosive gas (Cl, H2S, NH3, SO2, NOX, etc.). Manual Handling Remark The LED should only be picked up by making contact with the sides of the LED body. It should not put any pressure on the lens either by finger or any hand tool. Do not puncture or push the lens. 11/14 Part No. :

ESD (Electrostatic Discharge) Static Electricity or power surge will damage the LED. Suggestions to prevent ESD damage: Use a conductive wrist band or anti-electrostatic glove when handling these LEDs. All devices, equipment, and machinery must be properly grounded. Work tables, storage racks, etc. should be properly grounded. Use ion blower to neutralize the static charge which might have built up on surface of the LED s plastic lens as a result of friction between LEDs during storage and handling. ESD-damaged LEDs will exhibit abnormal characteristics such as high reverse leakage current, low forward voltage, or no light up at low currents. To verify for ESD damage, check for light up and V F of the suspect LEDs at low currents. The V F of good LEDs should be >2.0V@0.5mA. Training and Certification 1. Working area is ESD-certified. 2. Training records and re-certification dates monitored. Static-Safe Workstation & Work Areas 1. Static-safe working stations or work-areas have ESD signs. 2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V. 3. All ionizer activated, positioned towards the units. 4. Each work surface mats grounding is good. Personnel Grounding 1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or conductive shoes with conductive flooring. 2. If conductive footwear used, conductive flooring also present. 3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V. 4. The wrist strap or heel strap/conductive shoes are checked daily and result recorded. 5. All wrist strap or heel strap checkers calibration up to date. Device Handling 1. Each ESDS items identified by EIA-471 labels on item or packaging.. 2. No static charge generators (e.g. plastics) inside shielding containers with ESDS items. 3. All flexible conductive and dissipative package materials are inspected before reuse or recycles 12/14 Part No. :

Storage This product is qualified as Moisture sensitive Level 3 per JEDEC J-STD-020 Precaution when handling this moisture sensitive product is important to ensure the reliability of the product. The package is sealed: The LEDs should be stored at 30 C or less and 85%RH or less. And the LEDs are limited to use within one year, while the LEDs is packed in moisture-proof package with the desiccants inside. The package is opened: The LEDs should be stored at 30 C or less and 60%RH or less. The LEDs are limited to solder process within 168hrs. If the Humidity Indicator shows the pink color in 10% even higher or exceed the storage limiting time since opened, we recommended to baking LEDs at 60 C at least 24hours before solder. To seal the remainder LEDs return to package, it s recommended to be with workable desiccants in original package. Safety Do NOT directly look at the UV light from LED or optical instrument because it is harmful to human eyes. And it is recommended to use UV goggles protective glasses for avoiding eye damage. 13/14 Part No. :

9. Datasheet Version: Version Date Owner Change Item 1 2016/09/03 ChunChieh Initial specification 14/14 Part No. :