Applications Handheld/mobile devices Portable media players Notebook/netbook/laptop regulators Tablets/smartbooks Battery operated devices LED drivers LCD displays Point-of-load (POL) converters Product features High current carrying capacity Magnetically shielded, Low EMI Rugged flexible construction Self resonant frequency (SRF) greater than 9.5 MHz range from. μh to μh Current range from. A to A.75 mm x.5 mm footprint surface mount package in. mm,.5 mm, and. mm heights Moisture Sensitivity Level (MSL): Environmental data Storage temperature range (Component): -55 C to +5 C Operating temperature range: -55 C to +5 C (ambient plus self-temperature rise) Solder reflow temperature: J-STD- (latest revision) compliant Halogen free, lead free, RoHS compliant Pb HALOGEN HF FREE
Product specifications Part Number 5 OCL (μh) ±%. mm height Part marking designator I rms (A) I sat (A) DCR (mω) typical @ + C DCR (mω) maximum @ + C SRF (MHz) typical K-factor MPIV-R-R. A 7.5.5 MPIV-R7-R.7 B 5.. 9 7 MPIV-R-R. C.5.7.5 9 MPIV-R-R. D..5.5.5 77 MPIV-R5-R.5 E.. 55 MPIV-R-R. F.9. 75 9 5 MPIV-R7-R.7 G.. 75 9 9.5 mm height MPI5V-R-R. A.5. 7.5 5 9 MPI5V-R-R. B 9.5 7..5 5 MPI5V-R7-R.7 C 7. 9. 9 99 MPI5V-R5-R D 7.5. 9 MPI5V-R-R. E.. 9 7 MPI5V-R-R. F 5.5. 7 5 MPI5V-R5-R.5 G.. 5 MPI5V-R-R. H.9.5 5 7 9 MPI5V-R-R. I.. 77 9 5 MPI5V-R7-R.7 J.. 79 MPI5V-R-R. K.. 7 7 9 MPI5V--R L.. 5 9 7. mm height MPIV-R-R. A.5.5 9 MPIV-R-R. B 7 5.5. 5 MPIV-R-R. C 9.5 7.5 9. MPIV-R7-R.7 D.5.5 95 9 MPIV-R5-R E. 5 7 5 MPIV-R-R. F 7.5 9..5 MPIV-R-R. G.5 7. 5 MPIV-R-R. H.5. 5 MPIV-R5-R.5 I 5.. 5 5 MPIV-R-R. J. 5.5 7 MPIV-R-R. K.. 7 5 5 MPIV-R7-R.7 L.7. 9 5 MPIV-R-R. M.. 7 9 MPIV--R N.7. 5 7 7 MPIV-5-R 5 O.5. 57 MPIV--R P..5 5 9.5 5. Open Circuit (OCL) Test Parameters: khz,. Vrms,. Adc, +5 C.. I rms : DC current for an approximate temperature rise of C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +5 C under worst case operating conditions verified in the end application.. I sat : Peak current for approximately % rolloff @ +5 C.. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p :(Gauss), K: (K-factor from table), L: ( in uh), ΔI (Peak to peak ripple current in Amps). 5. Part Number Definition: MPIxxV-xxx-R MPI = Product code xx= Height indicator V=Version indicator xxx= inductance value in μh, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant
Dimensions (mm) Dimension A MPIV. ±. MPI5V. ±. MPIV. ±. Part marking: xx ( = version, x = inductance value per Part marking designator listed in Product specification table, x = bi-weekly date code) All soldering surfaces to be coplanar within. millimeters Tolerances are ±. millimeters unless stated otherwise Pad layout tolerances are ±. millimeters unless stated otherwise Do not route traces or vias underneath the inductor Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, parts per diameter reel KO MPIV. MPI5V. MPIV.5
Core loss vs Bp-p MPIV-R-R MPIV-R7-R khz khz...5 MHz. MHz. MHz. MHz khz 5 khz...5 MHz. MHz. MHz. MHz khz 5 khz.. MPIV-R-R MPIV-R-R khz khz...5 MHz. MHz. MHz. MHz khz 5 khz...5 MHz. MHz. MHz. MHz khz 5 khz.. MPIV-R5-R MPIV-R-R khz khz..5 MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz khz 5 khz. MHz. MHz....
Core loss vs Bp-p MPIV-R7-R MPI5V-R-R...5 MHz. MHz. MHz. MHz khz khz 5 khz...5 MHz. MHz. MHz. MHz khz khz 5 khz.. MPI5V-R-R MPI5V-R7-R..5 MHz. MHz. MHz. MHz khz khz 5 khz..5 MHz. MHz. MHz. MHz khz khz 5 khz.... MPI5V-R5-R MPI5V-R-R..5 MHz. MHz. MHz. MHz khz khz 5 khz..5 MHz. MHz. MHz. MHz khz khz 5 khz.... 5
Core loss vs Bp-p MPI5V-R-R MPI5V-R5-R..5 MHz. MHz. MHz. MHz khz khz 5 khz...5 MHz. MHz. MHz. MHz khz khz 5 khz.. MPI5V-R-R MPI5V-R-R khz khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... MPI5V-R7-R MPI5V-R-R khz khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz....
Core loss vs Bp-p..5 MHz. MHz. MHz. MHz MPI5V--R khz khz 5 khz. MPIV-R-R.5 MHz. MHz. MHz. MHz khz khz 5 khz.... MPIV-R-R khz MPIV-R-R khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... MPIV-R7-R khz MPIV-R5-R khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... 7
Core loss vs Bp-p MPIV-R-R khz MPIV-R-R khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... MPIV-R-R MPIV-R5-R khz khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... MPIV-R-R khz MPIV-R-R khz khz khz..5 MHz. MHz. MHz. MHz 5 khz..5 MHz. MHz. MHz. MHz 5 khz....
Core loss vs Bp-p MPIV-R7-R MPIV-R-R..5 MHz. MHz. MHz. MHz khz khz 5 khz..5 MHz. MHz. MHz. MHz khz khz 5 khz.... MPIV--R khz MPIV-5-R khz..5 MHz. MHz. MHz. MHz khz 5 khz..5 MHz. MHz. MHz. MHz khz 5 khz.... MPIV--R khz khz 5 khz..5 MHz. MHz. MHz. MHz.. 9
vs. Frequency MPIV-R-R MPIV-R7-R...7........5.....9..7... MPIV-R-R...... MPIV-R-R...... MPIV-R5-R.7....5..9... MPIV-R-R.7....5..9...
vs. Frequency MPIV-R7-R MPI5V-R-R 9. 7 5...5.. MPI5V-R-R MPI5V-R7-R.9.....5...7...... MPI5V-R5-R MPI5V-R-R....9..7.......9..7......
vs. Frequency MPI5V-R-R MPI5V-R5-R.................. MPI5V-R-R MPI5V-R-R 5.5 5 7.5.5.5 5.5.. MPI5V-R7-R MPI5V-R-R..
vs. Frequency MPI5V--R MPIV-R-R........ MPIV-R-R MPIV-R-R....5......5. MPIV-R7-R MPIV-R5-R..9..7...........
vs. Frequency MPIV-R-R MPIV-R-R.................. MPIV-R-R MPIV-R5-R..5......5.5. MPIV-R-R MPIV-R-R..5......5.5.
vs. Frequency MPIV-R7-R MPIV-R-R.. MPIV--R MPIV-5-R.. 7 MPIV--R 5. 5
and temperature rise vs. Current. MPIV-R-R 9. MPIV-R7-R 9.. 7 5 ( C).. 7 5 ( C).5..5.7..... MPIV-R-R 9 7 5 ( C).9..7..... MPIV-R-R 9 7 5 ( C) MPIV-R5-R. 5 7 9 MPIV-R-R....... 9 7 5 ( C).... 9 7 5 ( C) 5 7 5 7
and temperature rise vs. Current 5 MPIV-R7-R. MPI5V-R-R.5 9.. 9.5.5.5 7 5 ( C)....... 7 5 ( C)..5.5.5.5 5... MPI5V-R-R 9.5 MPI5V-R5-R. 9 7 5 ( C) MPI5V-R7-R 9. 7. 5.. MPI5V-R-R.7 9. ( C).... 7 5 ( C).... 7 5 ( C) 7
and temperature rise vs. Current. MPI5V-R-R. MPI5V-R5-R.9..7.... 9. 5 7 9 MPI5V-R-R. 7 5 ( C). 9. 7. 5... 5 7 MPI5V-R-R.5 ( C). 9. 7... 5.... 5 7 MPI5V-R7-R.5 9.5 7.5 5.5.5.5.5.5 5 ( C) 5 7 ( C) 9.5 7 5.5.5.5.5.5 5 5.5 MPI5V-R-R.5 9 5.5 5 7.5.5 5.5.5.5.5.5 ( C) ( C)
and temperature rise vs. Current MPI5V--R. MPIV-R-R 9 9.9. 9 7 5 7 5 ( C).7..5.. 7 5 ( C)...5.5.5 MPIV-R-R. 5 5 5 5 MPIV-R-R. 9. 9.... 7 5 ( C)...5 7 5 ( C) 5 5 5 MPIV-R7-R. MPIV-R5-R. 9 9.... 7 5 ( C).... 7 5 ( C) 9
and temperature rise vs. Current.7 MPIV-R-R. MPIV-R-R. 9 9.... MPIV-R-R. 7 5 ( C) 7.. 5.. MPIV-R5-R. ( C)..... 9 7 5 ( C)...... 9 7 5 ( C) 5 7 9 5 7 9. MPIV-R-R MPIV-R-R.... 9.5 7 5 ( C).5.5 9 7 5 ( C) 5 7.5.5.5.5 5 5.5
and temperature rise vs. Current 5 MPIV-R7-R 7 MPIV-R-R.5 9 9.5 7.5 5.5.5.5.5.5 5 ( C) 5 7 5.5.5.5.5 5 ( C) MPIV--R 9 7 5 ( C) MPIV-5-R 9 7 5 ( C).5.5.5..... MPIV--R 9 7 5 ( C)......
Solder reflow profile T P Max. Ramp Up Rate = C/s Max. Ramp Down Rate = C/s t P T C -5 C Table - Standard SnPb Solder (T c ) Package Thickness Volume mm <5 Volume mm 5 T L Temperature T smax T smin Preheat A ts t <.5mm) 5 C C.5mm C C Table - Lead (Pb) Free Solder (T c ) Package Thickness Volume mm <5 Volume mm 5 - Volume mm > <.mm C C C..5mm C 5 C 5 C >.5mm 5 C 5 C 5 C 5 C Time 5 C to Peak Time Reference JDEC J-STD- Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) C 5 C Temperature max. (T smax ) 5 C C Time (T smin to T smax ) (t s ) - Seconds - Seconds Average ramp up rate T smax to T p C/ Second Max. C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) C -5 Seconds Peak package body temperature (T P )* Table Table 7 C -5 Seconds Time (t p )** within 5 C of the specified classification temperature (T c ) Seconds** Seconds** Average ramp-down rate (T p to T smax ) C/ Second Max. C/ Second Max. Time 5 C to Peak Temperature Minutes Max. Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division Eaton Boulevard Cleveland, OH United States 7 Eaton All Rights Reserved Publication 5 BU-MC7 April 7 Eaton is a registered trademark. All other trademarks are property of their respective owners.