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Transcription:

absorption, 69 active tuning, 234 alignment, 394 396 apodization, 164 applications, 7 automated optical probe station, 389 397 avalanche detector, 268 back reflection, 164 band structures, 30 bandwidth detector, 260 beam propagation method, 37 bent waveguides, 69 75 field profile, 74 mode profile, 74 propagation loss, 73 rib, 72 rib waveguides, 76 strip, 71 strip waveguides, 76 bond pads, 386 bonding, 12 Bragg gratings, 117 143 buried oxide, 178 channel waveguide, see strip waveguide checklist, 402 circuit export, 355 circuit modelling, 313, 317, 330, 333 cladding, 179 CMC Microsystems, 22 combiner, 110 common-bus WDM, 408 compact models, 314, 316 computation lithography models, 134 contacts, 273 corner analysis, 370 coupled mode theory, 38, 92 coupling coefficient, 92 cross-over length, 93 cross-talk, 106 110 dark current, 262 data communication, 8, 406 delta beta coupling, 108, 109 design for manufacturability, 20 design for test, 362, 398 design methodology, 28, 168 design review, 402 design rule checking, 350, 360 design rules, 352 detector, 13, 259 282 avalanche, 268 band diagram, 267 bandwidth, 260, 273 contacts, 273 cross-section, 266 dark current, 262, 263, 280, 281 fabrication, 264 FDTD, 275 opto-electronic model, 279 photoconductive, 266 pin, 267 responsivity, 259, 266, 267, 273, 281 SEM, 265 transient, 282 transit time, 260 detectors, 397 detuned grating, 165 device design, 17 directional couplers, 92 110, 318 329 directionality, 164 dispersion group velocity dispersion, 66 material, 66 waveguide, 66 edge couplers, 182 190, 382 effective index, 30, 53, 57 59, 61, 66, 68 effective index method, 30, 57 60 eigenmode expansion method, 37, 92 eigenmode solver, 28 electrical interfaces, 386 389 electronic design automation, 41 mask layout, 42 electronic simulations, 41 in this web service

415 electronic photonic co-design, 351 electronic photonic integration, 43 electrons, 9 epixfab, 21 experimental bends, 70 72 Bragg gratings, 126 143, 369 detector, 263, 266, 267, 273 directional coupler, 99 101 eye diagrams, 409, 412 fabrication non-uniformity, 372 378 free spectral range, 116, 117 grating coupler, 181, 373 group index, 67, 374 ring resonator, 116, 117, 373 eye diagrams, 409, 412 fabrication detector, 264 fabless, 5, 20 non-uniformity, 136, 368 378 process contours, 369 process parameters, 352 sensitivity, 103 fan-in assembly, 384 FDTD 2.5D, 36 37 2D, 35 3D, 31 35 bends, 70 73 description, 31 directional couplers, 102 103 E-field intensity, 73 edge coupler, 187 effective index method, 36 grating coupler, 171 fibre array, 384, 385 fibre grating coupler, see also grating coupler, 163 182 fibre packaging, 382 fibre taper coupling, 386 finite difference modelling, 28 finite different time domain, see FDTD finite element modelling, 28 flip-chip bonding, 16, 388 foundry CEA-Leti, 21 electron-beam lithography, 127, 131 133 IME, 70, 132, 133 imec, 21, 70, 132, 133 OpSIS, 70 free-space coupling, 385 GDS layer map, 353 GDS layout, 362 366 germanium absorption, 265 lasers, 304 grating coupler, 163 182, 381 2D FDTD, 170 3D FDTD, 181 analytic, 169 Bragg condition, 166 168 circuits, 333 design methodology, 168 experimental, 373 fabrication non-uniformity, 377 379 focusing design, 179 mask layout, 180 return loss, 172, 330 S-parameters, 330 theory, 165 grating coupling coefficient, 120 group index, 59, 66 68 experimental, 67 group velocity, 65 high NA fibre, 185 hybrid integration, 12 hybrid laser, 301 industry, 9 insertion loss, 164 integration, 15 laser modelling, 39, 296 299 lasers, 14, 295 306, 397 co-packaged, 299 epitaxial bonding, 301 etch-pit, 301 external, 295 external cavity, 300 germanium, 304 hybrid, 301 monolithic, 303 Raman, 306 layer map, 353 layout, 41, 362 366 layout versus schematic, 350, 361 lensed fibre, 383 light sources, see also lasers, 14 lithography simulation, 134 losses, 69 Mach Zehnder interferometer, 113 114 mask layout, 41, 362 366 Maxwell s equations, 30 metal, 69 micro-ring modulator, see also ring modulator, 226 microscope, 393 microwave modelling, 39 in this web service

416 mobility, 261 mode convergence test, 55 crossing, 63 edge coupler, 183 effective index, see effective index energy density, 61 field intensities, 61 fundamental, 61 group index, see group index mismatch, 162 mismatch loss, 70, 75, 184 overlap calculations, 73, 75, 184 polarization fraction, see polarization fraction profile, 30, 53, 57, 59 62 single mode, 53, 63 slab waveguide, 53 solver, 28, 61 TE, 53, 57 TE-like, 61 63 TM, 53, 57 TM-like, 61, 62 wavelength dependence, 65 modulators, 12, 217 241 monolithic integration, 15 multi-chip integration, 16 multi-mode waveguides, 69 multi-project wafer, 20 OpSIS, see also foundry OpSIS, 21 optical alignment, 394 396 optical circuit modelling, 41 optical communications, 8, 406 optical coupling, 381 386 optical cross-talk, 106 110 optical losses bends, 70 material, 69 metal, 69 mode mismatch, see mode mismatch loss radiation, 70, 75 scattering, 69 substrate leakage, 70 wide waveguides, 69 optical power budget, 400 optical probe station, 389 397 optical return loss, 164 optical test equipment, 397 optoelectronic modelling, 39 oxide, 52 packaging electrical, 388 optical, 11, 385 parasitic coupling, 106 110 passivity, 324, 325 penetration loss, 164 perfectly matching layers, 33 phase velocity, 65 photonic circuit modelling, 40 photonic crystals, 30 photonic systems, 17 photonic wire, see strip waveguide photonic electronic integration, 15 photons, 9 PIN junction, 232 235 pn-junction, 218 226 polarization, 57, 190 193 conversion, 64 diversity, 191 fraction, 63, 65 management, 191 splitter rotator, 191 splitting grating couplers, 191 probing, 387 process design kit, 349 process modelling, 39 process stack, 5 quality factor, Q, 35 quasi-te mode, see mode TE-like quasi-tm mode, see mode TM-like RC time constant detector, 261 pn junction, 223, 225 reciprocity, 38, 317, 320, 326 refractive index imaginary, 69 Lorentz model, 50 Palik data, 50 Sellmeier model, 50 silicon, 49 silicon dioxide, 51 temperature dependence, 50, 51 responsivity, 259 RF probing, 387 rib waveguide, 68 directional couplers, 93 103 effective index, 66 effective index method, see also effective index method, 60 mode profile, 60 ridge waveguide, see strip waveguide ring modulator, 226 232, 406 ring resonator, 115 117 circuit model, 330 fabrication non-uniformity, 372 377 roughness, 69 in this web service

417 S-parameters, 317, 324 directional coupler, 320 FDTD, 320 grating coupler, 330 passivity, 324 passivity enforcement, 325 scattering, 69 schematic capture, 353 schematic-driven layout, 350, 356 semiconductor modelling, 39 silicon buried oxide, 49 optical absorption, 217 refractive index, 49 silicon-on-insulator, 49 substrate, 49 thickness variation, 49 wafer, 49 silicon dioxide cladding, 52 refractive index, 51 temperature dependence, 51 silicon oxide buried oxide, 49 silicon photonic chip, 7 simulation analysis, 35 boundary conditions, 33 conformal mesh, 56 convergence test, 34, 55, 56 mesh, 32 mesh accuracy, 71 mesh grid, 56 mesh override, 56 mesh refinement, 57 mode expansion, 71 mode solver, 61 monitors, 33 movies, 71 optimization, 35 parameter sweep, 35 simulation boundaries, 55 simulation size, 56 simulation span, 56 simulation time, 56 staircase mesh, 56 volume, 32 small signal modulation response, 228 Soref, 217 spiral gratings, 137 splitter, 110 spot-size converter, 383 strip waveguide, 51 directional couplers, 105 106 effective index, 57 effective index method, see also effective index method, 59 mode profile, 61 63 polarization fraction, 65 TE-like mode, 61 63 TM-like mode, 62 strip-loaded ridge waveguide, see rib waveguide substrate leakage, 70 supermode, 92 TCAD, 39 temperature control, 392 temperature dependence Bragg grating, 138 detector dark current, 280, 281 Mach Zehnder, 241 ring resonator, 410 silicon, 50 test equipment, 397 test structures, 399 thermal modelling, 40 thermal phase shifter, 236 240, 400 thermal tuning efficiency, 236, 408 thermo-optic switch, 240 241 through-silicon vias, 16 tiling, 351 transfer matrix method, 38, 121 123 trimming, 400 tuning, 234, 400 variable optical attenuator, 232 wafer, 4 wave propagation, 31 38 waveguide, 10 bends, see bent waveguides compact model, 66 design, 53 directional couplers, 92 110 dispersion, 66 effective index, see effective index evanescent field, 55 group index, see group index losses, 69 mode, see mode numerical modelling, 53 75 oxide cladding, 52 parameters, 68 pn-junction, 65 rib, see rib waveguide scattering loss, 61 single mode, 63 slab, 53 55, 57, 58 slab thickness, 57 in this web service

418 waveguide (cont.) strip, see strip waveguide TE, 54, 59 TM, 55 wavelength dependence, 65, 67 width, 63 wavelength division multiplexing, 406 wide waveguides, 69 wire bonding, 16, 388 Y-branch, 110 112 yield, see also fabrication non-uniformity, 20 in this web service