CEP8101A Rev 1.0, Apr, 2014

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Wide-Input Sensorless CC/CV Step-Down DC/DC Converter FEATURES 42V Input Voltage Surge 40V Steady State Operation Up to 2.1A output current Output Voltage 2.5V to 10V Resistor Programmable Current Limit from 1A to 2.1A Cable Compensation from 0Ω to 0.4Ω ±7.5% CC Accuracy Compensation of Input /Output Voltage Change Temperature Compensation 2% Feedback Voltage Accuracy Up to 94% Efficiency 125kHz Switching Frequency Eases EMI Design Advanced Feature Set Integrated Soft Start Thermal Shutdown Protection Against Shorted ISET Pin Patented E-LTI technology improves load transient response. SOP-8EP Package Long -waiting-time hiccup mode APPLICATIONS Car Charger/ Adaptor Rechargeable Portable Devices General-Purpose CC/CV Supply GENERAL DESCRIPTION is a wide input voltage, high efficiency CC step-down DC/DC converter that operates in either CV (Constant Output Voltage) mode or CC (Constant Output Current) mode. provides up to 2.1A output current at 125kHz switching frequency. provides OVP pin for output over voltage protection. Protection features include cycle-by-cycle current limit, thermal shutdown, and frequency foldback at short circuit. The devices are available in a SOP-8EP package and require very few external devices for operation. Typical Application Circuit for Car Charger ~ 1 ~

ORDERING INFORMATION PART NUMBER OPERATION TEMPERATURE RANGE PACKAGE PINS PACKING SP8-40 C to 85 C SOP-8EP 8 TAPE & REEL PIN CONFIGURATION HSB 1 8 ISET IN 2 7 OVP SW 3 6 LCOMP GND EP 4 5 FB PIN DESCRIPTIONS Pin NAME No. 1 HSB 2 IN Description High Side Bias Pin. This provides power to the internal high-side MOSFET gate driver. Connect a 100nF capacitor from HSB pin to SW pin. Power Supply Input. Bypass this pin with a 10µF ceramic capacitor to GND, placed as close to the IC as possible. 3 SW Power Switching Output to External Inductor. 4 GND 5 FB Ground. Connect this pin to a large PCB copper area for best heat dissipation. Return FB, COMP, and ISET to this GND, and connect this GND to power GND at a single point for best noise immunity. Feedback Input. The voltage at this pin is regulated to 0.800V. Connect to the resistor divider between output and GND to set the output voltage. 6 LCOMP Output cable resistance compensation. 7 OVP/EN 8 ISET Exposed Pad : OVP input. If the voltage at this pin exceeds 1.25V, the IC shuts down high -side switch. CEP8101B: EN input. If the voltage at this pin is below 1.5V, the IC remains shut-off. Output Current Setting Pin. Connect a resistor from ISET to GND to program the output current. Heat Dissipation Pad. Connect this exposed pad to large ground copper area with copper and vias. ~ 2 ~

FUNCTIONAL BLOCK DIAGRAM ABSOLUTE MAXIMUM RATINGS Parameter Rating Unit IN to GND -0.3 to 42 V SW to GND -1 to VIN + 1 V HSB to GND VSW - 0.3 to VSW + 7 V FB,OVP, ISET, COMP to GND -0.3 to + 6 V Junction to Ambient Thermal Resistance 50 C/W Operating Junction Temperature -40 to 150 C Storage Junction Temperature -55 to 150 C Lead Temperature (Soldering 10 sec.) 300 C Note: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect device reliability. ~ 3 ~

ELECTRICAL CHARACTERISTICS (VIN = 20V,TA = +25 C unless otherwise stated) Parameter Test Conditions Min Typ Max Unit Input Voltage 10 40 V Input Voltage Surge 42 V VIN UVLO Turn-On Voltage Input Voltage Rising 9.1 9.4 9.7 V VIN UVLO Hysteresis Input Voltage Falling 1.1 V Standby Supply Current V FB = 1V 0.9 1.4 ma V OUT = 5V, No load 3 ma Feedback Voltage 784 800 816 mv Internal Soft-Start Time 900 us Switching Frequency V FB = 0.800V 125 KHz Foldback Switching Frequency V FB = 0V 13 KHz Minimum On-Time 250 ns ISET Voltage 1 V ISET to IOUT DC Room Temp Current Gain CC Controller DC Accuracy IOUT / ISET, R ISET = 10kΩ 12400 A/A R ISET = 19.6kΩ, V OUT = 3.5V Open-Loop DC Test 625 640 655 ma OVP Voltage Reference OVP Pin Rising and Falling 1.25 V High-Side Switch ON-Resistance 0.2 Ω Thermal Shutdown Temperature Temperature Rising 150 C Thermal Shutdown Temperature Hysteresis Temperature Falling 40 C ~ 4 ~

FUNCTIONAL DESCRIPTION CV/CC Loop Regulation As seen in Functional Block Diagram, the is a Constant On Time (COT) mode pulse width modulation (PWM) converter with CC and CV control. The converter operates as follows: The main loop of CEP8101 uses a COT mode control which provides a very fast transient response with no external component and no need loop compensation. The CEP8101 also adopt a proprietary circuit that ensures enable use very low ESR capacitor to maintain loop stability. At beginning of each cycle, the high side MOSFET turns on. The high side MOSFET is turn off after internal one shot timer expires. This one shot time is set by VIN and VOUT to maintain a constant frequency. The one shot timer is reset and high side MOSFET turns on again when feedback voltage falls below the reference voltage. An internal ramp is generating to simulate output ripple, eliminating the need for ESR induced output ripple from COT control mode. When high side MOSFET turns off, the SW node of the inductor swings to a diode voltage below ground, causing the inductor current to decrease and magnetic energy to be transferred to output. This state continues until the next cycle start again. The High-Side Power Switch is driven by logic using HSB as the positive rail. This pin is charged to VSW + 5V when the Low-Side Power Switch turns on. The COMP voltage is the integration of the error between FB input and the internal 0.800V reference. If FB is lower than the reference voltage, COMP tends to go higher to increase current to the output. Output current will increase until it reaches the CC limit set by the ISET resistor. At this point, the device will transition from regulating output voltage to regulating output current, and the output voltage will drop with increasing load. The operation frequency is normally set at 125 khz. However, if FB voltage is less than 0.75V, then the switching frequency decreases until it reaches a typical value of 36kHz at VFB = 0.1V. OVP Pin provides OVP pin for output over voltage protection. If the voltage at this pin exceeds 1.25V, the IC shuts down. Hiccup Mode provides hiccup mode for output short protection. When the output voltage is under 25% of your primary setting-up voltage,the hiccup mode will work to protect your system. Thermal Shutdown The disables switching when its junction temperature exceeds 150 C and resumes when the temperature has dropped by 40 C. Typical Application Circuit for 5V/2.1A Car Charger ~ 5 ~

APPLICATIONS INFORMATION Output Voltage Setting Figure 1: Output Voltage Setting Figure 1 shows the connections for setting the output voltage. Select the proper ratio of the two feedback resistors R1 and R2 based on the output voltage. Typically, use R2 10kΩ and determine R1 from the following equation: V OUT R1 R2 1 0.800V CC Current Setting constant current value is set by a resistor connected between the ISET pin and GND. The CC output current is linearly proportional to the current flowing out of the ISET pin. The voltage at ISET is roughly 1V and the current gain from ISET to output is roughly 12400 (12.4mA/1µA). To determine the proper resistor for a desired current, please refer to Figure 2 below. (1) Inductor Selection The inductor maintains a continuous current to the output load. This inductor current has a ripple that is dependent on the inductance value: Higher inductance reduces the peak-to-peak ripple current. The tradeoff for high inductance value is the increase in inductor core size and series resistance, and the reduction in current handling capability. In general, select an inductance value L based on ripple current requirement: V OUT V IN V L OUT V f I K IN SW LOADMAX RIPPLE Where V IN is the input voltage, V OUT is the output voltage, f SW is the switching frequency, I LOADMAX is the maximum load current, and K RIPPLE is the ripple factor. Typically, choose K RIPPLE = 30% to correspond to the peak-to-peak ripple current being 30% of the maximum load current. With a selected inductor value the peak-to-peak inductor current is estimated as: I LPK PK V V V LVIN f OUT IN OUT SW The peak inductor current is estimated as: 1 ILPK ILOADMAX ILPK - PK (4) 2 (2) (3) Figure 2: Curve for Programming Output CC Current ~ 6 ~

The selected inductor should not saturate at I LPK. The maximum output current is calculated as: 1 IOUTMAX ILIM ILPK PK (5) 2 I LIM is the internal current limit, which is typically 4.2A. External High Voltage Bias Diode It is recommended that an external High Voltage Bias diode be added when the system has a 5V fixed input or the power supply generates a 5V output. This helps improve the efficiency of the regulator. The High Voltage Bias diode can be a low cost one such as IN4148. Figure 4: External High Voltage Bias Diode This diode is also recommended for high duty cycle operation and high output voltage applications. Input Capacitor The input capacitor needs to be carefully selected to maintain sufficiently low ripple at the supply input of the converter. A low ESR capacitor is highly recommended. Since large current flows in and out of this capacitor during switching, its ESR also affects efficiency. The input capacitance needs to be higher than 10µF. The best choice is the ceramic type, however, low ESR tantalum or electrolytic types may also be used provided that the RMS ripple current rating is higher than 50% of the output current. The input capacitor should be placed close to the IN and G pins of the IC, with the shortest traces possible. In the case of tantalum or electrolytic types, they can be further away if a small parallel 0.1µF ceramic capacitor is placed right next to the IC. Where I OUTMAX is the maximum output current, K RIPPLE is the ripple factor, R ESR is the ESR of the output capacitor, f SW is the switching frequency, L is the inductor value, and C OUT is the output capacitance. In the case of ceramic output capacitors, R ESR is very small and does not contribute to the ripple. Therefore, a lower capacitance value can be used for ceramic type. In the case of tantalum or electrolytic capacitors, the ripple is dominated by R ESR multiplied by the ripple current. In that case, the output capacitor is chosen to have sufficiently low ESR. For ceramic output capacitor, typically choose a capacitance of about 220µF. For tantalum or electrolytic capacitors, choose a capacitor with less than 50mΩ ESR. Rectifier Diode Use a Schottky diode as the rectifier to conduct current when the High-Side Power Switch is off. The Schottky diode must have current rating higher than the maximum output current and a reverse voltage rating higher than the maximum input voltage. Output Cable Resistance Compensation To compensate for resistive voltage drop across the charger's output cable, the integrates a simple, user-programmable cable voltage drop compensation using the impedance at the LCOMP pin. Use the curve in Figure 5 or list in Table1 to choose the proper resistance values for cable compensation. Figure 5: Cable Compensation Output Capacitor The output capacitor also needs to have low ESR to keep low output voltage ripple. The output ripple voltage is: VIN VRIPPLE IOUTMAXK RIPPLERESR (6) 2 28 f LCOUT SW ~ 7 ~

Table1: Recommend resistance values for cable compensation. R LCOMP (KΩ) Equivalent R (Ω) 10 0.04 20 0.08 30 0.12 40 0.16 60 0.24 75 0.30 PC Board Layout Guidance When laying out the printed circuit board, the following checklist should be used to ensure proper operation of the IC. 1) Arrange the power components to reduce the AC loop size consisting of CIN, IN pin, SW pin and the schottky diode. 2) Place input decoupling ceramic capacitor CIN as close to IN pin as possible. CIN is connected power GND with vias or short and wide path. 3) Return FB, COMP and ISET to signal GND pin,and connect the signal GND to power GND at a single point for best noise immunity. Connect exposed pad to power ground copper area with copper and vias. 4) Use copper plane for power GND for best heat dissipation and noise immunity. 5) Place feedback resistor close to FB pin. 6) Use short trace connecting HSB-CHSB-SW loop Figure 6 shows an example of PCB layout. Figure 6: PCB Layout ~ 8 ~

TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type SO Power PAD Package Drawing Pins SPQ Reel Diameter Reel Width W1 A0 B0 K0 P1 W Pin1 Quadrant C8101A 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1 ~ 9 ~

PACKAGE OUTLINE SOP-8EP PACKAGE OUTLINE AND DIMENSIONS SYMBOL DIMENSION IN MILLIMETERS DIMENSION IN INCHES MIN MAX MIN MAX A 1.350 1.700 0.053 0.067 A1 0.000 0.100 0.000 0.004 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 c 0.170 0.250 0.007 0.010 D 4.700 5.100 0.185 0.200 D1 3.202 3.402 0.126 0.134 E 3.800 4.000 0.150 0.157 E1 5.800 6.200 0.228 0.244 E2 2.313 2.513 0.091 0.099 e 1.270 TYP 0.050 TYP L 0.400 1.270 0.016 0.050 θ 0 8 0 8 ~ 10 ~