A Micromechanical Binary Counter with MEMS-Based Digital-to-Analog Converter

Similar documents
Proceedings A Comb-Based Capacitive MEMS Microphone with High Signal-to-Noise Ratio: Modeling and Noise-Level Analysis

An Ultrahigh Sensitive Self-Powered Current Sensor Utilizing a Piezoelectric Connected-In-Series Approach

Energy Income Estimation for Solar Cell Powered Wireless Sensor Nodes

Low-Power Ovenization of Fused Silica Resonators for Temperature-Stable Oscillators

Proceedings Contactless Interrogation System for Capacitive Sensors with Time-Gated Technique

Proceedings Improving the Durability of Screen Printed Conductors on Woven Fabrics for E-Textile Applications

ISSCC 2006 / SESSION 16 / MEMS AND SENSORS / 16.1

IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR FOR LOWER POWER BUDGET

VLSI Layout Based Design Optimization of a Piezoresistive MEMS Pressure Sensors Using COMSOL

Hybrid Vibration Energy Harvester Based On Piezoelectric and Electromagnetic Transduction Mechanism

Advanced Measurements

Active Vibration Control in Ultrasonic Wire Bonding Improving Bondability on Demanding Surfaces

2007-Novel structures of a MEMS-based pressure sensor

Embedded Surface Mount Triaxial Accelerometer

Fabrication of Wireless Micro Pressure Sensor Using the CMOS Process

UNIVERSITY OF UTAH ELECTRICAL ENGINEERING DEPARTMENT LABORATORY PROJECT NO. 3 DESIGN OF A MICROMOTOR DRIVER CIRCUIT

Development of a Package for a Triaxial High-G Accelerometer Optimized for High Signal Fidelity

Differential Amplifier : input. resistance. Differential amplifiers are widely used in engineering instrumentation

Proceedings Piezoelectric Actuators for In-Liquid Particle Manipulation in Microfluidic Applications

Novel piezoresistive e-nose sensor array cell

Modal Analysis of Microcantilever using Vibration Speaker

A BIOMIMETIC SENSING SKIN: CHARACTERIZATION OF PIEZORESISTIVE FABRIC-BASED ELASTOMERIC SENSORS

Underground M3 progress meeting 16 th month --- Strain sensors development IMM Bologna

Sensors & Transducers Published by IFSA Publishing, S. L., 2016

CMOS-Electromechanical Systems Microsensor Resonator with High Q-Factor at Low Voltage

None Operational Amplifier (OPA) Based: Design of Analogous Bandgap Reference Voltage

SPLIT-BOSS DESIGN FOR IMPROVED PERFORMANCE OF MEMS PIEZORESISTIVE PRESSURE SENSOR

INTEGRATED CIRCUITS. AN109 Microprocessor-compatible DACs Dec

Analysis of the dynamic transmission behaviour of piezoelectric film sensors. Andre Zander 1 and Rolf Kumme 2

sensors ISSN

Introduction to Measurement Systems

Industrial Sensors. Proximity Mechanical Optical Inductive/Capacitive. Position/Velocity Potentiometer LVDT Encoders Tachogenerator

Displacement Measurement of Burr Arch-Truss Under Dynamic Loading Based on Image Processing Technology

Proceedings Tuneable Q-Factor of MEMS Cantilevers with Integrated Piezoelectric Thin Films

Figure 1: Layout of the AVC scanning micromirror including layer structure and comb-offset view

Available online at ScienceDirect. Procedia Computer Science 79 (2016 )

Fabrication and Characteristics of an nc-si/c-si Heterojunction MOSFETs Pressure Sensor

Advances In Natural And Applied Sciences Homepage: October; 12(10): pages 1-7 DOI: /anas

B.E. SEMESTER III (ELECTRICAL) SUBJECT CODE: X30902 Subject Name: Analog & Digital Electronics

Special Lecture Series Biosensors and Instrumentation

Wheatstone Bridge. LAB 3: Instrumentation Amplifier ELECTRICAL ENGINEERING 43/100 INTRODUCTION TO DIGITAL ELECTRONICS

Design, Characterization & Modelling of a CMOS Magnetic Field Sensor

MEASUREMENT of physical conditions in buildings

Downloaded from Downloaded from

Instantaneous Baseline Damage Detection using a Low Power Guided Waves System

Electric polarization properties of single bacteria measured with electrostatic force microscopy

MICROFLEX Project: MEMS on New Emerging Smart Textiles/Flexibles

Micro and Smart Systems

Wafer-Level Vacuum-Packaged Piezoelectric Energy Harvesters Utilizing Two-Step Three-Wafer Bonding

5. Transducers Definition and General Concept of Transducer Classification of Transducers

Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process

Wafer Level Vacuum Packaged Out-of-Plane and In-Plane Differential Resonant Silicon Accelerometers for Navigational Applications

Electronic Instrumentation and Measurements

A Three-Dimensional Microdisplacement Sensing System Based on MEMS Bulk-Silicon Technology

Out-of-plane translatory MEMS actuator with extraordinary large stroke for optical path length modulation in miniaturized FTIR spectrometers

Quartz Enhanced Photoacoustic Spectroscopy Based Gas Sensor with a Custom Quartz Tuning Fork

Micro-nanosystems for electrical metrology and precision instrumentation

SUPPLEMENTARY INFORMATION

Emant Pte Ltd BRIDGE SENSOR APPLICATION ADAPTOR FOR EMANT300, EMANT380

MEAS Silicon MEMS Piezoresistive Accelerometer and its Benefits

Proceeding The Alignment Method for Linear Scale Projection Lithography Based on CCD Image Analysis

Optimization of Design Parameters of a Novel MEMS Strain Sensor Used for Structural Health Monitoring of Highway Bridges

Question Paper Code : B.E./B.Tech. DEGREE EXAMINATION, NOVEMBER/DECEMBER Third Semester. Electrical and Electronics Engineering

Signal Conditioning Systems

Characterization of Rotational Mode Disk Resonator Quality Factors in Liquid

MEMS Optical Scanner "ECO SCAN" Application Notes. Ver.0

Strain Gauge Measurement A Tutorial

Proceedings The First Frequency-Modulated (FM) Pitch Gyroscope

Chapter 30: Principles of Active Vibration Control: Piezoelectric Accelerometers

Bandwidth Optimization Design of a Multi Degree of Freedom MEMS Gyroscope

Preliminary study of the vibration displacement measurement by using strain gauge

Next Generation AT-Cut Quartz Crystal Sensing Devices

MEMS for RF, Micro Optics and Scanning Probe Nanotechnology Applications

Ballistocardiograph 1

Driving Strain-Gauge Bridge Sensors with Signal- Conditioning ICs

A COMPARITIVE ANALYSIS ON NANOWIRE BASED MEMS PRESSURE SENSOR

VOLTAGE-to-frequency conversion is desirable for many

The Design and Characterization of an 8-bit ADC for 250 o C Operation

Advanced Measurements

System Level Simulation of a Digital Accelerometer

Part 2: Second order systems: cantilever response

INVENTION DISCLOSURE- ELECTRONICS SUBJECT MATTER IMPEDANCE MATCHING ANTENNA-INTEGRATED HIGH-EFFICIENCY ENERGY HARVESTING CIRCUIT

Chapter 2 Signal Conditioning, Propagation, and Conversion

The AD620 Instrumentation Amplifier and the Strain Gauge Building the Electronic Scale

Passively Self-Tuning Piezoelectric Energy Harvesting System

XY-stage for alignment of optical elements in MOEMS

1. A transducer converts

High resolution measurements The differential approach

A-D and D-A Converters

1. The decimal number 62 is represented in hexadecimal (base 16) and binary (base 2) respectively as

Characterization and Validation of Telemetric Digital based on Hall Effect Sensor

DMS Insert Module MSR 282

A Micropower Front-end Interface for Differential-Capacitive Sensor Systems

A Review of MEMS Based Piezoelectric Energy Harvester for Low Frequency Applications

ET 438B Sequential Digital Control and Data Acquisition Laboratory 4 Analog Measurement and Digital Control Integration Using LabVIEW

Lecture 14 Interface Electronics (Part 2) ECE 5900/6900 Fundamentals of Sensor Design

A Survey of Sensor Technologies for Prognostics and Health Management of Electronic Systems

MONOLITHIC INTEGRATION OF RF MEMS SWITCH AND GAAS-MMIC PROCESS FOR RF SENSING APPLICATIONS

Smartphone Motion Mode Recognition

Miniaturising Motion Energy Harvesters: Limits and Ways Around Them

Transcription:

Proceedings A Micromechanical Binary Counter with MEMS-Based Digital-to-Analog Converter Philip Schmitt 1, *, Hannes Mehner 2 and Martin Hoffmann 1 1 Chair for Microsystems Technology, Ruhr-Universität Bochum, 44801 Bochum, Germany; martin.hoffmann-mst@rub.de 2 X-Fab MEMS Foundry GmbH, 99097 Erfurt, Germany; hannes.mehner@gmx.de * Correspondence: philip.schmitt@rub.de; Tel.: +49-(0)-234-32-28073 Presented at the Eurosensors 2018 Conference, Graz, Austria, 9 12 September 2018. Published: 21 November 2018 Abstract: Autonomous sensors are of interest in all cases where a continuous power source is not available or difficult to realize. Besides harvesting of electrical energy for a complex storage system, it is of interest to directly store an event in a non-electrical storage, but in a way that allows a later electrical read-out. Therefore, a miniaturized micromechanical binary counter is presented, which enables counting of threshold events, such as exceeding temperature limits or high mechanical shocks. An electro-mechanical digital-to-analog converter integrated in the binary counter is demonstrated as an option for monolithic electrical read-out of the mechanically stored information. Keywords: passive microsystem; mechanical digital-to-analog converter; binary counter; passive sensor; MEMS-mechanism, MEMS, MEMS-DAC 1. Introduction For the maintenance of manufacturing plants, macroscopic elapsed-hour counters often roughly indicate upcoming service requirements. Usually the maintenance intervals are based on empiric data, not covering individual machine and component-specific wear. More focused maintenance routines can be achieved by the surveillance of the critical components using autonomous sensors. This allows to register unusual operating conditions, such as vibrations, shocks or the violation of temperature limits. However, the integration of such sensors is often limited by the need of sufficient electrical energy. Since constant environmental energy flow is needed for effective energy harvesting, these systems are not suitable for applications with unstable conditions. As an alternative to energy harvesting, new sensor concepts focus on systems where no electrical energy is needed at all for sensing and storing of the measurement results. In many cases, only the violations of off-limit conditions with corresponding high signal amplitudes are of interest. Therefore, energy can be absorbed directly from these intense signals to trigger a micromechanical system, which senses and saves the measurement results non-electrically. In [1] we presented the basic idea of a 2-bit micromechanical binary counter realized in surface MEMS. Using a ratcheting mechanism, mechanical impulses at the system s entrance are converted into mechanically saved binary counts. In this contribution, we present an optimized version of the counter, featuring a MEMS-based digital-to-analog converter, that allows to convert mechanically saved binary code into an analog voltage. The concept presented, allows to mechanically count any physical threshold violation without the need of electrical energy. For Proceedings 2018, 2, 807; doi:10.3390/proceedings2130807 www.mdpi.com/journal/proceedings

Proceedings 2018, 2, 807 2 of 5 an electronical read-out of the mechanical storage, the saved binary code is converted into an analog voltage, making the system suitable for the connection to RFID interfaces. 2. System Design 2.1. Binary Counting Mechanism The micromechanical binary counter is based on a two-dimensional mechanism, allowing its fabrication in surface MEMS technology. Figure 1 shows a 1-bit system with the main mechanical components. By connecting multiple of these bi-stable elements (referred to as bits) in a serial arrangement, an n-bit mechanical counter can be created. Each bit can be set in two stable states, namely a low (0) and a high (1) state. The low state is defined as the state whereas the guiding springs at the bit-element are deflected and the ratchet is hooked to the bit-element. Figure 1. SEM image of a 1-bit mechanical binary counter which is set in state high (1). To increment the counter, a mechanical impulse at the system s entrance, such as a mechanical shock is needed. The least significant bit (LSB) connected directly to the entrance (bit 0) is then provoked to change its state from low (0) to high (1). If, for a next impulse, the LSB changes its state again from high to low, the subsequent bit in the serial arrangement is triggered to change its state, too. Similar to a shifting register, impulses at the system's entrance are shifted from the LSB through the serial arrangement to the most significant bit allowing a mechanical count on a binary basis. For a better understanding of the mechanical transition process from one state to the next one, a schematic description of the transition from 0-0 to 1-0 for a 2-bit counter is provided in Figure 2. Figure 2. Schematic explanation showing the mechanical state transition when applying a mechanical impulse at the entrance: (a) transition from 0-0 to 0-1; (b) transition from 0-1 to 1-0.

Proceedings 2018, 2, 807 3 of 5 2.2. MEMS-Based Digital-to-Analog Converter MEMS-based digital-to-analog converters (DAC) are known for converting electrical binary code into a mechanical displacement or force [2,3]. The inverse conversion from a mechanical binary signal to an analog electrical signal is presented in this contribution. The working principle of the cross-domain DAC is illustrated in Figure 3. Piezoresistive strain gauges with different resistance values are used as transducers. The strain gauges are positioned at the guiding springs of each bit. Depending on the bit-state, the correlating strain gauge can be either strained or relaxed. Figure 3. Schematic of the MEMS digital-to-analog converter using a quarter Wheatstone bridge. To eliminate cross-sensitivity to temperature changes, the strain gauges are arranged in a quarter Wheatstone bridge. The basic resistances of each strain gauge strictly depend on the associated bit position i, which can be determined by: Note that the value of the reference resistors within the Wheatstone bridge is the combined resistance value of all strain gauges that are connected in series. Assuming that the maximum deformations ε t and the gauge factor k of all strain gauges are identical, the magnitude of the resistance change R i depends only on the bit-position i, due to the associated basic resistance: The ratio of the bridge voltage Uout to the input voltage Uin and therefore the digital-toanalog conversion law for the modified Wheatstone bridge can be easily determined by: (1) (2) (3) Here z i takes the Boolean status 0 or 1 of the respective bit. Since for the binary counter, strained guiding springs indicate the low state, the value for z needs to be negated first. This means that if the counter is set to the maximum binary count of 11 1, none of the guiding springs are strained, therefore z i = 0, and Uout becomes zero. For the 2-bit DAC as shown in Figure 2, the status table is shown in Table 1.

Proceedings 2018, 2, 807 4 of 5 Table 1. Status table according to Equation (2) for a 2-bit digital-to-analog converter arranged in a quarter Wheatstone bridge. Binary Count Status of Guiding Spring Resistance Change Voltage Ratio Bit 1 Bit 0 Bit 1 Bit 0 ΔR1 Uout/Uin 0 0 deflected deflected 2 3 4 3 R0 0 1 deflected relaxed 2 0 2 4 3 R0 1 0 relaxed deflected 0 1 4 3 R0 1 1 relaxed relaxed 0 0 0 4 3 R 3. Experiment The microsystem, as shown in Figure 4a, was fabricated utilizing a standard silicon-oninsulator substrate (SOI). For the realization of the piezo resistive strain gauges, P-doped polycrystalline silicon with a gauge factor of 15.8 were deposited by LPCVD. For the electrical characterization, the output of the MEMS-DAC was connected to an instrumentation amplifier with an amplification factor of 100. The amplified signal was then analyzed using an oscilloscope. After adjusting the initial offset with the instrumentation amplifier, the counter was successively incremented manually with a tungsten needle clamped to a piezo linear stage. Figure 4b shows the measured digital-to-analog conversion without amplification. The modelled values are obtained from Equations (2) and (3), assuming a deformation of εt = 0.03% and a basic resistance of R0 = 196 kω. The variation shown between the model and the measurement results at count 0 and 2 are assumed to be based on a variation of the total strain at the guiding springs of bit 0 and bit 1. 0 Figure 4. MEMS-DAC: (a) SEM image of a fabricated 2-bit binary counter with MEMS-DAC realized with strain gauges in a quarter bridge; (b) Measurement results of the DAC. 4. Summary and Conclusions We presented a micromechanical binary counter which is suitable for counting physical threshold events by applying mechanical impulses at the entrance of the system. For the first time, we present a MEMS-based digital-to-analog converter integrated in a mechanical binary counter that allows to convert mechanically saved binary code into an analog voltage. With first experimental results the proof of principle for this concept of a cross-domain DAC was demonstrated.

Proceedings 2018, 2, 807 5 of 5 Acknowledgments: The microsystems have been fabricated at the Institute of Micro- and Nanotechnologies (IMN MacroNano ) at Technische Universität Ilmenau. The authors thank all colleagues at the cleanroom who contributed to this work and those who contributed with fruitful discussions. Conflicts of Interest: The authors declare no conflict of interest. References 1. Mehner, H.; Schwebke, S.; Leopold, S.; Hoffmann, M. Passive microsensor for binary counting of numerous threshold events. In Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, Proceedings of the SPIE Microtechnologies, Barcelona, Spain, 4 6 May 2015; p. 95170Z, doi:10.1117/12.2178726. 2. Toshiyoshi, H.; Kobayashi, D.; Mita, M.; Hashiguchi, G.; Fujita, H.; Endo, J.; Wada, Y. Microelectromechanical digital-to-analog converters of displacement for step motion actuators. J. Microelectromechan. Syst. 2000, 9, 218 225. 3. Zhou, G.; VJ, L.; Tay, F.E.; Chau, F.S. Micromechanical digital-to-analog converter for out-of-plane motion. J. Microelectromechan. Syst. 2004, 13, 770 778. 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).