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eatures Package in 8mm tape on 7 diameter reel. Compatible with automatic placement equipment. Compatible with infrared and vapor phase reflow solder process. Mono-color type. Pb-free. The product itself will remain within RoHS compliant version. Compliance with EU REACH. Compliance Halogen ree.(br <9 ppm,cl <9 ppm, Br+Cl < 15 ppm). Description The SMD LED is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. Besides, lightweight makes them ideal for miniature applications. etc. Applications Backlighting in dashboard and switch. Telecommunication: indicator and backlighting in telephone and fax. lat backlight for LCD, switch and symbol. General use. 1 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Device Selection Guide Code Chip Materials Emitted Color Resin Color R7 AlGaInP Dark-Red BH InGaN Blue Water Clear Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Code Rating Unit Reverse Voltage V R 5 V R7 25 orward Current I BH 25 ma Peak orward Current (Duty 1/ @1KHz) I P R7 6 BH ma R7 6 Power Dissipation Pd mw BH 95 R7 2 Electrostatic Discharge ESD HBM BH 15 V Operating Temperature T opr -4 ~ +85 Storage Temperature Tstg -4 ~ +9 Soldering Temperature Tsol Reflow Soldering : 26 for sec. Hand Soldering : 35 for 3 sec. 2 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Code Min. Typ. Max. Unit Condition R7 45. ----- 112 Luminous Intensity Iv mcd BH 36. ----- 9. Viewing Angle 2θ 1/2 ----- 13 ----- deg Peak Wavelength Dominant Wavelength Spectrum Bandwidth Radiation λp λd λ R7 ----- 639 ----- BH ----- 468 ----- R7 625.5 ----- 637.5 BH 464.5 ----- 476.5 R7 ----- 2 ----- BH ----- 25 ----- R7 1.7 2. 2.4 orward Voltage V BH 2.7 3.3 3.7 Reverse Current I R R7 ----- ----- BH ----- ----- 5 Note: 1.Tolerance of Luminous Intensity: ±11% 2.Tolerance of Dominant Wavelength ±1nm 3. Tolerance of orward Voltage: ±.V nm nm nm V I =2mA μa V R =5V 3 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

R7 Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition P 45. 72. Q 72. 112 mcd I =2mA BH Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition 1 36. 57. 2 57. 9. Bin Range Of Dom. Wavelength mcd I =2mA Bin Code Min. Max. Unit Condition A9 464.5 467.5 A 467.5 47.5 A11 47.5 473.5 A12 473.5 476.5 Note: 1.Tolerance of Luminous Intensity: ±11% 2.Tolerance of Dominant Wavelength ±1nm nm I =2mA 4 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Typical Electro-Optical Characteristics Curves R7 Relative luminous intensity (%) Spectrum Distribution Ta=25 C 75 5 25 5 55 6 65 7 Wavelength λ (nm) I (ma) orward Current 5 4 3 25 2 1.2 orward Current vs. orward Voltage Ta=25 C 1.6 2. 2.4 2.8 3. orward Voltage V (V) Relative luminous intensity (%) Luminous Intensity vs. Ambient Temperature 1-6 -4-2 2 4 6 8 Ambient Temperature Ta ( C) Relative luminous intensity (%) 1 Luminous Intensity vs. orward Current Ta=25 C orward Current I (ma) orward Current I (ma) 5 4 3 25 2 orward Current Derating Curve 2 4 6 85 Ambient Temperature Ta ( C) 1..9.8.7 Radiation Diagram.5.3.1.2.4 Ta=25 C 2 3.6 4 5 6 7 8 9 5 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Typical Electro-Optical Characteristics Curves BH Relative luminous intensity (%) 75 5 25 Spectrum Distribution Ta=25 C orward Current 4 45 5 55 6 2.6 Wavelength λ (nm) I (ma) 5 4 3 25 2 orward Current vs. orward Voltage Ta=25 C 3. 3.4 3.8 4.2 4.5 orward Voltage V (V) Relative luminous intensity (%) 1-6 Luminous Intensity vs. Ambient Temperature -4-2 2 4 6 8 Relative luminous intensity (%) 1 Luminous Intensity vs. orward Current Ta=25 C 1 2 Ambient Temperature Ta ( C) orward Current I (ma) orward Current I (ma) 5 4 3 25 2 orward Current Derating Curve 2 4 6 85 Ambient Temperature Ta ( C) 1..9.8.7 Radiation Diagram.5.3.1.2.4 Ta=25 C 2 3.6 4 5 6 7 8 9 6 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Package Dimension Suggested pad dimension is just for reference only. Please modify the pad dimension based on individual need. Note: Tolerances unless mentioned ±.1mm. Unit = mm 7 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Label Explanation CPN: Customer s Product Number P/N: Product Number QTY: Packing Quantity CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates & Dom. Wavelength Rank RE: orward Voltage Rank LOT No: Lot Number Reel Dimensions Note: The tolerances unless mentioned is ±.1mm,Unit = mm 8 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Carrier Tape Dimensions: Loaded quantity 2 PCS per reel Note: The tolerances unless mentioned is ±.1mm,Unit = mm Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label 9 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Precautions or Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 3 or less and 9%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 3 or less and 6% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 6±5 for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile Above255 C 3sec.Max. 3 C/sec.Max. Pre-heating 15~2 C 6~12sec. Above 217 C 6~15sec. 26 C Max. sec. Max. 6 C/sec.Max. 3.2 Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. 4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 35 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

Application Restrictions High reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment may require different product. If you have any concerns, please contact Everlight Americas before using this product in your application. This specification guarantees the quality and performance of the product as an individual component. Do not use this product beyond the specification described in this document. 11 Copyright 2, Everlight Americas Inc. All Rights Reserved. Release Date : 8-Dec-26. Issue No: 1 Rev.1

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