TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC

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TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62001P,TD62001AP,TD62001F,TD62001AF,TD62002P TD62002AP,TD62002F,TD62002AF,TD62003P,TD62003AP,TD62003F TD62003AF,TD62004P,TD62004AP,TD62004F,TD62004AF 7CH DARLINGTON SINK DRIER The TD62001P / AP / F / AF Series are high voltage, high current darlington drivers comprised of seven NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. FEATURES Output current (single output) 500 ma MAX. High sustaining voltage output 35 MIN. (TD62001P / F Series) 50 MIN. (TD62001AP / AF Series) Output clamp diodes Inputs compatible with various types of logic Package Type P, AP : DIP 16 pin Package Type F, AF : SOP 16 pin TYPE INPUT BASE RESISTOR DESIGNATION TD62001P / AP / F / AF External General Purpose TD62002P / AP / F / AF 10.5 kω + 7 Zenner diode 14~25 PMOS TD62003P / AP / F / AF 2.7 kω TTL, 5 CMOS TD62004P / AP / F / AF 10.5 kω 6~15 PMOS, CMOS Weight DIP16 P 300 2.54A : 1.11 g (Typ.) SOP16 P 225 1.27 : 0.16 g (Typ.) PIN CONNECTION (TOP IEW) 1

SCHEMATICS (EACH DRIER) TD62001P / AP / F / AF TD62002P / AP / F / AF TD62003P / AP / F / AF TD62004P / AP / F / AF Note: The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25 C) Output Sustaining oltage CHARACTERISTIC SYMBOL RATING UNIT P, F CE (SUS) 0.5~35 0.5~50 Output Current I OUT 500 ma / ch Input oltage IN (Note 1) 0.5~30 Input Current I IN (Note 2) 25 ma Clamp Diode Reverse oltage P, F R 35 50 Clamp Diode Forward Current I F 500 ma Power Dissipation Operating Temperature P 1.0 AP 1.47 P D F, AF 0.54 / 0.625 (Note 3) P T opr 30~75 AP, F, AF 40~85 Storage Temperature T stg 55~150 C Note 1: Except TD62001P / AP / F / AF Note 2: Only TD62001P / AP / F / AF Note 3: On glass epoxy PCB (30 30 1.6 mm Cu 50%) W C 2

RECOMMENDED OPERATING CONDITIONS (Ta = 40~85 C and Ta = 30~75 C for only Type P) Output Sustaining oltage Output Current Input oltage Input oltage (Output On) Input oltage (Output Off) CHARACTERISTIC SYMBOL CONDITION MIN TYP. MAX UNIT P, F CE (SUS) 0 35 0 50 AP P F, AF Except TD62001P / AP / F / AF I OUT T pw = 25 ms 7 Circuits Ta = 85 C T j = 120 C Duty = 10% 0 370 Duty = 50% 0 130 Duty = 10% 0 295 Duty = 50% 0 95 Duty = 10% 0 233 Duty = 50% 0 70 IN 0 24 TD62002 14.5 24 TD62003 IN (ON) I OUT = 400 ma h FE = 800 2.8 24 TD62004 6.2 24 TD62001 0 0.6 TD62002 IN (OFF) 0 7.4 TD62003 0 0.7 TD62004 0 1.0 Input Current Only TD62001 I IN 0 10 ma Clamp Diode Reverse oltage P, F R 35 50 Clamp Diode Forward Current I F 350 ma Power Dissipation P 0.6 Ta = 85 C AP P D 0.76 AF, F Ta = 85 C (Note) 0.325 Note: On glass epoxy PCB (30 30 1.6 mm Cu 50%) ma / ch W 3

ELECTRICAL CHARACTERISTICS (Ta = 25 C unless otherwise noted) Output Leakage Current CHARACTERISTIC F P SYMBOL TEST CIR CUIT I CEX 1 Collector Emitter Saturation oltage CE (sat) 2 TEST CONDITION MIN TYP. MAX UNIT CE = 50, Ta = 25 C 50 CE = 50, Ta = 85 C 100 CE = 35, Ta = 25 C 50 CE = 35, Ta = 85 C 100 CE = 35, Ta = 25 C 50 CE = 35, Ta = 75 C 100 I OUT = 350 ma, I IN = 500 µa 1.3 1.6 I OUT = 200 ma, I IN = 350 µa 1.1 1.3 I OUT = 100 ma, I IN = 250 µa 0.9 1.1 DC Current Transfer Ratio h FE 2 CE = 2, I OUT = 350 ma 1000 Input Current (Output On) Input Current (Output Off) Input oltage (Output On) Clamp Diode Reverse Current TD62002 IN = 20, I OUT = 350 ma 1.1 1.7 TD62003 I IN (ON) 3 IN = 2.4, I OUT = 350 ma 0.4 0.7 TD62004 IN = 9.5, I OUT = 350 ma 0.8 1.2 P I IN (OFF) 4 I OUT = 500 µa, Ta = 75 C 50 65 AP, F, AF I OUT = 500 µa, Ta = 85 C 50 65 TD62002 TD62003 TD62004 F P IN (ON) 5 I R 6 CE = 2 h FE = 800 I OUT = 350 ma 13.7 I OUT = 200 ma 11.4 I OUT = 350 ma 2.6 I OUT = 200 ma 2.0 I OUT = 350 ma 4.7 I OUT = 200 ma 4.4 R = 50, Ta = 25 C 50 R = 50, Ta = 85 C 100 R = 35, Ta = 25 C 50 R = 35, Ta = 85 C 100 R = 35, Ta = 25 C 50 R = 35, Ta = 75 C 100 Clamp Diode Forward oltage F 7 I F = 350 ma 2.0 Input Capacitance C IN 15 pf Turn On Delay Turn Off Delay P, F P, F t ON 8 t OFF 8 OUT = 35, R L = 87.5 Ω C L = 15 pf OUT = 50, R L = 125 Ω C L = 15 pf OUT = 35, R L = 87.5 Ω C L = 15 pf OUT = 50, R L = 125 Ω C L = 15 pf 0.1 0.1 0.2 0.2 µa ma µa µa µs 4

TEST CIRCUIT 1. I CEX 2. CE (sat), h FE 3. IIN (ON) 4. I IN (OFF) 5. IN (ON) 6. I R 7. F 5

8. t ON, t OFF Note 1: Pulse width 50 µs, duty cycle 10% Output impedance 50 Ω, t r 5 ns, t f 10 ns Note 2: See below INPUT CONDITION TYPE NUMBER R1 IH TD62001P / AP / F / AF 2.7 kω 3 TD62002P / AP / F / AF 0 13 TD62003P / AP / F / AF 0 3 TD62004P / AP / F / AF 0 8 Note 3: C L includes probe and jig capacitance. PRECAUTIONS for USING This IC does not include built-in protection circuits for excess current or overvoltage. If this IC is subjected to excess current or overvoltage, it may be destroyed. Hence, the utmost care must be taken when systems which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short circuit between outputs, air contamination fault, or fault by improper grounding. 6

7

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9

10

PACKAGE DIMENSIONS DIP16 P 300 2.54A Unit : mm Weight: 1.11 g (Typ.) 11

PACKAGE DIMENSIONS SOP16 P 225 1.27 Unit : mm Weight: 0.16 g (Typ.) 12

RESTRICTIONS ON PRODUCT USE TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability Handbook etc.. The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ( Unintended Usage ). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer s own risk. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. The information contained herein is subject to change without notice. 000707EBA 13