Standard SMD LED PLCC-2

Similar documents
Standard SMD LED PLCC-2

Standard SMD LED PLCC-2

Bicolor SMD LED FEATURES APPLICATIONS. (V) (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Low Current SMD LED PLCC-2

High Intensity SMD LED PLCC-2

Low Current SMD LED PLCC-2

Bicolor SMD LED PLCC-4

Low Current SMD LED PLCC-2

Standard SMD LED in PLCC-2

Standard SMD LED PLCC-2

Standard SMD LED PLCC-2

Reverse Gullwing SMD LED Red

Power SMD LED PLCC-2

Power SMD LED PLCC-2

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Standard Mini SMD LED

Bicolor SMD LED PLCC-4

Highbright 0603 ChipLED

Ultrabright 0603 SMD LED

Ultrabright 0402 ChipLED

VLMH310., VLMO310., VLMY310., VLMG310., VLMP310. Standard SMD LED PLCC-2

VLMS333.., VLMR333.., VLMK333.., VLMO333.., VLMY Power SMD LED PLCC-2

Mini SMD LED FEATURES APPLICATIONS. FORWARD WAVELENGTH INTENSITY at I F (nm) at I F

Power Mini SMD LED FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Highbright 0603 ChipLED

Low Current 0603 SMD LED

FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Standard SMD LED PLCC-2

Standard Mini SMD LED

Power SMD LED PLCC-2

Standard SMD LED PLCC-2

VLMS233.., VLMR233.., VLMK233.., VLMO233.., VLMY Power Mini SMD LED

High Intensity SMD LED

Multi SMD LED RGB FEATURES APPLICATIONS MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Power Mini SMD LED FEATURES APPLICATIONS

Low Current Mini SMD LED

Standard 0603 SMD LED

Power SMD LED PLCC-4

Multi SMD LED RGB FEATURES APPLICATIONS. WAVELENGTH (nm) at I F (ma)

High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero

High Speed Infrared Emitting Diode, 830 nm, GaAlAs Double Hetero

VLMS333.., VLMR333.., VLMK333.., VLMO333.., VLMY333.. Power SMD LED PLCC-2

High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero

High Intensity SMD LED

Power SMD LED PLCC-4

High Speed Infrared Emitting Diode, 940 nm, Surface Emitter Technology

High Speed Infrared Emitting Diode, 890 nm, GaAlAs, DH

High Speed Infrared Emitting Diode, 940 nm, GaAlAs Double Hetero

Standard SMD LED PLCC-2

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, MQW

High Intensity LED in Ø 3 mm Tinted Diffused Package

High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology

UV SMD LED with Silicone Lens

UV SMD LED with Silicone Lens

UV SMD LED with Silicone Lens

Mini SMD LED FEATURES APPLICATIONS. WAVELENGTH FORWARD VOLTAGE (mcd) at I F (nm) (V) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

UV SMD LED with Silicone Lens

High Speed Infrared Emitting Diode, 940 nm, GaAlAs, MQW

High Speed Infrared Emitting Diode, 850 nm, Surface Emitter Technology

TELUX LED FEATURES APPLICATIONS. WAVELENGTH (nm)

High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology

Standard 0603 SMD LED

Universal LED in Ø 3 mm Tinted Diffused Package

Dome Lens SMD LED FEATURES APPLICATIONS. WAVELENGTH (nm) at I F (ma)

High Brightness LED, Ø 5 mm Untinted Non-Diffused Package

Universal LED in Ø 5 mm Tinted Diffused Package

Low Current LED in Ø 5 mm Tinted Diffused Package

High Efficiency Blue LED in Ø 3 mm Tinted Diffused Package

Bicolor Symbol LED in 2.5 mm x 5 mm Untinted Top-Diffused Package

High Intensity LED in Ø 3 mm Tinted Non-Diffused Package

High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology

Silicon PIN Photodiode

Little Star 1 W Power SMD LED White

Standard SMD LED PLCC-2

Ambient Light Sensor

Dual Color Emitting Diodes, 660 nm and 940 nm

Silicon PIN Photodiode

Low Current LED in Ø 3 mm Tinted Diffused Package

Silicon PIN Photodiode

Silicon PIN Photodiode

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Dome Lens SMD LED FEATURES APPLICATIONS. WAVELENGTH (nm) at I F (ma)

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

Ambient Light Sensor

High Intensity LED, Ø 5 mm Untinted Non-Diffused Package

Silicon PIN Photodiode

High Efficiency LED in Ø 3 mm Tinted Diffused Package

High Power Infrared Emitting Diode, 850 nm, Surface Emitter Technology

VLMS233.., VLMR233.., VLMK233.., VLMO233.., VLMY Power Mini SMD LED

High Efficiency LED in Ø 3 mm Tinted Diffused Package

High Speed Infrared Emitting Diodes, 850 nm, Surface Emitter Technology

High Power Infrared Emitting Diode, 940 nm, GaAlAs, MQW

High Efficiency LED in Ø 3 mm Clear Package

High Intensity LED, Ø 5 mm Clear Package

TLPR5600, TLPH5600, TLPY5600, TLPG5600, TLPP5600 Sideview LED, Ø 5 mm Tinted Diffused Package

Ultrabright LED, Ø 5 mm Untinted Non-Diffused Package

High Speed Infrared Emitting Diode, 850 nm, GaAlAs, DH

Silicon PIN Photodiode

High Power Infrared Emitting Diode, 940 nm, Surface Emitter Technology

High Speed Infrared Emitting Diodes, 940 nm, GaAlAs, DH

Transcription:

Standard SMD LED PLCC-2 DESCRIPTION 948553 This device has been designed for applications requiring narrow brightness and color selection. The package of this device is the PLCC-2. It consists of a lead frame which is embedded in a white thermoplast. The reflector inside this package is filled up with clear epoxy. PRODUCT GROUP AND PACKAGE DATA Product group: LED Package: SMD PLCC-2 Product series: standard Angle of half intensity: ± 6 FEATURES SMD LED with exceptional brightness Luminous intensity categorized Compatible with automatic placement equipment EIA and ICE standard package Compatible with IR reflow, vapor phase and wave solder processes according to CECC 82 and J-STD-2 Available in 8 mm tape Low profile package Non-diffused lens: excellent for coupling to light pipes and backlighting Low power consumption Luminous intensity ratio in one packaging unit I Vmax. /I Vmin..6 Preconditioning according to JEDEC level 2a ESD-withstand voltage: up to 2 kv according to JESD22-A4-B AEC-Q qualified Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 APPLICATIONS Automotive: backlighting in dashboards and switches Telecommunication: indicator and backlighting in telephone and fax Indicator and backlight for audio and video equipment Indicator and backlight in office equipment Flat backlight for LCDs, switches, and symbols General use PARTS TABLE PART COLOR LUMINOUS INTENSITY WAVELENGTH FORWARD VOLTAGE (mcd) at I F (nm) at I F (V) at I F (ma) (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX. TECHNOLOGY VLMD3-GS8 Red.2 22 - - 648 - -.8 2.2 2 GaAlAs on GaAs VLMD3-GS8 Red.2 22 - - 648 - -.8 2.2 2 GaAlAs on GaAs VLMD3-GS8 Red 8 23 45-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3-GS8 Red 8 23 45-648 - -.8 2.2 2 GaAlAs on GaAs VLMD35-GS8 Red.2 22 28-648 - -.8 2.2 2 GaAlAs on GaAs VLMD35-GS8 Red.2 22 28-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3L2N-GS8 Red 4 22 35.5-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3L2N-GS8 Red 4 22 35.5-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3L2P-GS8 Red 4 22 56-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3L2P-GS8 Red 4 22 56-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3M2P-GS8 Red 22.4 25 56-648 - -.8 2.2 2 GaAlAs on GaAs VLMD3M2P-GS8 Red 22.4 25 56-648 - -.8 2.2 2 GaAlAs on GaAs Rev..8, -Aug-7 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

ABSOLUTE MAXIMUM RATINGS (T amb = 25 C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage () V R 6 V DC forward current T amb 6 C I F 3 ma Surge forward current t p μs I FSM.5 A Power dissipation P V mw Junction temperature T j C Operating temperature range T amb -4 to + C Storage temperature range T stg -4 to + C Soldering temperature t 5 s T sd 26 C Thermal resistance junction-to-ambient Mounted on PC board (pad size > 6 mm 2 ) R thja 4 K/W Note () Driving LED in reverse direction is suitable for short term application OPTICAL AND ELECTRICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified), RED PARAMETER TEST CONDITION PART SYMBOL MIN. TYP. MAX. UNIT VLMD3 I V.2 22 - mcd VLMD3 I V 8 23 45 mcd Luminous intensity () I F = ma VLMD35 I V.2 22 28 mcd VLMD3L2N I V 4 22 35.5 mcd VLMD3L2P I V 4 22 56 mcd VLMD3M2P I V 22.4 25 56 mcd Dominant wavelength I F = ma λ d - 648 - nm Peak wavelength I F = ma λ p - 65 - nm Angle of half intensity I F = ma ϕ - ± 6 - deg Forward voltage I F = 2 ma V F -.8 2.2 V Reverse voltage I R = μa V R 6 - - V Junction capacitance V R =, f = MHz C j - 7 - pf Temperature coefficient of V F I F = 2 ma TC VF - -.8 - mv/k Temperature coefficient of λ d I F = ma TCλ d -.5 - nm/k Note () In one packing unit I Vmax. /I Vmin..6 LUMINOUS INTENSITY CLASSIFICATION GROUP LIGHT INTENSITY (mcd) STANDARD OPTIONAL MIN. MAX. J 4.5 5.6 2 5.6 7. K 7. 9 2 9.2 L.2 4 2 4 8 M 8 22.4 2 22.4 28 N 28 35.5 2 35.5 45 P 45 56 Note Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ± %. The above type numbers represent the order groups which include only a few brightness groups. Only one group will be shipped on each reel (there will be no mixing of two groups on each reel). In order to ensure availability, single brightness groups will not be orderable. In a similar manner for colors where wavelength groups are measured and binned, single wavelength groups will be shipped on any one reel. In order to ensure availability, single wavelength groups will not be orderable CROSSING TABLE VISHAY VLMD3L2N VLMD3L2P VLMD3M2P OSRAM LHT674-L2N LHT674-L2P LHT674-M2P Rev..8, -Aug-7 2 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

TYPICAL CHARACTERISTICS (T amb = 25 C, unless otherwise specified) 6.2 I F - Forward Current (ma) 5 4 3 2 I rel - Relative Luminous Intensity..8.6.4.2 red 2 4 6 8 6 62 64 66 68 7 95 95 T amb - Ambient Temperature ( C) 95 8 - Wavelength (nm) Fig. - Maximum Permissible Forward Current vs. Ambient Temperature Fig. 4 - Relative Luminous Intensity vs. Wavelength t p /T =.5 T amb < 6 C red I F - Forward Current (ma).2.5 DC...2.5 I F - Forward Current (ma).. 95 9985 t p - Pulse Length (ms).5 2 2.5 3 95 4 V F - Forward Voltage (V) Fig. 2 - Permissible Pulse Forward Current vs. Pulse Length Fig. 5 - Forward Current vs. Forward Voltage I V rel - Relative Luminous Intensity 95 39..9.8.7.6.4.2 2 3 4 5 6 7 8 ϕ - Angular Displacement I V rel - Relative Luminous Intensity super red.. 6638 I F - Forward Current (ma) Fig. 3 - Relative Luminous Intensity vs. Angular Displacement Fig. 6 - Relative Luminous Intensity vs. Forward Current Rev..8, -Aug-7 3 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

I V rel - Relative Luminous Intensity 2. super red.6.2.8.4. 2 4 6 8 6635 T amb - Ambient Temperature ( C) V F - Change of Forward Voltage (mv) 2 5 5-5 - - 5-2 - 25-3 2 4 6 8 6636 T amb - Ambient Temperature ( C) Fig. 7 - Relative Luminous Intensity vs. Ambient Temperature Fig. 9 - Change of Forward Voltage vs. Ambient Temperature - Change of Dom. Wavelength (nm) 5 4 3 2 - - 2 d - 3 2 4 6 8 6637 T amb - Ambient Temperature ( C) Fig. 8 - Change of Dominant Wavelength vs. Ambient Temperature PACKAGE DIMENSIONS in millimeters Mounting Pad Layout.2 area covered with solder resist 2.6 (2.8) 4.6 (.9) 4 245 Rev..8, -Aug-7 4 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

METHOD OF TAPING / POLARITY AND TAPE AND REEL SMD LED (VLM.3-SERIES) Vishay s LEDs in SMD packages are available in an antistatic 8 mm blister tape (in accordance with DIN IEC 4 (CO) 564) for automatic component insertion. The blister tape is a plastic strip with impressed component cavities, covered by a top tape. Adhesive tape Blister tape REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS8 (= 8 PCS) PREFFERED Identification Label: Vishay type group tape code production code quantity 32 329 2 4.5 3.5 2.5.5 3. 2.75 4.4 max..4 8.4 62.5 6. 8857 Component cavity TAPING OF 22972 SOLDERING PROFILE Fig. 2 - Reel Dimensions - GS8 Anode 3.5 3. 2.2 2. 3 IR Reflow Soldering Profile for Lead (Pb)-Free Soldering Preconditioning according to JEDEC level 2a Cathode 3.6 3.4.85.65 5.75 5.25 8.3 7.7 4. 3.6 Temperature ( C) 25 2 5 255 C 24 C 27 C max. 2 s max. 3 s max. s max. 26 C 245 C.6.4 4. 3.9 4. 3.9.25 5 max. ramp up 3 C/s max. ramp down 6 C/s 2.5.95 Fig. - Tape Dimensions in mm for PLCC-2 REEL PACKAGE DIMENSION IN MILLIMETERS FOR SMD LEDS, TAPE OPTION GS8 (= 5 PCS) Identification Label: Vishay type group tape code production code quantity 8 78 2 4.5 3.5 2.5.5 3. 2.75 4.4 max. Fig. - Reel Dimensions - GS8. 9. 6 25 63.5 6.5 94 8665 5 5 2 25 3 Time (s) 9885 max. 2 cycles allowed Fig. 3 - Vishay Lead (Pb)-free Reflow Soldering Profile (according to J-STD-2) Temperature ( C) 3 5 s 25 235 C to 26 C first wave 2 5 5 TTW Soldering (according to CECC82) ca. 2 K/s C to 3 C 2 K/s forced cooling lead temperature second wave full line: typical dotted line: process limits ca. 2 K/s ca. 5 K/s 5 5 2 25 948626- Time (s) Fig. 4 - Double Wave Soldering of Opto Devices (all Packages) Rev..8, -Aug-7 5 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

BAR CODE PRODUCT LABEL A 6 VISHAY B C D E F G 262 A) Type of component B) Manufacturing plant C) SEL - selection code (bin): e.g.: L2 = code for luminous intensity group D) Date code year / week E) Day code (e.g. 3: Wednesday) F) Batch no. G) Total quantity H) Company code DRY PACKING The reel is packed in an anti-humidity bag to protect the devices from absorbing moisture during transportation and storage. Aluminum bag H Label 37 RECOMMENDED METHOD OF STORAGE Dry box storage is recommended as soon as the aluminum bag has been opened to prevent moisture absorption. The following conditions should be observed, if dry boxes are not available: Storage temperature C to 3 C Storage humidity 6 % RH max. After more than 672 h under these conditions moisture content will be too high for reflow soldering. In case of moisture absorption, the devices will recover to the former condition by drying under the following condition: 92 h at 4 C + 5 C / - C and < 5 % RH (dry air / nitrogen) or 96 h at 6 C + 5 C and < 5 % RH for all device containers or 24 h at C + 5 C not suitable for reel or tubes. An EIA JEDEC standard JESD22-A2 level 2a label is included on all dry bags. CAUTION This bag contains MOISTURE SENSITIVE DEVICES L E V E L. Shelf life in sealed bag 2 months at <4 C and < 9% relative humidity (RH) 2. After this bag is opened devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. 26 C) must be: a) Mounted within 672 hours at factory condition of < 3 C/6%RH or b) Stored at <% RH. 3. Devices require baking before mounting if: a) Humidity Indicator Card is >% when read at 23 C + 5 C or b) 2a or 2b is not met. 2a Reel 4. If baking is required, devices may be baked for: 92 hours at 4 C + 5 C/- C and <5%RH (dry air/nitrogen) or 96 hours at 6±5 o Cand <5%RH For all device containers or 24 hours at ±5 C Not suitable for reels or tubes Bag Seal Date: (If blank, see bar code label) Note: LEVEL defined by EIA JEDEC Standard JESD22-A3 9786 5973 FINAL PACKING The sealed reel is packed into a cardboard box. A secondary cardboard box is used for shipping purposes. ESD PRECAUTION Example of JESD22-A2 level 2a label Proper storage and handling procedures should be followed to prevent ESD damage to the devices especially when they are removed from the antistatic shielding bag. Electrostatic sensitive devices warning labels are on the packaging. VISHAY SEMICONDUCTORS STANDARD BAR CODE LABELS The standard bar code labels are printed at final packing areas. The labels are on each packing unit and contain specific data. Rev..8, -Aug-7 6 Document Number: 835 ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?9

Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. 27 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED Revision: 8-Feb-7 Document Number: 9