ESDCANxx-2BLY. Automotive dual-line TVS in SOT23-3L for CAN bus. Datasheet. Features. Applications. Description

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Datasheet Automotive dual-line TVS in SOT23-3L for CAN bus Features AEC-Q101 qualified Dual-line ESD and EOS protection Breakdown voltage: V BR : 25 V : 27 V : 27.5 V : 38 V Bidirectional device Max pulse power up to 230 W (8/20 μs) 1 ESDCANxx-2BLY 2 Product status link 3,,, Low clamping factor V CL / V BR Low leakage current ECOPACK 2 ROHS compliant component Complies with the following standards UL94, V0 J-STD-020 MSL level 1 IPC7531 footprint and JEDEC registered package ISO 16750-2 (Jump start and reversed battery test for 12 V system) ISO 10605 - C = 150 pf, R = 330 Ω, exceeds level 4: ±30 kv (air discharge) ±30 kv (contact discharge) ISO 10605 - C = 330 pf, R = 330 Ω exceeds level 4: ±30 kv (air discharge) ±30 kv (contact discharge) ISO 7637-3: Pulse 3a: -150 V Pulse 3b: +150 V Pulse 2a: +/- 85 V Applications Automotive controller area network (CAN) bus lines where electrostatic discharges and other transients must be suppressed. This product is compliant with most of automotive interfaces. Description The ESDCAN0xx-2BLY are dual-line TVS specifically designed for the protection of automotive CAN bus lines against electrostatic discharge (ESD). Its improved parameters make it compliant with all key interfaces in automotive: CAN-FD, LIN, FlexRay, MOST, SENT, USB, etc. DS11111 - Rev 2 - October 2018 For further information contact your local STMicroelectronics sales office. www.st.com

Characteristics 1 Characteristics Table 1. Absolute ratings (T amb = 25 C) Symbol Parameter Value Unit ISO 10605 - C = 150 pf, R = 330 Ω: Contact discharge 30 Air discharge 30 ISO 10605 - C = 330 pf, R = 330 Ω: V PP Peak pulse voltage Contact discharge 30 kv Air discharge 30 ISO 10605 - C = 330 pf, R = 330 Ω: Contact discharge Air discharge 22 22 I PP Peak pulse current (8/20 μs) 5.5 3.7 A 3 T j Operating junction temperature range -40 to +150 C T stg Storage temperature range -55 to +150 C Figure 1. Electrical characteristics (definitions) Ipp stand-off voltage DS11111 - Rev 2 page 2/14

Characteristics Table 2. Electrical characteristics (values, T amb = 25 C) I RM max. at V RM V BR at I R V CL Pulse ISO7637-3 V CL at I PP (8/20 µs) C ΔC (1) αt (2) Order code Min. Max. 3a at -150 V min. 3b at +150 V max. Max. Typ. Max. Typ. Typ. µa V V ma V V A pf pf 10-4 / C 0.1 24 27 32 1-40 40 43 5-30 0.1 9 0.1 24 25 30 1-35 35 40 5-30 0.1 9 0.05 25.5 27.5 30.7 1-35 35 43 3 17 19 0.1 9 0.1 35 38 42.2 1-44 44 59 3 13 15 0.1 9 1. ΔC : capacitance variation between IO1 and IO2 versus GND 2. to calculate V BR versus T j : V BR at T j = V BR at 25 C x (1 + αt x (T j - 25) ) DS11111 - Rev 2 page 3/14

Characteristics (curves) 1.1 Characteristics (curves) Figure 2. Maximum peak current versus initial junction temperature 6 5 4 I pp (A) 8/20 µs 3 2 1 T j ( C) 0 0 25 50 75 100 125 150 175 200 Figure 3. Maximum peak pulse current versus exponential pulse duration 10 I PP (A) T j initial = 25 C Figure 4. Clamping voltage versus peak pulse current I pp (A) 10 1 1 8/20 µs t p (ms) 0.1 0.01 0.1 1 V CL (V) 0.1 20 25 30 35 40 45 50 55 60 65 70 DS11111 - Rev 2 page 4/14

Characteristics (curves) Figure 5. Junction capacitance versus reverse voltage Figure 6. Leakage current versus junction temperature 100 C (pf) f = 1 MHz V osc = 30 mv RMS T j = 25 C I R (na) 100.0 10.0 10 1.0 0.1 V R = V RM V R (V) 1 0 5 10 15 20 25 30 35 40 T j ( C) 0.0 25 50 75 100 125 150 Figure 7. Response to ISO 10605 -C = 150 pf, R = 330 Ω (-8 kv contact) Figure 8. Response to ISO 10605 - C = 150 pf, R = 330 Ω (+8 kv contact ) Figure 9. Response to ISO 7637-3 Pulse 3a: -150 V DS11111 - Rev 2 page 5/14

Characteristics (curves) Figure 10. Response to ISO 7637-3 Pulse 3b : +150 V Figure 11. Response to ISO 7637-3 pulse 2a: -85 V Figure 12. Response to ISO 7637-3 pulse 2a: +85 V DS11111 - Rev 2 page 6/14

Characteristics (curves) Figure 13. S21 attenuation Figure 14. TLP I (A) 25 20 15 10 5 0-5 -10-15 -20 V (V) -25-60 -50-40 -30-20 -10 0 10 20 30 40 50 60 DS11111 - Rev 2 page 7/14

Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 2.1 SOT23-3L package information Figure 15. SOT23-3L package outline B L 3 E H 1 2 S e c e1 D A 0.25 Gauge plane A1 L L1 a Seating plane Table 3. SOT23-3L package mechanical data Dimensions Ref. Millimeters Inches (1) Min. Typ. Max. Min. Typ. Max. A 0.89 1.40 0.0350 0.0551 A1 0.00 0.10 0.0000 0.0039 B 0.30 0.51 0.0118 0.0201 C 0.085 0.18 0.0033 0.0071 D 2.75 3.04 0.1083 0.1197 e 0.85 1.05 0.0335 0.0413 e1 1.70 2.10 0.0669 0.0827 E 1.20 1.75 0.0472 0.0689 H 2.10 3.00 0.0827 0.1181 L 0.60 0.0236 S 0.35 0.65 0.0138 0.256 L1 0.25 0.55 0.0098 0.0217 a 0 8 0 8 1. Dimension in inches are given for reference only. DS11111 - Rev 2 page 8/14

SOT23-3L package information Figure 16. SOT23-3L marking Figure 17. SOT23-3L footprint in mm (inches) 0.95 (0.037) X X X X 1 (0.039) 2.9 (0.114) XXXX : Marking 0.8 (0.0031) 0.5 (0.019) Figure 18. Package orientation in reel Figure 19. Tape and reel orientation Note: Pin 1 located according to EIA-481 Pocket dimensions are not on scale Pocket shape may vary depending on package Figure 20. 7'' reel dimension values Figure 21. Inner box dimension values Ø 180 max 14.4 30 2±0.5 Ø 13 Ø 60 Ø 20.2 min 205 205 DS11111 - Rev 2 page 9/14

SOT23-3L package information Figure 22. Tape outline Table 4. Tape dimension values Dimensions Ref. Millimeters Min. Typ. Max. D0 1.45 1.5 1.6 D1 1 F 3.45 3.5 3.55 K0 1.3 1.4 1.5 P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.95 2.0 2.05 W 7.9 8 8.3 DS11111 - Rev 2 page 10/14

Reflow profile 3 Reflow profile Figure 23. ST ECOPACK recommended soldering reflow profile for PCB mounting Temperature ( C) 250 2-3 C/s 240-245 C -2 C/s 200 60 sec (90 max) -3 C/s 150-6 C/s 100 50 0.9 C/s Time (s) 0 30 60 90 120 150 180 210 240 270 300 Note: Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020. DS11111 - Rev 2 page 11/14

Ordering information 4 Ordering information Figure 24. Ordering information scheme Table 5. Ordering information Order code Marking (1) Package Weight Base qty. Delivery mode EL24 EN24 EC24 EC35 SOT23-3L 9.8 mg 3000 Tape and reel 1. The marking can be rotated by multiples of 90 to differentiate assembly location DS11111 - Rev 2 page 12/14

Revision history Table 6. Document revision history Date Revision Changes 13-Jul-2015 1 First issue. 04-Oct-2018 2 Added RPN and. Updated cover page, Section 1 Characteristics and Section 1.1 Characteristics (curves). Added Packing information. DS11111 - Rev 2 page 13/14

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2018 STMicroelectronics All rights reserved DS11111 - Rev 2 page 14/14