Fast Soft Recovery Rectifier Diode, 20 A

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D 2 PK (SMD-22) PRODUCT SUMMRY V F at 2 I FSM V RRM Base common cathode + 2 node - - 2ETF..SPbF Soft Recovery Series Rectifier Diode, 2 3 node <.3 V 3 8 V to 2 V MJOR RTINGS ND CHRCTERISTICS FETURES/DESCRIPTION The 2ETF..SPbF fast soft recovery rectifier series has been optimized for combined short reverse recovery time and low forward voltage drop. The glass passivation ensures stable reliable operation in the most severe temperature and power cycling conditions. This product series has been designed and qualified for industrial level. Compliant to RoHS directive 22/9/EC. Halogen-free according to IEC 6249-2-2 definition. PPLICTIONS Output rectification and freewheeling in inverters, choppers and converters Input rectifications where severe restrictions on conducted EMI should be met SYMBOL CHRCTERISTICS VLUES UNITS I F(V) Sinusoidal waveform 2 V RRM 8 to 2 V I FSM 3 V F 2, = 2 C.3 V t rr, /µs 9 ns Range - 4 to C VOLTGE RTINGS PRT NUMBER V RRM, MXIMUM PEK REVERSE VOLTGE V V RSM, MXIMUM NON-REPETITIVE PEK REVERSE VOLTGE V 2ETF8SPbF 8 9 2ETFSPbF 2ETF2SPbF 2 3 I RRM T C m 6 BSOLUTE MXIMUM RTINGS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Maximum average forward current I F(V) T C = 97 C, 8 conduction half sine wave 2 Maximum peak one cycle ms sine pulse, rated V RRM applied 3 I FSM non-repetitive surge current ms sine pulse, no voltage reapplied 3 ms sine pulse, rated V RRM applied 4 Maximum I 2 t for fusing I 2 t ms sine pulse, no voltage reapplied 63 2 s Maximum I 2 t for fusing I 2 t t =. ms to ms, no voltage reapplied 63 2 s * Pb containing terminations are not RoHS compliant, exemptions may apply Document Number: 9499 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 7-Sep-9

2ETF..SPbF Soft Recovery Series Rectifier Diode, 2 ELECTRICL SPECIFICTIONS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Maximum forward voltage drop V FM 2, = 2 C.3 V Forward slope resistance r t.88 mω = C Threshold voltage V F(TO).93 V = 2 C. Maximum reverse leakage current I RM V R = Rated V RRM = C 6 m RECOVERY CHRCTERISTICS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Reverse recovery time t rr IF at 2 pk 4 ns Reverse recovery current I rr 2 /µs 6. Reverse recovery charge Q rr 2 C.7 µc Snap factor S Typical.6 dir dt t rr t a t b t Q rr I RM(REC) THERML - MECHNICL SPECIFICTIONS PRMETER SYMBOL TEST CONDITIONS VLUES UNITS Maximum junction and storage temperature range, T Stg - 4 to C Maximum thermal resistance, junction to case R thjc DC operation.9 Maximum thermal resistance, junction to ambient (PCB mount) R () thj 62 C/W Soldering temperature T S 24 C pproximate weight Marking device Case style D 2 PK (SMD-22) Note () When mounted on " square (6 mm 2 ) PCB of FR-4 or G- material 4 oz. (4 µm) copper 4 C/W For recommended footprint and soldering techniques refer to application note #N-994 2 g.7 oz. 2ETF8S 2ETFS 2ETF2S www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 9499 2 Revision: 7-Sep-9

2ETF..SPbF Soft Recovery Series Rectifier Diode, 2 Maximum llowable Case Temperature ( C) 4 3 2 3 R thjc (DC) =.9 K/W 6 Ø Conduction angle 9 2 8 2 2 Maximum verage Forward Power Loss (W) 4 4 3 3 2 2 RMS limit 8 2 9 6 3 DC Ø Conduction period = C 2 2 3 3 verage Forward Current () verage Forward Current () Fig. - Current Rating Characteristics Fig. 4 - Forward Power Loss Characteristics Maximum llowable Case Temperature ( C) 4 3 2 R thjc (DC) =.9 K/W Ø Conduction period 6 9 3 2 8 DC 2 2 3 verage Forward Current () Fig. 2 - Current Rating Characteristics 3 Peak Half Sine Wave Forward Current () 3 3 2 2 t any rated load condition and with rated V RRM applied following surge. Initial = C at 6 Hz.83 s at Hz. s Number of Equal mplitude Half Cycle Current Pulses (N) Fig. - Maximum Non-Repetitive Surge Current Maximum verage Forward Power Loss (W) 3 3 2 2 8 2 9 6 3 RMS limit Ø Conduction angle = C 2 2 Peak Half Sine Wave Forward Current () 4 3 3 2 2 Maximum non-repetitive surge current versus pulse train duration. Initial = C No voltage reapplied Rated V RRM reapplied.. verage Forward Current () Pulse Train Duration (s) Fig. 3 - Forward Power Loss Characteristics Fig. 6 - Maximum Non-Repetitive Surge Current Document Number: 9499 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 7-Sep-9 3

2ETF..SPbF Soft Recovery Series Rectifier Diode, 2 Instantaneous Forward Current () = 2 C = C... 2. 2. 3. 3. 4. Instantaneous Forward Voltage (V) Fig. 7 - Forward Voltage Drop Characteristics t rr - Maximum Reverse Recovery Time (µs).7.6..4.3.2. = 2 C = 3 = 2 = = = Q rr - Maximum Reverse Recovery Charge (µc) 6 4 3 2 = 2 C = 3 = 2 = = = 2 Fig. 8 - Recovery Time Characteristics, = 2 C 2 Fig. - Recovery Charge Characteristics, = 2 C t rr - Maximum Reverse Recovery Time (µs).2.9.6.3 = C = 3 = 2 = = = Q rr - Maximum Reverse Recovery Charge (µc) 8 6 4 2 = C = 3 = 2 = = = 2 Fig. 9 - Recovery Time Characteristics, = C 2 Fig. - Recovery Charge Characteristics, = C www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 9499 4 Revision: 7-Sep-9

2ETF..SPbF Soft Recovery Series Rectifier Diode, 2 I rr - Maximum Reverse Recovery Current () 2 2 = 2 C = 3 = 2 = = = I rr - Maximum Reverse Recovery Current () 3 3 2 2 = C = 3 = 2 = = = 2 2 Fig. 2 - Recovery Current Characteristics, = 2 C Fig. 3 - Recovery Current Characteristics, = C Z thjc - Transient Thermal Impedance (K/W). Single pulse D =. D =.33 D =.2 D =.7 D =.8..... Square Wave Pulse Duration (s) Steady state value (DC operation) Fig. 4 - Thermal Impedance Z thjc Characteristics Document Number: 9499 For technical questions, contact: diodestech@vishay.com www.vishay.com Revision: 7-Sep-9

2ETF..SPbF Soft Recovery Series ORDERING INFORMTION TBLE Rectifier Diode, 2 Device code 2 E T F 2 S TRL PbF 2 3 4 6 7 8 - Current rating (2 = 2 ) 2 - Circuit configuration: E = Single diode 3 - Package: T = D 2 PK (TO-22C) 4 - Type of silicon: F = Fast soft recovery rectifier - Voltage code x = V RRM 6 - S = Surface mountable 7 - None = Tape TRR = Tape and reel (right oriented) TRL = Tape and reel (left oriented) 8 - None = Standard production PbF = Lead (Pb)-free 8 = 8 V = V 2 = 2 V LINKS TO RELTED DOCUMENTS Dimensions Part marking information Packaging information www.vishay.com/doc?946 www.vishay.com/doc?94 www.vishay.com/doc?932 www.vishay.com For technical questions, contact: diodestech@vishay.com Document Number: 9499 6 Revision: 7-Sep-9

Outline Dimensions Vishay Semiconductors D 2 PK DIMENSIONS in millimeters and inches Conforms to JEDEC outline D 2 PK (SMD-22) (3) L (2)(3) E 4 c2 B (E) (D) (3) Pad layout. MIN. (.43) 9.6 MIN. (.38) D L2 B 2 x e 2 3 B H (2) 2 x b2 2 x b C Detail. M M B c ±.4 M B E View - H (3) 7.9 (.7). (.62) 2.32 MIN. (.8) Plating 2.64 (.3) 2.4 (.96) (4) b, b3 3.8 MIN. (.) Base Metal Gauge plane Lead assignments Diodes. - node (two die)/open (one die) 2., 4. - Cathode 3. - node Lead tip to 8 L3 L L4 Detail Rotated 9 CW Scale: 8: B Seating plane (c) (b, b2) Section B - B and C - C Scale: None c (4) SYMBOL MILLIMETERS INCHES MILLIMETERS INCHES NOTES SYMBOL MIN. MX. MIN. MX. MIN. MX. MIN. MX. NOTES 4.6 4.83.6.9 D 6.86 8..27.3 3..24.. E 9.6.67.38.42 2, 3 b..99.2.39 E 7.9 8.8.3.346 3 b..89.2.3 4 e 2.4 BSC. BSC b2.4.78.4.7 H 4.6.88.7.62 b3.4.73.4.68 4 L.78 2.79.7. c.38.74..29 L -.6 -.66 3 c.38.8..23 4 L2.27.78..7 c2.4.6.4.6 L3.2 BSC. BSC D 8. 9.6.33.38 2 L4 4.78.28.88.28 Notes () Dimensioning and tolerancing per SME Y4. M-994 (2) Dimension D and E do not include mold flash. Mold flash shall not exceed.27 mm (.") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L, D and E (4) Dimension b and c apply to base metal only () Datum and B to be determined at datum plane H (6) Controlling dimension: inch (7) Outline conforms to JEDEC outline TO-263B Document Number: 946 For technical questions within your region, please contact one of the following: www.vishay.com Revision: 3-Mar- Diodesmericas@vishay.com, Diodessia@vishay.com, DiodesEurope@vishay.com This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN ND THIS DOCUMENT RE SUBJECT TO SPECIFIC DISCLIMERS, SET FORTH T www.vishay.com/doc?9

www.vishay.com Legal Disclaimer Notice Vishay Disclaimer LL PRODUCT, PRODUCT SPECIFICTIONS ND DT RE SUBJECT TO CHNGE WITHOUT NOTICE TO IMPROVE RELIBILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, Vishay ), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. ll operating parameters, including typical parameters, must be validated for each customer application by the customer s technical experts. Product specifications do not expand or otherwise modify Vishay s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2/6/EU of The European Parliament and of the Council of June 8, 2 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 22/9/EC. We confirm that all the products identified as being compliant to Directive 22/9/EC conform to Directive 2/6/EU. Revision: 2-Mar-2 Document Number: 9