HCS410/WM. Crypto Read/Write Transponder Module FEATURES PACKAGE TYPES BLOCK DIAGRAM HCS410 IMMOBILIZER TRANSPONDER. Security. Operating.

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M HCS410/WM Crypto Read/Write Transponder Module FEATURES Security Two programmable 64-bit encryption keys 16/32-bit bi-directional challenge and response using one of two keys Programmable 32-bit serial number Three IFF encryption algorithms Operating Selectable baud rate Anti-collision of multiple transponders Intelligent damping for high Q LC-circuits Asynchronous transponder communication Other 64-bit user EEPROM Typical Applications Access control systems Automotive immobilizers Electronic door locks (Home/Office/Hotel) Burglar alarm systems Proximity access control HCS410 IMMOBILIZER TRANSPONDER Crypto Read/Write Transponder Challenge Immobilizer Base Station Unit PACKAGE TYPES SOT385 BLOCK DIAGRAM L VDD 125kHZ C Power Control Wakeup Logic Transponder Circuitry HCS410/WM PPM Detector PPM Encoder Oscillator Configuration Register Address Decoding EEPROM Control Logic and Counters Encryption Logic Register 125KHz AM Response KEELOQ is a registered trademark of Microchip Technology, Inc. Microchip s Secure Data Products are covered by some or all of the following patents: Code hopping encoder patents issued in Europe, U.S.A., and R.S.A. U.S.A.: 5,517,187; Europe: 0459781; R.S.A.: ZA93/4726 Secure learning patents issued in the U.S.A. and R.S.A. U.S.A.: 5,686,904; R.S.A.: 95/5429 *Secure Learn patent pending. 1999 Preliminary DS41116A-page 1

1.0 ELECTRICAL CHARACTERISTICS TABLE 1-1: ABSOLUTE MAXIMUM RATING Parameter Symbol Value Units Operating Temperature Range TAMB TBD C Storage Temperature Range TSTG TBD C Magnetic Field Strength H 1000 A/m Maximum Assembly Temperature, t<5 min TASS TBD C TABLE 1-2: OPERATING CHARACTERISTICS TRANSPONDER TAMB = 25 C, f = 125 khz unless otherwise noted. Parameter Symbol Min Typ Max Unit Test Conditions/Pins Inductor Inductance L 895 µh Resonating Capacitor Capacitance CRES 1800 pf Pool Capacitor Capacitance CPOOL 100 nf LC Circuit, H = 20 A/m Resonance Frequency fr TBD 125 TBD khz TAMB = 25 C Unloaded Quality Factor Q 22 TABLE 1-3: MAGNETIC FIELD STRENGTH (H) Parameter Symbol Min Typ. Max Unit Test Conditions/Pins Minimum Field Strength Read Mode HREAD TBD 7.5 A/m TAMB = 25 C Write Mode HPROG TBD 45 A/m TAMB = 25 C Data Retention EEPROM tretention 10 Years TAMB = 25 C DS41116A-page 2 Preliminary 1999

2.0 PACKAGING INFORMATION 2.1 Package Details Leadless Wedge Module (WM) (SOT385) CH1 X 45 E F D J CH2 X 45 α TYP. A1 A β TYP. Units INCHES MILLIMETERS* Dimension LimitsMIN NOM MAX MIN NOM MAX Overall Height A.114.118.120 2.90 3.00 3.05 Bottom of Package to ChamferA1.075.079.083 1.90 2.00 2.10 Overall Width E.236.240 2.44 6.00 6.10 6.20 Overall Length D.472.476.480 12.00 12.10 12.20 Width at Tapered End J.173.177.181 4.40 4.50 4.60 Length of Flat F.193.197.200 4.90 5.00 5.10 Chamfer Distance, HorizontalCH1.039.043.047 1.00 1.10 1.20 Chamfer Distance, Vertical CH2.039.043.047 1.00 1.10 1.20 Mold Draft Angle Top α 4 6 8 4 6 8 Mold Draft Angle Bottom β 4 6 8 4 6 8 *Controlling Parameter Notes: Dimensions D, E, F and J do not include mold flash or protrusions. Mold flash or protrusions s.010 (0.254mm) per side. Drawing No. C04-109 2.2 Package Marking Information Not available at time of printing. Will be made available after definition of QS9000 compliant standard. 1999 Preliminary DS41116A-page 3

NOTES: DS41116A-page 4 Preliminary 1999

NOTES: 1999 Preliminary DS41116A-page 5

NOTES: DS41116A-page 6 Preliminary 1999

HCS410/WM PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. HCS410 WM Package: SOT385 = Leadless Wedge Module Temperature Range: Blank = I = 0 C to +70 C 40 C to +85 C Device: HCS410/WM Crypto Read/Write Transponder Module Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. Your local Microchip sales office 2. The Microchip Corporate Literature Center U.S. FAX: (602) 786-7277 3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 1999 Preliminary DS41116A-page 7

WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-786-7200 Fax: 480-786-7277 Technical Support: 480-786-7627 Web Address: http://www.microchip.com Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Boston 5 Mount Royal Avenue Marlborough, MA 01752 Tel: 508-480-9990 Fax: 508-480-8575 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75248 Tel: 972-818-7423 Fax: 972-818-2924 Dayton Two Prestige Place, Suite 150 Miamisburg, OH 45342 Tel: 937-291-1654 Fax: 937-291-9175 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 San Jose 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 AMERICAS (continued) Toronto 5925 Airport Road, Suite 200 Mississauga, Ontario L4V 1W1, Canada Tel: 905-405-6279 Fax: 905-405-6253 ASIA/PACIFIC Hong Kong Microchip Asia Pacific Unit 2101, Tower 2 Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2-401-1200 Fax: 852-2-401-3431 Beijing Microchip Technology, Beijing Unit 915, 6 Chaoyangmen Bei Dajie Dong Erhuan Road, Dongcheng District New China Hong Kong Manhattan Building Beijing 100027 PRC Tel: 86-10-85282100 Fax: 86-10-85282104 India India Liaison Office No. 6, Legacy, Convent Road Bangalore 560 025, India Tel: 91-80-229-0061 Fax: 91-80-229-0062 Japan Microchip Technology Intl. Inc. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa 222-0033 Japan Tel: 81-45-471-6166 Fax: 81-45-471-6122 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea Tel: 82-2-554-7200 Fax: 82-2-558-5934 Shanghai Microchip Technology RM 406 Shanghai Golden Bridge Bldg. 2077 Yan an Road West, Hong Qiao District Shanghai, PRC 200335 Tel: 86-21-6275-5700 Fax: 86 21-6275-5060 ASIA/PACIFIC (continued) Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore 188980 Tel: 65-334-8870 Fax: 65-334-8850 Taiwan, R.O.C Microchip Technology Taiwan 10F-1C 207 Tung Hua North Road Taipei, Taiwan, ROC Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 EUROPE United Kingdom Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5858 Fax: 44-118 921-5835 Denmark Microchip Technology Denmark ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 France Arizona Microchip Technology SARL Parc d Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany Arizona Microchip Technology GmbH Gustav-Heinemann-Ring 125 D-81739 München, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Italy Arizona Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 11/15/99 Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999. The Company s quality system processes and procedures are QS-9000 compliant for its PICmicro 8-bit MCUs, KEELOQ code hopping devices, Serial EEPROMs and microperipheral products. In addition, Microchip s quality system for the design and manufacture of development systems is ISO 9001 certified. All rights reserved. 1999 Microchip Technology Incorporated. Printed in the USA. 11/99 Printed on recycled paper. Information contained in this publication regarding device applications and the like is intended for suggestion only and may be superseded by updates. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. The Microchip logo and name are registered trademarks of in the U.S.A. and other countries. All rights reserved. All other trademarks mentioned herein are the property of their respective companies. 1999

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