ACCELERATING COMMERCIALIZATION

ACCELERATING COMMERCIALIZATION 1

ReMAP Our Vision is that the Canadian Electronics Manufacturing sector is recognized as the global leader in product commercialization. Our Mission is to accelerate the commercialization of electronics innovations ensuring that Canada s investment in electronics technology translates into economic growth and job creation. What we do. Technology Readiness Level * (TRL) *Buyandsell.gc.ca Hardware and electronics manufacturing differentiates this network. Enabling products faster. TRL 9 Market Launch Actual application of the technology in its final form and under real-life conditions, such as those encountered in operational tests and evaluations. Activities include using the innovation under operational conditions. ReMAP is a network of partners (startups, small-medium enterprises (SMEs), large organizations and leading research institutions) from across Canada to form a product-enablement network. Through shared resources and knowledge, ReMAP bridges the commercialization gap between applied research and industry. A collaborative approach accelerates the commercialization of electronics products manufactured in Canada for the global market. Our blueprint, a Product Enablement Value Chain, leverages the strength and synergies from suppliers, manufacturers, researchers and customers that will enable innovative ideas to products for the global market. Proven technologies from one industry to another can be leveraged to shorten time to market. ReMAP supports lateral innovations across the Aerospace, Defense, Information and Communications Technology (ICT), Healthcare, Industrial and Renewable Energy market segments. ReMAP TRL 8 TRL 7 TRL 6 TRL 5 TRL 4 TRL 3 TRL 2 Technology Qualified Through Test and Demo Technology has been proven to work in its final form and under expected conditions. Activities include developmental testing and evaluation of whether it will meet operational requirements. Demo Operational Environment Prototype at planned operational level and is ready for demonstration in an operational environment. Activities include prototype field testing. Demo Relevant Environment A model or prototype that represents a near desired configuration. Activities include testing in a simulated operational environment or laboratory. Basic Validation Relevant Environment The basic technological components are integrated for testing in a simulated environment. Activities include laboratory integration of components. Basic Validation Lab Environment Basic technological components are integrated to establish that they will work together. Activities include integration of ad hoc hardware in the lab. Proof of Concept Active research and development is initiated. This includes analytical studies and/or lab studies. Activities might include components that are not yet integrated or representative. Concept and/or Application Invention begins. Once basic principles are observed, practical applications can be invented. Activities are limited an analytical studies. ReMAP is made possible through joint funding from the Government of Canada s Business-led Networks of Centres of Excellence (BL-NCE) program matched by contributions from our network partners. TRL 1 Basic Principles Scientific research begins to be translated into applied R&D. Activities might include paper studies of a technology s basic properties. The ReMAP project portfolio supports later-stage product development (TRL 4-8). Our projects advance the next-generation of innovations by developing new, environmentallycompliant materials for high-reliability applications; cost-effective, miniaturized optics and photonics technologies; and more energy efficient products for the renewable energy industry. 2

Accelerating Commercialization ReMAP Priorities Lateral Innovation Product Enablement Global Commercialization Product Enablement Ecosystem Global Commercialization 10 Research Partners 8 Large Industry Partners $19 million in funding 14 Start-ups and SMEs New Materials Optics/ Photonics Renewable Energy 20+ Industry Associations Leveraging 38 labs & manufacturing lines across Canada in 3 research areas Lateral Innovation Across Market Segments Aerospace ICT Industrial Defense Healthcare Renewable Energy Labs and 38 Manufacturing Lines 14 Projects 3

High-Reliability Product Enablement Materials M1 Lower Temperature Soldering Alloys The introduction of environmental legislation such as the European Union s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to pad cratering which occurs in high temperature assembly processes which - may result in catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics. This project focuses on developing new lower temperature alloys and test methods that are environmentally friendly and meet the aerospace industry s performance reliability standards. Assessing melting temperatures of traditional leaded solders compared to lead-free solder alloys Traditional Sn-Pb Solder P.T. 220ºC M.P. 183ºC Gold Standard for Electronics Manufacturing Since 1950s Pb-Free Solders P.T. 260ºC M.P. 217ºC Increased risk of field failures in high reliability applications - Pad Cratering - Aging - Tin whiskers - Mechanical /Thermal Mechanical RoHS Compliant Expensive Next-Gen Pb-Free Solders P.T. 230ºC M.P. 205 ºC Mitigates propensity of field failures in high reliability applications ROHS Compliant Lower cost Melting Point (M.P.) Peak Temperature (P.T.) Patents Pending 4

High-Reliability Product Enablement Materials M2 Tin Whiskers The introduction of environmental legislation such as the European Union s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to spontaneous growth of filaments known as tin whiskers. Over time, this may cause catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics. This project focuses on developing new alloys to mitigate tin whisker growth and increase reliability in applications that are exposed to extreme environmental conditions. Human Hair Width Compared to Tin Whisker Filament, Celestica 5

High-Reliability Product Enablement Materials M3 Aging The introduction of environmental legislation such as the European Union s Restriction of Hazardous Substances (RoHS) directive has led to the use of new tin-based solder alloys in electronics manufacturing. These alloys have shown a susceptibility to solder cracks due to aging. Over time, this may cause catastrophic field failures in high-reliability applications such as aerospace, medical and automotive electronics. This project focuses on developing new alloys and test methods to increase reliability for applications exposed to various environmental conditions, such as an extended lifespan (20+ years). New Solder Solder 20+ Years Crack Solder Crack Due to Aging, Celestica 6

High-Reliability Product Enablement Materials M4 Electronically Conductive Adhesives Developing Electrically Conductive Adhesives (ECAs) using nanomaterials is an alternative to traditional solders. Traditional solders are limited in reflow temperatures and particle size, rendering them restricted to a set pitch and temperature. ECAs can bind at lower temperatures reducing the risk of stress while maintaining product reliability. ECAs also enable higher density interconnects due to the structure of the material. This project is focused on developing ECA materials that support larger process windows, higher density interconnects and electronics miniaturization. Sub-Micron Silver Nano Crystals, University of Waterloo S 7

Next Generation Solar Solutions Renewable Energy S1 Smart Lamination Materials In order for solar power to become a viable alternative to mature energy systems, solar panel power efficiencies must be increased without adding steps or complexities to the current manufacturing process. Silicon solar cells convert only a portion of the solar spectrum into electricity. This project focuses on developing nanostructureembedded smart lamination materials that are capable of broadening the usable range of the solar spectrum. These materials can increase the power conversion efficiency of the solar module without additional cost or changes to the manufacturing process. Photoluminescence of Synthesized Quantum Dots Coating on Glass, University of Waterloo 8

Next Generation Solar Solutions Renewable Energy S2 Enhanced Laminate Materials There are a number of factors which are impeding the widespread adoption of solar photovolatics (PV) as an alternative energy source, with cost in the form of $/watt being the main driver. Optimizing power efficiency is a critical factor in reducing cost. There are opportunities to gain significant power improvements through advancements in materials, such as the laminate. Current lamination materials have limitations when exposed to certain environmental conditions (darkening in hot climates and loss of mechanical properties in low temperature climates). This project focuses on enabling higher panel efficiencies through the use of nanocrystals to improve solar performance. 3D Laser Scanning Confocal Microscopy Image of Quantum Dots in EVA Film, Western University 9

Next Generation Solar Solutions Renewable Energy S3 Smart Electronics Today s energy infrastructure is evolving into adaptive, intelligent networks. Powering these networks requires unique smart energy products that can meet industry s rapidly evolving requirements. Increasing the deployment of distributed generation systems based on solar photovolatics (PV) is driving demand for reliable, networked power conversion and optimization technologies. Pricing pressures are adding an additional driver for solar installations; impact panel and inverter manufacturers and solar power developers. This project focuses on developing smart electronics in solar module manufacturing. Power Optimizer Reference Design, Solantro 10

Next Generation Solar Solutions Renewable Energy S4 Solar Windows Solar farms represent the majority of solar installations. By 2020, 60% of the global solar installations are predicted to be in residential or commercial applications; while solar farms will only represent 20% of the market share. Semi-transparent solar windows can provide significant energy savings in architectural installations. For cooling-dominated buildings, they can replace tinted or fritted glass as a means of reducing cooling energy loads. This project focuses on the development of new semi-transparent windows that will enhance sustainable buildings. Transparent Solar Window, Concordia University 11

Miniaturizing Optical Technologies Optics & Photonics O1 Optical Interconnects Packaging is viewed by the industry as one of the biggest technical hurdles in enabling the successful commercialization of photonic integrated circuits (PICs), particularly those implemented in silicon photonics (SiP). In mature technologies like semiconductor lasers for optical communications, packaging accounts for up to 90% of the total cost of the product. To remain competitive, this cost needs to be dramatically reduced, particularly in large volume applications targeted for SiP technology. This project focuses on the development of cost effective and manufacturable solutions for the integration of photonic circuits and electronics with an emphasis on optical interfacing to optical fibres and lasers. Silicon Photonics Test Station, University of British Columbia and CMC Microsystems 12

Miniaturizing Optical Technologies Optics & Photonics 03 Monolithically Integrated Laser Materials on Silicon Global mobile internet use is creating a traffic tsunami affecting both mobile and fixed communications networks. Managing exponential internet data growth requires innovative, smaller components with lower power dissipation. One solution is silicon photonics (SiP). This project focuses on developing a robust and effective process to grow laser sources on a silicon wafer using semiconductor technologies. This will enable higher performance and cost-effective solutions for the next generation of photonic integrated circuits (PICs). GaAs Quantum Dots (QD), University of Toronto 13

Miniaturizing Optical Technologies Optics & Photonics O4 Integrated OCT System Current state-of-the-art Optical Coherence Tomography (OCT) is expensive, bulky and sensitive to mechanical shock and vibration. An integrated photonic OCT solution, with key optical elements on a single chip, would allow the development of miniaturized OCT systems. These systems can be designed for a broader range of applications, such as ophthalmology, resulting in greatly improved reliability due to fewer component interfaces. This project focuses on the integration of an OCT solution that combines superluminescent laser diode, spectrometer and interferometer into a single silicon chip. Silicon Chip 14

Miniaturizing Optical Technologies Optics & Photonics O6 Low Cost Optical Integrated Transceiver Consumer off the shelf (COTS) electronics technology has been leveraged by aerospace, defense and the military for the past 20 years to reduce cost. Similarly, there is the opportunity to leverage advancements in optics from the telecommunications industry to reduce cost for aerospace and defense applications. This project focuses on developing a low-cost optical integrated transceiver that meets high-reliability industry standards and aligns to regulatory compliance legislation for aerospace and defense applications. Extreme Temperature LightABLE Optical Engines for Embedded Computer Systems, ReflexPhotonics 15

Miniaturizing Optical Technologies Optics & Photonics 07 Optically Guided Laser Ablation with Integrated Surgical Navigation System Patients undergoing neurosurgery may be at risk for spinal cord injury, repetitive corrective surgery or other complications. Image-guided surgical procedures using optical technologies combined with traditional medical imaging modalities (CT and MRI) enables new surgical techniques that increase surgeon confidence, reduce operating time and improve patient safety. This project focuses on the advancement of optical technologies for image-guided surgery. The integrated surgical lighting and 3D imaging system utilizes sensors, machine vision cameras and advanced computational algorithms to allow pinpoint surgical guidance during neurosurgery. Spinal Surgical Screws 16

Miniaturizing Optical Technologies Optics & Photonics O8 Indium Phosphide High Speed Modulator In response to the increasing demand for bandwidth, telecommunication systems operating at 100 Gb/s are now deployed in long-haul links. In particular, larger bandwidth is achieved by not only using higher data rates but also using increased spectral efficiency. A critical element of these solutions is 100 Gb/s dual polarization IQ modulators. This project focuses on developing next-generation optical modulators for high-speed optical communication applications using indium phosphide technology. The resulting modulators will provide smaller form factor packages at a lower cost, improving the scalability of 100Gb/s and future 400Gb/s systems. Optical Modulator, TeraXion 17

Lateral Innovation ReMAP leverages the strengths and synergies from our network partners to accelerate commercialization. 18

Board of Directors Brad Jackson Vice President, Strategic Business Development, Diversified Markets, Celestica Board Chair, ReMAP Bruce Good Executive Director, Conference Board of Canada Board Vice Chair, ReMAP Jason Field, PhD. President & CEO, Life Sciences Ontario Larry Fitzgerald President & CEO, Wainbee Ltd & Filtramax Peter Frise, PhD. Scientific Director & CEO, Auto21, Professor, University of Windsor Paul Johnston, LL.B. Senior Associate, Hickling Arthurs Low (Retired) Antoine Paquin Chief Executive Officer and President, Solantro Semiconductor Corp. George Pinho, PhD. President, Christie Medical Holdings, Inc. John Reid President & CEO, CATAAlliance Philip Turi, LL.B. General Counsel & Global Business Services, Canadian Manufacturers & Exporters Marci Vernon, PhD. General Manager, INO-Ontario Dan Wasserman Founder and CEO, Mammoth Health Innovation Matt Kelly, P.Eng., MBA Senior Technical Staff Member and Senior Inventor, IBM Systems Technology Development Committee Alex Edwards CMC Microsystems Danxia Xu, PhD. National Research Council Canada Lionel C. Kimerling, PhD. Massachusetts Institute of Technology (MIT) Marianne Romansky, PhD. Celestica Inc. Martin Guy, PhD. TeraXion Rafael Kleiman, PhD. McMaster University Robert Corriveau Photons Canada S. Manian Ramkumar, PhD. Rochester Institute of Technology Timothy Pope, PhD. INO-Ontario Yves Poissant Natural Resources Canada Reza Ghaffarian, PhD. NASA-Jet Propulsion Lab-CalTech Technology Adoption & Commercialization Committee Andrew Kinross Navigant Consulting Dan Henes Celestica Inc. Dan Mathers MARS/Ironbit Consulting Doug Cooper Splintir Media Operations Garth Smith, PhD. Ontario Brain Institute Ian McWalter CMC Microsystems Imed Zine, PhD. Roadmap Capital Inc. Lahav Gil Kangaroo Group Ning Cheng Lee, PhD. Indium Corporation Ron Mantay PowerStream Shawn Blakney Celestica Inc. Victor Yang, MD Ryerson University/ Sunnybrook Research Institute Irene Sterian Executive Director, ReMAP Loretta Renard Network Manager, ReMAP Jackie Hatherly-Martin CFO, ReMAP Nimfa Sacun Financial Analyst, ReMAP 19

R-02-123015 www.