Product quality is the life of CenRF
Contents Company Introduction Professional Team High Quality Products Product Application
Company Introduction Hangzhou Shengtong Technology Co., Ltd. (), is a professional manufacturing & system integrator supplier of mobile network coverage & optimization solution in China. CenRF Communications, with a team of 15 years' experience, focuses on optimization and coverage of mobile networks. We have provided products and solutions for operators in China, Southeast Asia, the Middle East and North America. Our products and services support all mobile/cellular systems of IDEN, Tetra, CDMA, GSM, DCS networks as well as 3G UMTS and 4G LTE, and support the cellular networks' data transmission technologies of GPRS, EDGE, HSDPA, HSUPA, 1X EV-DO, etc. We help customers to target cost-effective and high reliable mobile/cellular system. We welcome new and old customers from all over the world to contact us for future business relationships and mutual success.
International Certificate Company Introduction CE Certificate of Antenna CE Certificate of Power splitter CE Certificate of Wireless Signal Repeater EU type examination certificate ISO9001 ISO14001
Professional Team CenRF is made up of expert teams, whom working in the field of communications for more than ten years. They are mainly responsible for marketing, product development, engineering design, quality testing, packing, delivery, and after-sales service. Sales Managers: Our company s customers are distributed in different countries. Because of the time difference, you can often see them working around the clock in their own positions. Product Design Engineers: Foreign customers often require customized products with different specifications, and professional engineers can provide the best solution in the shortest possible time.
Professional Team Product Test Engineers: For each product of each indicator strictly tested, the product passed the test will be accompanied by a fine test report, such as product production certificate so that customers buy assured. Logistics Engineers: They pack the customer's products and put them neatly in the warehouse's assigned location. They don't have a fixed day off just to deliver the goods to the docks or the airport on time.
High Quality Products The main electrical specification of passive device is Power Rating and PIM (IM3). Power Rating refers to the thermal energy produced by the resistance and dielectric loss of the device, which resulting in the aging, deformation and voltage changes. But it can satisfy the maximum power load permitted by the target. With the multi system combination and the increase of carrier frequency, most of the old devices with low power rating can not meet the requirements of the network system. When it does not meet the requirements, it is mainly manifested in: local micro discharge of the device, resulting in spectral expansion and broadband interference. Compare signal source average power(w) peak power(dbm) peak power(w) GSM 1 carrier 20 53 186 UMTS 1 carrier 20 53 186 LTE 47 61 1258 GSM+UMTS+LTE 1630 average power peak power CenRF products 300W (N) 500W(DIN) 1500W(N) 1800W(DIN) Low quality products 100-200W Less than 1000W
High Quality Products PIM (Passive inter-modulation) refers to: When two or more signals with different frequencies are applied to passive devices with nonlinear characteristics, passive intermodulation products will be produced. When it does not meet the requirements, the resulting impact: 1.Intermodulation signals fall into the uplink accepting frequency band, resulting in the signal can not communicate normally. 2.Intermodulation signals are prone to adjacent frequency interference or same frequency interference, call quality degradation. 3. Increasing the interference level of the base station. Especially in the case of multi carrier multi system integration, the PIM (IM3) requirement of passive devices is higher and must be <-150dBc@2 43dBm. Compare CenRF products Low quality products PIM (IM3) -150dBc~-165dBc -120dBc~-130dBc
High Quality Products Directional Coupler The directional coupler is a typical 4 port device, the coupling degree is mainly controlled by the distance between the main line and the secondary line, the smaller the spacing, the greater the coupling. It can distribute the energy according to any proportion, and its specifications are divided according to the magnitude of the output signal level of the coupling end. It consists of the following component: 1. connectors, 2. coupling rods, 3. cavities, and 4. resistors. directional coupler coupling ratio coupling degree insertion loss 5dB 1/3-5dB -2.0dB 6dB 1/4-6dB -1.7dB 7dB 1/5-7dB -1.5dB 10dB 1/10-10dB -0.8dB 15dB 1/32-15dB -0.4dB 20dB 1/100-20dB -0.3dB 30dB 1/1000-30dB -0.2dB
Directional Coupler Connector material comparison High Quality Products material surface cost PIM3 life copper Siver plating highest <-150dBc longest copper Alloy plating higher <-130dBc longer zinc Siver plating middle <-140dBc longer zinc Alloy plating low <-130dBc short Coupling rod coupling material comparison material surface cost PIM3 life copper Siver plating highest <-150dBc longest copper pickling higher <-120dBc longest zinc Siver plating middle <-150dBc longer aluminum Siver plating middle <-150dBc longer steel Alloy plating low <-120dBc short
High Quality Products Directional Coupler CenRF products Low quality products Clear solder joints Silver plating Unclear solder joints Alloy plating Clear cavity Dirty cavity Compared to low quality products, CenRF directional couplers are in good performance,they have lower Insertion Loss, lower VSWR,lower PIM (IM3),and longer product life.
High Quality Products Hybrid Coupler The 3dB hybrid coupler is actually a directional coupler with equal power sharing. It is implemented in a microstrip / stripline form. Because of the high isolation of the input / output, the hybrid coupler can be used in the same frequency combination, such as the GSM signal combination of different operators. When the hybrid coupler is applied, the output load must be matched, and the low intermodulation load should be used when the source is connected. The three port hybrid coupler(direct load matching) cannot be used for signal source routing. The material analysis is the same as the coupler.
High Quality Products Hybrid Coupler CenRF products Low quality products Clear solder joints Silver plating Unclear solder joints Alloy plating Clear cavity Dirty cavity Compared to low quality products, CenRF hybrid couplers are in good performance,they have lower insertion loss, lower VSWR,lower PIM (IM3),higher isolation,and longer product life.
High Quality Products Power Splitter Power spliier(wilkinson) has good port isolation, but it can not withstand the impact of high-power signals, so it should be used under the condition of small power coverage project and high isolation requirements. Power spliier(cavity) makes up the demand of high power, and the insertion loss is slightly smaller power spliier(wilkinson), and it is widely used in the field of signal covering engineering with low isolation requirement.. The white part is a coaxial transmission line with three stage impedance transformation, and the yellow part is the pin of the joint. Each section of the transmission line has a wavelength of 1/4. Power spliier(cavity)consists of the following component: 1. connector 2. power inner rod 3. cavity
High Quality Products Power Splitter Connector material comparison material surface cost PIM3 life copper Siver plating highest <-150dBc longest copper Alloy plating higher <-130dBc longer zinc Siver plating middle <-140dBc longer zinc Alloy plating low <-130dBc short Internal conductor material comparison material surface cost PIM3 life copper Siver plating highest <-150dBc longest aluminum Siver plating higher <-150dBc longest aluminum Copper plating middle <-130dBc longer aluminum Conductive oxidation low <-120dBc longer zinc Conductive oxidation low <-120dBc short
High Quality Products Power Splitter(Wilkinson) CenRF products Smooth connector Low quality products Rough connector Silver plating Alloy plating Clear solder joints Unclear solder joints Compared to low quality products, CenRF power splitters(wilkinson) are in good performance, They have lower VSWR,lower PIM (IM3), higher reliability, and longer product life.
High Quality Products Combiner Combiner is composed of resonant cavity, resonant column and tuning screw. Cavity material: A. Profile aluminum B. Die-casting aluminum.
High Quality Products Combiner CDMA/GSM 2-way combiner
High Quality Products Combiner Cavity plating material comparison surface cost PIM3 life Siver plating highest <-150dBc longest Copper plating middle <-130dBc longer Conductive oxidation low <-120dBc short Resonant bar material comparison material surface cost PIM3 life copper Siver plating highest <-150dBc longest copper pickling middle <-120dBc longest zinc Siver plating middle <-150dBc longer aluminum Siver plating middle <-150dBc longer steel Siver plating low <-120dBc short
High Quality Products Combiner CenRF products Low quality products Smooth connector Silver plating Alloy plating Rough connector Clear solder joints Unclear solder joints Compared to low quality products, CenRF combiners are in good performance,they have lower VSWR,lower PIM (IM3), higher isolation,higher reliability, and longer product life.
Product Application Application scenarios Hangzhou subway in China Garrincha Stadium in Brazilian Hilton Jumeirah Hotel in Dubai Hattencity Apartment in Malaysia Hefei international airport in China Hout Bay Hotel in Singapore Siam Shopping Center in Thailand Industrial Zone in Vietnam
Product Application Clients distribution Russia U.S.A Spain Turkey Israel Dubai Beijing Pakistan Hefei Hangzhou Thailand Taiwan India Vietnam The Philippines Singapore Malaysia Indonesia Brazil South Africa
Product Application Clients partners
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