Maintain time. Timer intermittent operation circuit VC(ON) / VC(OFF) Overheat protection. Restart trigger

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Transcription:

Silicon MOS FET type integrated circuit Features Reducing the average noise Adding a frequency jitter function to MIP2E/3E* series to dramatically reduce the average noise and simplify EMI parts Stabilization of maximum electric power by input correction Correcting the input voltage dependency of I LIMIT reduces the input voltage dependency of maximum output current Overheating protection function Changed from stopping in latch mode to self reset type Protecting function Overload protection, overheat protection Package Code TO-220-A2 Pin Name 1. CONTROL 2. SOURCE 3. DRAIN Marking Symbol: MIP2L4MY Applications Flat-screen TV, audio and others Absolute Maximum Ratings T a = 25 C±3 C Parameter Symbol Rating Unit DRAIN voltage VD - 0.3 to +700 V CONTROL voltage VC - 0.3 to +8 V Output peak current * IDP 2.7 A Channel temperature Tch 150 C Storage temperature Tstg -55 to +150 C Note) *: The guarantee within the following pulse width. Leading edge blanking delay + Current limit delay ton(blk) + td(ocl) Block Diagram CONTROL Maintain time Current source for start DRAIN Error amplifier For intermittent oscillation control under the low-load detection VC(ON) / VC(OFF) Timer intermittent operation circuit Reset signal (Reset at MAXDC & VC(OFF)) Timer reset Overheat protection VC_ CLAMP OSCLLATOR WITH JITTER MAXDUTY CLOCK Restart trigger S Q Gate driver Power MOSFET R Q Generating circuit of on-time blanking pulse ILIMIT compensation For drain current detection ILIMIT_max SOURCE Publication date: November 2011 Ver. AEF 1

Electrical Characteristics T C = 25 C±3 C Parameter Symbol Conditions Min Typ Max Unit Control functions Output frequency fosc VC = VC(CNT) - 0.2 V, VD = 5V 92 100 108 khz Jitter frequency deviation f VC = VC(CNT) - 0.2 V, VD = 5V * Fig. 5 5.5 khz Jitter frequency modulation rate * fm VC = VC(CNT) - 0.2 V, VD = 5V * Fig. 5 270 Hz Maximum duty cycle MAXDC VC = VC(CNT) - 0.2 V, VD = 5V 50 53 56 % PWM gain * GPWM VC = VC(CNT) 12.5 db Before auto-restart current IC(SB)1 VC < VC(ON), VD = 5 V 0.2 0.5 0.8 ma After off-state current IC(SB)2 VC > VC(CNT), VD = 5 V 0.2 0.5 0.8 ma Operating current IC(OP) VC = VC(CNT) - 0.2 V, VD = 5V 0.25 0.7 1.15 ma Auto-restart threshold voltage VC(ON) VD = 5V 5.75 6.25 6.75 V UV lockout threshold voltage VC(OFF) VD = 5V 4.35 4.8 5.25 V Auto-restart maintain voltage VC_m S1 = OPEN 4.95 5.45 5.95 V Auto-restart maintain time Tm S1 = OPEN 45 ms Auto-restart hysteresis voltage DVC VC(ON) - VC(OFF) 1.05 1.45 1.85 V Control clamp voltage VC(CLP) IC = 3 ma 6.2 6.8 7.4 V Auto-restart duty cycle TSW/TTIM S1 = OPEN * Fig. 4 12 % Auto-restart frequency ftim S1 = OPEN * Fig. 4 2.6 Hz Control pin charging current IC(CHG)1 VC = 0 V, VD = 50 V -14-9 -6 ma IC(CHG)2 VC = 5 V, VD = 50 V -11.2-5.7-2.4 ma Control pin voltage VC(CNT) VD = 5 V 5.3 5.9 6.5 V Control pin voltage hysteresis * DVC(CNT) VD = 5 V 10 mv Circuit protections Self protection current limit ILIMIT Duty = 30% * Fig. 1, 2 1.24 1.35 1.46 A ILIMIT modified coefficient R_slope VC = VC(CNT) - 0.2 V * Fig. 1, 2 37 ma/ms Leading edge blanking delay * ton(blk) 240 300 360 ns Current limit delay * td(ocl) 140 210 280 ns Thermal shutdown temperature * TOTP 130 140 150 C Thermal shutdown temperature hysteresis * DTOTP 70 C Output Power-up reset theshold voltage * VCreset 1.8 2.6 3.5 V ON-state resistance RDS(ON) ID = 0.2 A 5.2 6.7 W OFF-state leakage current IDSS VD = 650 V, VC = 6.5 V 10 20 ma Breakdown voltage VDSS ID = 100 ma, VC = 6.5 V 700 V Rise time tr VC = VC(CNT) - 0.2 V, VD = 5 V * Fig. 3 95 ns Fall time tf VC = VC(CNT) - 0.2 V, VD = 5 V * Fig. 3 30 ns Supply voltage characteristics Drain supply voltage VD(MIN) S1 = OPEN 36 V Note) *: Design guaranteed item 2 Ver. AEF

Electrical Characteristics (continued) T C = 25 C±3 C 1. Measurement circuit 2. Figure 1. Measurement circuit 2 Figure 2. ILIMIT measurement ILIMIT ID t R_slope = {(ILIMIT at Duty = 30%) (ILIMIT at Duty = 20%)} / {(Ton at Duty = 30%) (Ton at Duty = 20%)} Ver. AEF 3

Electrical Characteristics (continued) T C = 25 C±3 C 2. Figure 3. tr, tf measurement tf tr VD 90% 10% 0 Figure 4. VC_m, Tm, TTSW. TTIM, FTIM measurement Tm TTIM VC(ON) VC(CNT) VC(CNT) VC_m VC(OFF) TSW ftim = 1/TTIM time Figure 5. Df, fm measurement Frequency f fosc = average frequency 1/fM time 4 Ver. AEF

Usage Notes Connect a Ceramic Capacitor (over 0.1 mf) between CONTROL and SOURCE. The IPD has risks for break-down or burst or giving off smoke in following conditions. Avoid the following use. Fuse should be added at the input side or connect zener diode between control pin and GND, etc as a countermeasure to pass regulatory Safety Standard. Concrete countermeasure could be provided individually. However, customer should make the final judgment. (1) Reverse the DRAIN pin and SOURCE pin connection to the power supply board. (2) DRAIN pin short to CONTROL pin. (3) DRAIN pin short to SOURCE pin. Ver. AEF 5

Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most upto-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination, please understand that customers will bear the burden. (8) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618