The APOLLO Project: LV Power Supplies For The Next High Energy Physics Experiments

Similar documents
Cosmic Rays induced Single Event Effects in Power Semiconductor Devices

Annual Meeting. Task 4.8: DC Data Center with High Voltage isolation Virginia Tech Fred C Lee, Qiang Li and Shishuo Zhao.

The SIRAD irradiation facility at the INFN - Legnaro National Laboratory

The on-line detectors of the beam delivery system for the Centro Nazionale di Adroterapia Oncologica(CNAO)

The Compact Muon Solenoid Experiment. Conference Report. Mailing address: CMS CERN, CH-1211 GENEVA 23, Switzerland

A rad-hard 8-channel 12-bit resolution ADC for slow control applications in the LHC environment

GaN in Practical Applications

GaN Power ICs at 1 MHz+: Topologies, Technologies and Performance

200 MHz 350 MHz 750 MHz Linac2 RFQ2 202 MHz 0.5 MeV /m Weight : 1000 kg/m Ext. diameter : 45 cm

Unlocking the Power of GaN PSMA Semiconductor Committee Industry Session

A 2.5V Step-Down DC-DC Converter for Two-Stages Power Distribution Systems

CMS Conference Report

Topologies for Optimizing Efficiency, EMC and Time to Market

Study of a 3kW High-Efficient Wide-Bandgap DC- DC Power Converter for Solar Power Integration in 400V DC Distribution Networks

The CMS Muon Trigger

Triple GEM detector as beam monitor Monitors for Crystal experiment at SPS A compact Time Projection chamber with GEM

Prototype Performance and Design of the ATLAS Pixel Sensor

EUROPEAN ORGANIZATION FOR NUCLEAR RESEARCH European Laboratory for Particle Physics

CONTENTS 2/ /7 8/9 10/11 12/13 14/15 16/17 18/19 20/21 22/23 24/25 26/27 28/29 30/31 32/ Contact Us 38

The Inner Tracker detector of the LHCb experiment.

Herwig Schopper CERN 1211 Geneva 23, Switzerland. Introduction

Designing Reliable and High-Density Power Solutions with GaN

Phase 1 upgrade of the CMS pixel detector

Heavy Ion Irradiation of the XAA1.2 ASIC Chip for Space Application

AIDA Advanced European Infrastructures for Detectors at Accelerators. Conference Contribution

The LHCb VELO Upgrade. Stefano de Capua on behalf of the LHCb VELO group

VIENNA Rectifier & Beyond...

Measurement and Analysis for Switchmode Power Design

Layout and prototyping of the new ATLAS Inner Tracker for the High Luminosity LHC

Designing reliable and high density power solutions with GaN. Created by: Masoud Beheshti Presented by: Paul L Brohlin

The Compact Muon Solenoid Experiment. Conference Report. Mailing address: CMS CERN, CH-1211 GENEVA 23, Switzerland

A NOVEL FPGA-BASED DIGITAL APPROACH TO NEUTRON/ -RAY PULSE ACQUISITION AND DISCRIMINATION IN SCINTILLATORS

HV BOARD. Claudio Arnaboldi Gianluigi Pessina INFN, Milano. Thierry Gys, Didier Piedigrossi CERN. LHCb, 15/12/2004 1

Radiation Test Report Paul Scherer Institute Proton Irradiation Facility

Breaking Speed Limits with GaN Power ICs March 21 st 2016 Dan Kinzer, COO/CTO

Multitrack Power Factor Correction Architecture

CHAPTER 3. SINGLE-STAGE PFC TOPOLOGY GENERALIZATION AND VARIATIONS

AIDA-2020 Advanced European Infrastructures for Detectors at Accelerators. Milestone Report

The European Spallation Source. Dave McGinnis Chief Engineer ESS\Accelerator Division IVEC 2013

HV BOARD. Claudio Arnaboldi Tito Bellunato Gianluigi Pessina INFN, Milano. Thierry Gys, Didier Piedigrossi CERN. LHCb, 20/01/2005 Genova 1

Monolithic Pixel Sensors in SOI technology R&D activities at LBNL

Preparing for the Future: Upgrades of the CMS Pixel Detector

Operation and Performance of the ATLAS Level-1 Calorimeter and Level-1 Topological Triggers in Run 2 at the LHC

High-Speed/Radiation-Hard Optical Links

Progress in Radiation and Magnetic Field tests of CAEN HV and LV boards

The CMS ECAL Barrel HV system

Pixel characterization for the ITS/MFT upgrade. Audrey Francisco

User s Manual ISL70040SEHEV2Z. User s Manual: Evaluation Board. High Reliability

High-Power-Density 400VDC-19VDC LLC Solution with GaN HEMTs

Current sensor by IZM

The LHCb Upgrade BEACH Simon Akar on behalf of the LHCb collaboration

REDI. M. Wind (SL), P. Beck (SL), M. Latocha (SL), S. Metzger (INT), M. Poizat(ESA), M. Steffens (INT)

Power of GaN. Enabling designers to create smaller, more efficient and higher-performing AC/DC power supplies

IRHN7150 JANSR2N7268U

Gate Drive Optimisation

Electric Grid Modernization Enabled by SiC Device based Solid State Transformers and Innovations in Medium Frequency Magnetics

FAST DIGITIZING TECHNIQUES APPLIED TO SCINTILLATION DETECTORS

2008 JINST 3 S The RF systems and beam feedback. Chapter Introduction

irpc upgrade project for CMS during HL-LHC program

Department of Electrical and Information Engineering. Electronic Research Group

Taking advantage of SiC s high switching speeds with optimizations in measurement, layout, and design

Conventional Single-Switch Forward Converter Design

Results of FE65-P2 Pixel Readout Test Chip for High Luminosity LHC Upgrades

GaN Transistors for Efficient Power Conversion

The ALPHA facility at Indiana University New Capabilities for Dose Rate Testing

Inductor based switching DC-DC converter for low voltage power distribution in SLHC

GS66516T Top-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

Test results on 60 MeV proton beam at CYCLONE - UCL Performed on CAEN HV prototype module A June 2001 Introduction

GaN is Crushing Silicon. EPC - The Leader in GaN Technology IEEE PELS

Miniaturized High-Frequency Integrated Power Conversion for Grid Interface

Mauro CAPPELLI Francesco CORDELLA Massimo SEPIELLI

Maurizio Vretenar Linac4 Project Leader EuCARD-2 Coordinator

Satish K Dhawan Yale University

Mitigating high energy anomalous signals in the CMS barrel Electromagnetic Calorimeter

Installation, Commissioning and Performance of the CMS Electromagnetic Calorimeter (ECAL) Electronics

IBM Technology Symposium

25 Watt DC/DC converter using integrated Planar Magnetics

CHAPTER 2 DESIGN AND MODELING OF POSITIVE BUCK BOOST CONVERTER WITH CASCADED BUCK BOOST CONVERTER

Recent Approaches to Develop High Frequency Power Converters

All-SiC Modules Equipped with SiC Trench Gate MOSFETs

Designing High density Power Solutions with GaN Created by: Masoud Beheshti Presented by: Xaver Arbinger

GaN Power ICs: Integration Drives Performance

BR V, 1 A Non-Isolated Step Down DC/DC Converter Module BR300. Features and Benefits. Description. Applications: Typical Application Circuit

A High Efficient Integrated Planar Transformer for Primary-Parallel Isolated Boost Converters

Performance of the ATLAS Muon Trigger in Run I and Upgrades for Run II

Present and future beams for SHE research at GSI W. Barth, GSI - Darmstadt

100V ENHANCEMENT MODE HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) Michele Rossitto. Marketing Director MOSFETs and Power ICs

Spectrometer cavern background

A Lossless Clamp Circuit for Tapped-Inductor Buck Converters*

2.8 Gen4 Medium Voltage SST Development

VErtex LOcator (VELO)

IRHNJ57230SE JANSR2N7486U3 R 5 200V, N-CHANNEL REF: MIL-PRF-19500/704 RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-0.5) PD-93836C TECHNOLOGY

Cree PV Inverter Tops 1kW/kg with All-SiC Design

/ Little-Box Challenge

IRHNA57264SE JANSR2N7474U2 R 5 250V, N-CHANNEL REF: MIL-PRF-19500/684 RADIATION HARDENED POWER MOSFET SURFACE MOUNT (SMD-2) PD-93816G TECHNOLOGY

STUDY OF THE RADIATION HARDNESS OF VCSEL AND PIN ARRAYS

Radiation-hard/high-speed data transmission using optical links

D-Σ Digital Control for Improving Stability Margin under High Line Impedance

General Application Notes Remote Sense Remote On / Off Output Trim Series Operation Parallel Operation...

Quality assurance for CMS Tracker LV and HV Power Supplies

Transcription:

The A roject: V ower Supplies For The Next High Energy hysics Experiments Milano, ctober 19, 2011 Agostino anza, on behalf of the A Collaboration M. Alderighi (1,6), M. Citterio (1), M. Riva (1,8),. Cova (3,10), N. Delmonte (3,10), A. anza (3), R. Menozzi (10), A. accagnella (2,9), F. Sichirollo (2,9), G. Spiazzi (2,9), M. Stellini (2,9), S. Baccaro (4,5), F. Iannuzzo (4,7), A. Sanseverino (4,7), G. Busatto (7), V. De uca (7) (1) INFN Milano, (2) INFN adova, (3) INFN avia, (4) INFN Roma, (5) ENEA UTTMAT, (6) INAF, (7) University of Cassino, (8) University of Milano, (9) University of adova, (10) University of arma

Features of the S systems required by the present experiments (mainly at HC) Extensive use of the DC/DC technology, which requires a careful design in terms of EMC Integration with detectors at the design level, to avoid both mechanical and electrical criticalities Necessity of rad-hard devices, so to place modules in the experimental caverns Necessity of B-tolerant systems, to be able to place them close to detectors Implementation ti of redundancy, d because of difficult access of no access at all Very complex DCS systems, in order to get a fully remote control Industrial engineering design and industrial scale production Milano, ctober 19 2011 The A roject - Agostino anza 2

Requirements of future HC upgrades and new experiments New design, full replacing the present systems whose design dates from early 2000 years Increased rad-hard performance, because of the increased luminosity of accelerators Minimization of power loss in cables used for carrying current from S distributors to the front-end of detectors, moving distributors as close as possible to the front-end Increased B-tolerance of systems getting closer to detectors t and magnets Better reliability and controls, in order to reduce access time and increase the overall detector efficiency Avoiding industrial intellectual property, trying to implement the CERN pen Hardware policy Milano, ctober 19 2011 The A roject - Agostino anza 3

The A proposal System architectures Case study: ATAS Ar calorimeters Characteristics: Main isolated converter with N1 redundancy High DC bus 280 Vdc CRATE Card #3 D Card #2 Card er #1 Convert D Convert D er Convert D er Convert D er Convert D er Convert er ni Converter voltage Main DC/DC Converter (12V or more) ni Converter Distributed Non- Isolated oint of oad Converters (ni) with high step-down ratio Regulated DC bus ni Converter Converter with high step-down ratio Milano, ctober 19 2011 The A roject - Agostino anza 4

The A proposal System architectures arallel study: ATAS Muon detectors Characteristics: Main isolated converter with N1 redundancy High DC bus voltage (12V or more) Distributed ib t Non- Isolated oint of oad Converters (ni) with high step-down ratio, on-chamber installed and high B- tolerant 280 Vdc Main DC/DC Converter Regulated DC bus Muon Detectors Chamb #3 D Chamb #2 Convert Chamb D er #1 Convert D er Convert D er Convert D ni er Convert er Converter D Convert er Converter with high step-down ratio Milano, ctober 19 2011 The A roject - Agostino anza 5

The A proposal - Topologies 3modules1.5kWeach The Main DC/DC Converter redundancy n1 current sharing interleaved operations Switch In ine Converter - SIC phase shift operation ZVS transitions high efficiency reduced switch voltage stress high frequency capability V in C 4 C 3 C 2 i T 1 C 1 T 2 Q 4 Q 3 T 3 i Q 2 T T2 4 Q 1 C o V out = 12V 33 cm Efficiency 1 Transient response 0.9 (B ext = 13 cm 7cm 08 0.8 0.7 0.6 0) 0.5 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 utput power kw] V out I load - V out utput voltage response to a load step change (25 A 37 A) Milano, ctober 19 2011 The A roject - Agostino anza 6

The A proposal Thermal sizing 3D Finite Element Model (FEM) FE modeling of the main heating components: Input power MSFETs utput diodes Inductor lanar transformer Thermal measurements 1 Thermal characterization on single components, to validate models Thermal design Designed advanced solutions to improve heat exchange: ower MSFETs mounted on IMS board IST diode isolated package directly mounted on baseplate Copper thermal layers for transformer core cooling Silicone gap filler for transformer windings cooling Thermal simulation and measurements 2 reliminary thermal measurements on the air cooled whole converter Final requirements Main converter output t power = 3x1 kw Case dimensions: 150 x 402 x 285 mm 3 Max case temperature = 18 C Water cooling system delivery = 1.9 l/min, Δp = 350 mbar T inlet = 18 C, T outlet 25 C Milano, ctober 19 2011 The A roject - Agostino anza 7

The A proposal - Topologies Specifications: Input voltage: U g = 12 V utput voltage: U o =2.5V utput current: I o =3A p. frequency: f s =1MHz 350 nh air core inductors Dim.:=6cm,W=4.2cm The oint of oads C in U in 1 S 1 S 2 S 4 U C o R o U C C1 1 2 - S 3 - D<50% U o = U in D/2 Specifications: Input voltage: Ug =12V utput voltage: U o =2V utput current: I o = 20A p. frequency: f s = 280 khz 2.2 μh ferrite core inductors Dim.:=7cm,W=3.5cm S1 S C 1 4 S 3 1 2 Interleaved Buck with Voltage Divider IBVD Characteristics: Zero voltage switch turn on High step-down ratio Reduced switch voltage stress (U in /2) Interleaved operation with automatic current sharing and ripple cancellation Milano, ctober C 19 2011 The A roject - Agostino anza o 8

The A proposal Rad-hard devices Seeking for power MSFETs radiation tolerant up to 10kGy and 10 14 /(s cm 2 ) neutrons and protons: many components, with V d ranging from 30V to 200V and polarized in various configurations, were tested at the 60 Co γ ray source in the ENEA center of Casaccia, near Roma same components were tested with a heavy ion beam, 75 Br at 155MeV, at INFN aboratori Nazionali del Sud in Catania within the end of the year same components will be tested under neutrons, at the Casaccia nuclear reactor Tapiro, and under protons, at INFN NS Seeking for power MSFETs, controllers and FGA radiation tolerant: first irradiation was performed under 216MeV proton beam in Boston, at Massachusetts General Hospital facility, using some of devices irradiated in Italy. ther irradiation campaigns are planned at the same facilities in the next months Results are still preliminary and under analysis. ther irradiation campaigns are necessary in order to select good devices Milano, ctober 19 2011 The A roject - Agostino anza 9

The A proposal Rad-hard devices Some preliminary results of γ irradiation up to 9600 Gy of the 200V MSFET IRF630 Milano, ctober 19 2011 The A roject - Agostino anza 10

The A proposal New technologies Study of EC GaNs: Work in progress since early 2011 Two device types under test: 40V and 200V Difficulties found for soldering devices on CB Electrical characterization in progress Rad-hard tests will come soon V DC vc GaN test circuit DRIVER DUT C 1 i DUT R shunt V CC Measured voltage and current during switching periods of a GaN device R shunt = 85 mω U GS [1V/div] U GS [1V/div] U DS [20V/div] -I DS [1A/div] -I DS [1A/div] Time [10ns/div] Turn on interval @ V cc = 100V, I DS = 0A -p off (t) Turn off interval @ V cc = 100V, I DS = 5A Time [10ns/div] Milano, ctober 19 2011 The A roject - Agostino anza 11

The A proposal New technologies Study of high-b materials: Collaboration with the private company FN S.p.A. Base material by Hoganas, FES168 HQ, Fe Si(6.5-6.9%) 69%) roblems found and solved in the injection moulding phase Still problems in the sintherization phase First B tests by end of the year (hopefully) First moulded samples of FES168 Collaboration with a CERN group (F. Faccio). It aims at studying current sharing of already existing integrated DC/DC converters with low output currents (< 3A), designed by that group Milano, ctober 19 2011 The A roject - Agostino anza 12