Dual SPST Switches DG, DG8, DG9 DESCRIPTION The DG, DG8, and DG9 are low voltage, precision dual SPST switches that can be operated in a single supply or in a dual supply configuration power supply with low power dissipation. The DG, DG8 and DG9 can switch both analog and digital signals within the power supply rail, and conduct well in both directions. Fabricated with advance submicron CMOS process, these switches provide high precision low and flat ON resistance, low leakage current, low parasitic capacitance, and low charge injection. The DG, DG8 and DG9 contain two independent Single Pole Single Throw (SPST) switches. Switch- and switch- are normally open for the DG and normally closed for the DG8. For the DG9, switch- is normally open and switch- is normally closed with a Break-Before-Make switching timing. The DG, DG8 and DG9 are the ideal switches for use in low voltage instruments and healthcare devices, fitting the circuits of low voltage ADC and DAC, analog front end gain control, and signal path control. As a committed partner to the community and the environment, manufactures this product with lead (Pb)-free device termination. As a further sign of 's commitment, the DG, DG8 and D9 are fully RoHS compliant and halogen-free. FEATURES Halogen-free According to IEC 9-- Definition Low and flat switch on resistance,. /typ Low leakage and parasitic capacitance MHz, - db bandwidth Latch-up current > ma (JESD8) Over voltage tolerant TTL/CMOS compatible Compliant to RoHS Directive /9/EC APPLICATIONS Healthcare and medical devices Test instruments Portable meters Data acquisitions Control and automation PDAs and modems Communication systems Audio, video systems Mechanical reed relay replacement FUNCTIONAL BLOCK DIAGRAM AND PIN CONFIGURATION DG, MSOP- DG8, MSOP- DG9, MSOP- NO NC NO COM IN 9 8 IN COM NO COM IN 9 8 IN COM NC COM IN 9 8 IN COM NC Top View TRUTH TABLE (DG, DG8) DG DG8 Switches Logic Off On Top View Top View TRUTH TABLE (DG9) Logic Switch- Switch- Off On On Off ORDERING INFORMATION Temperature Range Package Part Number - C to 8 C Document Number: S--Rev. A, -Aug- MSOP- MSOP- MSOP- DGDQ-T-GE DG8DQ-T-GE DG9DQ-T-GE THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 ABSOLUTE MAXIMUM RATINGS Parameter Limit Unit Referenced to -. to IN, COM, NC, NO a -. to ( +.) V Continuous Current (Any Terminal) ± Peak Current (Pulsed at ms, % duty cycle) ± ma Storage Temperature (D Suffix) - to C Power Dissipation (Packages) b MSOP- c mw Notes: a. Signals on NC, NO, or COM or IN exceeding will be clamped by internal diodes. Limit forward diode current to maximum current ratings. b. All leads welded or soldered to PC board. c. Derate mw/ C above C. SPECIFICATIONS ( = V, = ) Parameter Analog Switch Analog Signal Range d Symbol Test Conditions Otherwise Unless Specified = V, =, ± %, V IN =. V or. V e Temp. a Limits - C to 8 C Min. b Typ. c Max. b V NO, V NC V COM V On-Resistance =. V, =, V COM = to, I NO, I NC = - ma Flatness d Match d Flatness Match =. V, =, V COM =. V to. V, I NO, I NC = - ma =. V, =, V D =. V to. V, I D = - ma I NO(off) I Switch Off Leakage Current NC(off) =. V, =, V NO, V NC = V/ V, V COM = V/ V I COM(off) =. V, =, Channel-On Leakage Current I COM(on) V NO, V NC = V COM = V/ V Digital Control.. Input High Voltage V INH Input Low Voltage V INL. V Input Capacitance d C in f = MHz. pf Input Current I INL or I INH V IN = or - µa Dynamic Characteristics Turn-On Time t ON V NO or V NC = V, =, C L = pf, figures and Turn-Off Time t OFF ns Charge Injection d Q INJ C L = nf, V GEN =, R GEN =, figure.8 pc Bandwidth d BW = V, =, C L = pf, - db 9 MHz Off-Isolation d OIRR - =, C L = pf, f = MHz Crosstalk d X TALK - 9 Off-Isolation d OIRR - =, C L = pf, f = MHz Crosstalk d X TALK - 9 db Source-Off Capacitance d C NC/NO(off) 8 Drain-Off Capacitance d C COM(off) V IN = or, f = MHz 9 pf Channel-On Capacitance d C ON Power Supply Power Supply Current I+ V IN = or, =. V µa - -. - -. - -...9... Unit na Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 SPECIFICATIONS ( = V, = ) Parameter Analog Switch Symbol Test Conditions Otherwise Unless Specified = V, =, ± %, V IN =.8 V or. V e Temp. a Limits - C to 8 C Min. b Typ. c Max. b Unit Analog Signal Range d V NO, V NC V COM V On-Resistance =. V, =, V COM = to, I NO, I NC = ma Flatness d Match d Flatness Match =. V, =, V COM =. V to V, I NO, I NC = ma =. V, =, I D = ma, V COM =. V to V I NO(off) I Switch Off Leakage Current NC(off) =. V, =, V NO, V NC = V/. V, V COM =. V/ V I COM(off) =. V, =, Channel-On Leakage Current I COM(on) V NO, V NC = V COM = V/. V Digital Control......9 V IN = or, f = MHz Input High Voltage V INH. Input Low Voltage V INL.8 V Input Capacitance C in f = MHz. pf Input Current I INL or I INH V IN = or -... µa Dynamic Characteristics Turn-On Time d t ON V NO or V NC = V, =, C L = pf, figures and Turn-Off Time d t 9 OFF ns Charge Injection d Q INJ C L = nf, V GEN =, R GEN =, figure. pc Bandwidth d BW = V, =, C L = pf, - db MHz Off-Isolation d OIRR - =, C L = pf, f = MHz Crosstalk d X TALK - 9 Off-Isolation d OIRR - =, C L = pf, f = MHz Crosstalk d X TALK - 9 db Source-Off Capacitance d C NC/NO(off) 8 Drain-Off Capacitance d C COM(off) 9 pf Channel-On Capacitance d C ON Power Supply Power Supply Range.. V Power Supply Current I+ V IN = or, =. V µa - -. - -. - -.... na Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 SPECIFICATIONS ( = +. V, = -. V) Parameter Analog Switch Symbol Test Conditions Otherwise Unless Specified = +. V, = -. V, ± %, V IN =.8 V or. V e Temp. a Limits - C to 8 C Min. b Typ. c Max. b Unit Analog Signal Range V NO, V NC V COM V On-Resistance = +. V, = -. V, V COM = to, I NO, I NC = ma Flatness Match Flatness Match = +. V, = -. V, V COM = ±. V,, I NO, I NC = ma = +. V, = -. V, V COM = ±. V, I NO, I NC = ma I NO(off) I Switch Off Leakage Current NC(off) = +. V, = -. V, = ±. V, V D = ±. V I COM(off) = +. V, = -. V, Switch on Leakage I COM(on) = V D = ±. V Digital Control Notes: a. = C, = as determined by the operating suffix. b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet. c. Typical values are for design aid only, not guaranteed nor subject to production testing. d. Guarantee by design, nor subjected to production test. e. V IN = input voltage to perform proper function. f. Not production tested.......9 Input High Voltage V INH. Input Low Voltage V INL.8 V Input Capacitance C in f = MHz. pf Input Current I INL or I INH V IN = or -.. µa Dynamic Characteristics Turn-On Time d t ON V NO or V NC = V, =, C L = pf Turn-Off Time d t OFF ns Charge Injection d Q INJ C L = nf, V GEN =, R GEN =. pc V IN = or, f = MHz Bandwidth d BW = +. V, = -. V, =, C L = pf, - db MHz Off-Isolation d OIRR = +. V, = -. V, - Crosstalk d X TALK =, C L = pf, - db, f = MHz - 9 Off-Isolation d OIRR = +. V, = -. V, - db Crosstalk d X TALK =, C L = pf, - db, f = MHz - 9 Source-Off Capacitance d C NC/NO(off) Drain-Off Capacitance d C COM(off) pf Channel-On Capacitance d C ON Power Supply Power Supply Range.. V Power Supply I+ V IN = or, =. V µa - -. - -. - -.... na Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
TYPICAL CHARACTERISTICS (T A = C, unless otherwise noted) DG, DG8, DG9 - On-Resistance (Ω) =.8 V =. V T = C INO/NC = - ma =. V =. =. V =. V =. =. V - On-Resistance (Ω) 9 8 =. V INO/NC = - ma + C + 8 C - C...... V D - Analog Voltage (V)..8.....8 V D - Analog Voltage (V) vs. V D and Single Supply Voltage vs. Analog Voltage and Temperature... =. V INO/NC = - ma + C + 8 C + 8 C V = ±. V IN O /N C = - ma - On-Resistance (Ω)...... - C - On-Resistance (Ω) + C - C............ V D - Analog Voltage (V) vs. Analog Voltage and Temperature -. - -. - -.... V COM - Analog Voltage (V) vs. Analog Voltage and Temperature ma Leakage Current (pa) =. V I COM(ON) I COM(OFF) I+ - Supply Current (A) ma µa µa µa na na =. V =. =. V =. I NO(OFF) na =.8 V. - - - 8 Temperature ( C) Leakage Current vs. Temperature pa K K K M M Input Switching Frequency (Hz) Supply Current vs. Input Switching Frequency Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 TYPICAL CHARACTERISTICS (T A = C, unless otherwise noted) V T - Switching Threshold (V)....9 V IH.8.. V IL.......9.8............ - Supply Voltage (V) Switching Threshold vs. Supplz Voltage Crosstalk (db) - - - - - - - - 8-9 - Frequency (MHz) Crosstalk vs. Frequency Loss (db) - - - - - - - - 8 Frequency (MHz) Insertion Loss vs. Frequency Off Isolation (db) - - - - - - - - 8-9 - Frequency (MHz) Off Isolation vs. Frequency TEST CIRCUITS + V = V S D Logic Input V % t r < ns t f < ns V IN = V IN C L pf Switch Input Switch Output 9 % t OFF = + R DS(on) t ON Figure. Single Supply Switching Time Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 TEST CIRCUITS +. V V IN = V = V S IN D -. V = + R DS(on) C L pf Logic Input Switch Input Switch Output V % t ON 9 % t OFF t r < ns t f < ns Figure. Dual Supply Switching Time + V R g S D V g V IN C L pf IN X ON OFF ON = measured voltage error due to charge injection The charge injection in coulombs is Q = C L x Figure. Charge Injection + V C S D nf V R g = V IN = / V IN C,. V IN COM NC or NO Meter HP9A Impedance Analyzer or Equivalent f = MHz nf Off Isolation = log Figure. Off-Isolation Figure. Channel Off/On Capacitance Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
DG, DG8, DG9 Vishay Semiconductors TEST CIRCUITS C + V S D R g = Ω IN Ω V IN = / V NC S D V IN = / V IN C X TALK = log C = RF bypass Figure. Channel to Channel Crosstalk maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see /ppg?. 8 Document Number: S--Rev. A, -Aug- THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT /doc?9
Package Information MSOP: LEADS JEDEC Part Number: MO-8, (Variation AA and BA) (N/) Tips) N N- A B C X. E..8 Max Detail B (Scale: /) Dambar Protrusion.. N/ Top View b.8 M C B S A S b e See Detail B e A With Plating c c BSC Parting Line L Detail A (Scale: /) NOTES:. Die thickness allowable is.... Dimensioning and tolerances per ANSI.Y.M-99.. Dimensions D and E do not include mold flash or protrusions, and are measured at Datum plane -H-, mold flash or protrusions shall not exceed. mm per side.. Dimension is the length of terminal for soldering to a substrate.. Terminal positions are shown for reference only.. Formed leads shall be planar with respect to one another within. mm at seating plane.. The lead width dimension does not include Dambar protrusion. Allowable Dambar protrusion shall be.8 mm total in excess of the lead width dimension at maximum material condition. Dambar cannot be located on the lower radius or the lead foot. Minimum space between protrusions and an adjacent lead to be. mm. See detail B and Section C-C. 8. Section C-C to be determined at. mm to mm from the lead tip. 9. Controlling dimension: millimeters. D Side View.9. This part is compliant with JEDEC registration MO-8, variation AA and BA.. Datums -A- and -B- to be determined Datum plane -H-.. Exposed pad area in bottom side is the same as teh leadframe pad size. A. R. Min Places Seating Plane. C Seating Plane Base Metal See Detail A A. S Section C-C Scale: / (See Note 8) ς E End View N = L MILLIMETERS Dim Min Nom Max Note A - -. A... A..8.9 b. -. 8 b... 8 c. -. c...8 D. BSC E.9 BSC E.9.. e. BSC e. BSC L... N ECN: T-8 Rev. C, -Jul- DWG: 8 C C -H- -A- -C- -B- Document Number: -Jul-
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