QPD0020S2. 35 W, 48 V, DC 6 GHz, GaN RF Power Transistor. Product Overview. Key Features. Functional Block Diagram. Applications. Ordering Information

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Product Overview The is a 35 W unmatched discrete GaN on SiC HEMT which operates from DC to 6 GHz on a +48 V supply rail. It is ideally suited for base station, radar and communications applications and can support both CW and pulsed mode of operations. The can be used in Doherty architecture for the final stage of a base station power amplifier for small cell, microcell, and active antenna systems. The can also be used as a driver in a macrocell base station power amplifier. The device is housed in an industry-standard 4x3 mm surface mount QFN package. Lead-free and ROHS compliant. Key Features 20 Pin 4x3 mm QFN Package Operating Frequency Range: DC to 6 GHz Operating Drain Voltage: +48 V Maximum Output Power (PSAT): 34.7 W (1) Maximum Drain Efficiency: 77.8% (1) Efficiency-Tuned P3dB Gain: 18.8 db (1) Surface Mount Plastic Package Functional Block Diagram Notes: 1. Based on 2.7 GHz load pull data. Applications W-CDMA / LTE Macrocell Base Station Driver Microcell Base Station Small Cell Final Stage Active Antenna Land Mobile and Military Radio Communications General Purpose Applications Ordering Information Part Number S2 TR7 EVB02 Description Sample 2 Pieces 7 Reel 500 Pieces 2.62 2.69 GHz Evaluation Board Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 1 of 11 www.qorvo.com

Absolute Maximum Ratings Parameter Breakdown Voltage (BVDG) Gate Voltage Range (VG1,2) Drain Voltage (VD1,2) Peak RF Input Power VSWR Mismatch, P1dB Pulse (20% Duty Cycle, 100 µs Width), Rating +165 V 7 to +2 V +55 V 29 dbm 10:1 Storage Temperature 65 to 150 C Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to device may reduce device reliability. Recommended Operating Conditions Parameter Min Typ Max Units Gate Voltage (VG) 2.7 V Drain Voltage (VD) +48 V Quiescent Current (IDQ) 30 ma Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Parameter Conditions Min Typ Max Units Operational Frequency Range 2620 Quiescent Current 30 ma Gain 3 db Compression 16.7 db Power (PSAT) 3 db Compression 44.1 dbm Drain Efficiency 3 db Compression 68.2 % Test conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW signal (10% duty cycle, 1 ms width) on a single-ended reference design fixture tuned for 2620. Thermal Information Parameter Conditions Values Units Thermal Resistance, Peak IR Surface Temperature at Average Power (θjc) Thermal Resistance, Peak IR Surface Temperature at Average Power (θjc) TCASE = +105 C, TCH = 144 C CW: PDISS = 7.4 W, POUT = 1.6 W TCASE = +105 C, TCH = 169 C CW: PDISS = 10.9 W, POUT = 5.6 W 5.3 C/W 5.9 C/W Notes: 1. Thermal resistance is measured to package backside. 2. Refer to the following document: GaN Device Channel Temperature, Thermal Resistance, and Reliability Estimates Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 2 of 11 www.qorvo.com

EVB02 Layout 2.62 2.69 GHz Reference Design EVB02 Bill of Materials Reference Des. Value Description Manuf. Part Number C1, C2 3 pf Capacitor, 3 pf, ±0.1pF, 250 V, C0G, 0805 ATC 600F3R0BT250XT C3 2 pf Capacitor, 2 pf, ±0.1 pf, 250 V, C0G, 0805 ATC 600F2R0BT250XT C4, C7 10 pf Capacitor, 10 pf, ±1%, 250 V, C0G, 0805 ATC 600F100FT250XT C5, C6 4.7 µf Capacitor, 4.7 µf, ±20%, 50 V, X5R, 0805 Murata GRT21BR61H475ME13L C8, C9 10 µf Capacitor, 10 µf, ±20%, 50 V, STD, 2220 TDK C5750X7R1H106K230KB C10 220 µf Capacitor, 220 µf, ±20%, 50 V, Electrolytic United Chemi-Con EMVY500ADA221MJA0G R1 47 Ω Resistor, 47 Ω, ±5%, 1/10 W, 0805 Panasonic ERJ-6GEYJ470 R2 20 Ω Resistor, 20 Ω, ±5%, 1/10 W, 0805 Panasonic ERJ-6GEYJ200 U1 35 W, 48 V, DC 6 GHz, GaN RF Transistor Qorvo Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 3 of 11 www.qorvo.com

Peak Power at 0.01% CCDF (dbm) Lower ACPR (dbc) Gain (db) Drain Efficiency (%) Gain (db) Drain Efficiency (%) EVB02 Performance Plots 22 21 Gain vs. Output Power Pulsed CW (Duty Cycle = 10%, Period = 1 ms) 80 70 Drain Efficiency vs. Output Power Pulsed CW (Duty Cycle = 10%, Period = 1 ms) 20 19 18 17 60 50 40 30 16 20 15 10 14 27 29 31 33 35 37 39 41 43 45 Output Power (dbm) 0 27 29 31 33 35 37 39 41 43 45 Output Power (dbm) 22 21 20 19 Gain vs. Average Output Power 1C WCDMA, PAR = 8 db @ 0.01% CCDF 55 50 45 40 35 30 Drain Efficiency vs. Average Output Power 1C WCDMA, PAR = 8 db @ 0.01% CCDF 18 25 17 20 15 16 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Average Output Power (dbm) 47 46 45 44 43 42 41 40 39 38 37 36 Peak Power vs. Average Output Power 1C WCDMA, PAR = 8 db @ 0.01% CCDF 35 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Average Output Power (dbm) 10 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Average Output Power (dbm) -26-28 -30-32 -34-36 -38-40 -42-44 ACPR vs. Average Output Power 1C WCDMA, PAR = 8 db @ 0.01% CCDF -46 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Average Output Power (dbm) Test conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW signal (10% duty cycle, 1 ms period) on a 2620 reference design fixture. Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 4 of 11 www.qorvo.com

S 21 (db) S 11, S 22 (db) EVB02 Performance Plots 25 20 Small Signal Gain vs. Frequency 15 10 5 0-5 -10-15 -20-25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (GHz) 2 0-2 -4-6 -8-10 -12 Return Loss vs. Frequency IRL ORL -14-16 -18 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Frequency (GHz) Test conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW signal (10% duty cycle, 1 ms period) on a 2620 reference design fixture. Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 5 of 11 www.qorvo.com

Power-Matched Load Pull Performance Frequency (MHz) Source Impedance (Ω) Load Impedance (Ω) P3dB (dbm) Drain Efficiency (%) G3dB (db) 2500 2.87 + j1.08 14.06 + j5.73 45.3 62.5 18.5 2600 2.86 + j1.07 13.72 + j7.59 45.3 67.6 18.5 2700 4.10 + j0.01 14.16 + j7.51 45.4 68.2 17.5 Test conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW (20% duty cycle, 100 µs width). Efficiency-Matched Load Pull Performance Frequency (MHz) Source Impedance (Ω) Load Impedance (Ω) P3dB (dbm) Drain Efficiency (%) G3dB (db) 2500 2.87 + j1.08 9.32 + j17.22 43.4 78.3 20.4 2600 2.86 + j1.07 10.41 + j15.61 43.8 76.8 19.6 2700 4.10 + j0.01 8.59 + j16.46 43.1 77.8 18.8 Test conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW (20% duty cycle, 100 µs width). Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 6 of 11 www.qorvo.com

Load Pull Contours Test Conditions unless otherwise noted: VD = +48 V, IDQ = 30 ma,, pulsed CW (20% duty cycle, 100 µs width). Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 7 of 11 www.qorvo.com

Package Marking and Pin Configuration Marking: Qorvo Logo Part Number 0020 Date Code YYWW Production Lot Number - MXXX Pin Number Label Description 1, 2 NC Not Connected 3, 4 RF IN / VG RF Input / Gate Voltage 5, 6, 7, 8, 9, 10, 11, 12 NC Not Connected 13, 14 RF OUT / VD RF Output / Drain Voltage 15, 16, 17, 18, 19, 20 NC Not Connected 21 GND Source to be connected to ground Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 8 of 11 www.qorvo.com

Package Dimensions Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. General tolerance is ±0.25. 3. Part is overmold encapsulated. 4. Contact plating is NiPdAu. Au thickness is 0.00254 to 0.01501 µm. Bias Procedure Bias-Up Procedure Bias-Down Procedure 1. Set VG to 4 V. 1. Turn off RF signal. 2. Apply +48 V VD. 2. Turn off VD. 3. Slowly adjust VG until ID is set to 30 ma. 3. Wait two (2) seconds to allow drain capacitor to discharge. 4. Apply RF. 4. Turn off VG. Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 9 of 11 www.qorvo.com

Recommended Solder Temperature Profile Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 10 of 11 www.qorvo.com

Handling Precautions Parameter Rating Standard ESD Human Body Model (HBM) TBD ANSI/ESDA/JEDEC Standard JS-001 ESD Charged Device Model (CDM) TBD ANSI/ESDA/JEDEC Standard JS-002 MSL Moisture Sensitivity Level TBD IPC/JEDEC Standard J-STD-020 Caution! ESD-Sensitive Device Solderability Compatible with lead-free (260 C max. reflow temp.) soldering processes. Package lead plating is NiPdAu. Au thickness is 0.00254 to 0.01501 µm. RoHS Compliance This part is compliant with 2011/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) as amended by Directive 2015/863/EU. This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free Pb Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com For technical questions and application information: Email: BTSApplications@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMANCE, USAGE OF TRADE OR OTHERWISE, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 2018 Qorvo, Inc. Qorvo is a registered trademark of Qorvo, Inc. Data Sheet Rev. A, December 11, 2018 Subject to change without notice. 11 of 11 www.qorvo.com