Schottky Barrier Diode Schottky barrier diodes are optimized for very low forward voltage drop and low leakage current and are used in a wide range of dc dc converter, clamping and protection applications in portable devices. NSR0340V in a miniature package enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. Features Very Low Forward Voltage Drop 40 mv @ 00 ma Low Reverse Current 0.5 A @ 5 V V R 50 ma of Continuous Forward Current Power Dissipation of 00 mw with Minimum Trace Very High Switching Speed Low Capacitance C T = 6 pf This is a Pb Free Device Typical Applications LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc dc Converters Reverse Voltage and Current Protection Clamping & Protection Markets Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs and PDAs GPS MAXIMUM RATINGS Rating Symbol Value Unit Reverse Voltage V R 40 Vdc Forward Continuous Current (DC) I F 50 ma Non Repetitive Peak Forward Surge Current ESD Rating: Human Body Model Machine Model I FSM.0 A ESD Class Class A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 40 VOLT SCHOTTKY BARRIER DIODE CATHODE ANODE ORDERING INFORMATION Device Package Shipping NSR0340VTG CASE 50 MARKING DIAGRAM (Pb Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. AD M AD = Device Code M = Date Code* = Pb Free Package (Note: Microdot may be in either location) *Date Code orientation position may vary depending upon manufacturing location. NSR0340VT5G (Pb Free) 8000 / Tape & Reel Semiconductor Components Industries, LLC, 03 June, 03 Rev. Publication Order Number: NSR0340VT/D
THERMAL CHARACTERISTICS Thermal Resistance Junction to Ambient (Note ) Total Power Dissipation @ T A = 5 C Thermal Resistance Junction to Ambient (Note ) Total Power Dissipation @ T A = 5 C Characteristic Symbol Max Unit R JA 600 P D 00 R JA 300 P D 400 Junction and Storage Temperature Range T J, T stg 55 to +50 C. Mounted onto a 4 in square FR 4 board 0 mm sq. oz. Cu 0.06 thick single sided. Operating to steady state.. Mounted onto a 4 in square FR 4 board in sq. oz. Cu 0.06 thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (T A = 5 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Reverse Leakage (V R = 0 V) (V R = 5 V) (V R = 40 V) Forward Voltage (I F = 0 ma) (I F = 00 ma) (I F = 00 ma) Total Capacitance (V R = 0 V, f = MHz) I R 0. 0.5.5 V F 30 40 470 CT 6.0.0 3.0 6.0 350 450 50 C/W mw C/W mw A mv pf Reverse Recovery Time (I F = I R = 0 ma, I R =.0 ma) t rr 5.0 ns DC Current Source + 0. F 0 V t r t p 0% 750 H I F V R 90% 50 Output Pulse Generator 0. F I F Pulse Generator Output Adjust for I RM DUT t rr R L = 50 50 Input Oscilloscope Current Transformer. DC Current Source is adjusted for a Forward Current (I F ) of 0 ma.. Pulse Generator Output is adjusted for a Peak Reverse Recovery Current I RM of 0 ma. 3. Pulse Generator transition time << t rr. 4. I R(REC) is measured at ma. Typically 0. X I RM or 0.5 X I RM. 5. t p» t rr I RM i R(REC) = ma Output Pulse (I F = I RM = 0 ma; measured at i R(REC) = ma) Figure. Recovery Time Equivalent Test Circuit
I F, FORWARD CURRENT (ma) 000 00 5 C 0 50 C 0. 85 C 5 C 40 C I R, REVERSE CURRENT ( A) 0000 000 50 C 00 5 C 0 85 C 0. 5 C 0.0 0.00 40 C 0.000 0.0 0.0000 0 0. 0. 0.3 0.4 0.5 0.6 0 5 0 5 0 5 30 35 40 V F, FORWARD VOLTAGE (V) V R, REVERSE VOLTAGE (V) Figure. Forward Voltage Figure 3. Leakage Current 30 C T, TOTAL CAPACITANCE (pf) 5 0 5 0 5 T A = 5 C 0 0 5 0 5 0 5 30 35 40 V R, REVERSE VOLTAGE (V) Figure 4. Total Capacitance 3
PACKAGE DIMENSIONS CASE 50 ISSUE E X b 0.08 M X Y TOP VIEW D X E A Y NOTES:. DIMENSIONING AND TOLERANCING PER ASME Y4.5M, 994.. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO- TRUSIONS, OR GATE BURRS. MILLIMETERS DIM MIN NOM MAX A 0.50 0.60 0.70 b 0.5 0.30 0.35 c 0.07 0.4 0.0 D.0.0.30 E 0.70 0.80 0.90 H E.50.60.70 L 0.30 REF L 0.5 0.0 0.5 c HE SIDE VIEW RECOMMENDED SOLDERING FOOTPRINT* X L X 0.48.80 X 0.40 X L BOTTOM VIEW PACKAGE OUTLINE DIMENSION: MILLIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 807 USA Phone: 303 675 75 or 800 344 3860 Toll Free USA/Canada Fax: 303 675 76 or 800 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800 8 9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 4 33 790 90 Japan Customer Focus Center Phone: 8 3 587 050 4 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative NSR0340VT/D
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