Department of Astronomy, Graduate School of Science, the University of Tokyo, Hongo, Bunkyo-ku, Tokyo , Japan;

Similar documents
Influence of dielectric substrate on the responsivity of microstrip dipole-antenna-coupled infrared microbolometers

PROFILE CONTROL OF A BOROSILICATE-GLASS GROOVE FORMED BY DEEP REACTIVE ION ETCHING. Teruhisa Akashi and Yasuhiro Yoshimura

Supplementary Figure 1 Reflective and refractive behaviors of light with normal

Angela Piegari ENEA, Optical Coatings Laboratory, Roma, Italy

Printing Beyond srgb Color Gamut by. Mimicking Silicon Nanostructures in Free-Space

Supplementary Figure S1. Schematic representation of different functionalities that could be

attosnom I: Topography and Force Images NANOSCOPY APPLICATION NOTE M06 RELATED PRODUCTS G

Sub-50 nm period patterns with EUV interference lithography

In their earliest form, bandpass filters

Infrared wire grid polarizers: metrology, modeling, and laser damage threshold

Achievement of Arbitrary Bandwidth of a Narrow Bandpass Filter

Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator

Compact ellipsometer employing a static polarimeter module with arrayed polarizer and wave-plate elements

Super-resolution imaging through a planar silver layer

Micro-sensors - what happens when you make "classical" devices "small": MEMS devices and integrated bolometric IR detectors

Fabrication of Silicon Master Using Dry and Wet Etching for Optical Waveguide by Thermal Embossing Technique

Filters for Dual Band Infrared Imagers

Micro-Mechanical Slit Positioning System as a Transmissive Spatial Light Modulator

Waveguiding in PMMA photonic crystals

Hermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films

Confocal Imaging Through Scattering Media with a Volume Holographic Filter

Development and Applications of a Sample Compartment FTIR Microscope

3.3. Purpose. Problem Discussion. Selection of Detector Material. Recent Developments in Photoconductive Infrared Arrays

This writeup is adapted from Fall 2002, final project report for by Robert Winsor.

Supplementary information for Stretchable photonic crystal cavity with

SUPPLEMENTARY INFORMATION

Development of Si/SiO 2 Multilayer Type AFM Tip Characterizers

Guided resonance reflective phase shifters

Realization of Polarization-Insensitive Optical Polymer Waveguide Devices

Design Thin Film Narrow Band-pass Filters For Dense Wavelength Division Multiplexing

Design and Fabrication of an Efficient Extreme Ultraviolet Beam Splitter

The Department of Advanced Materials Engineering. Materials and Processes in Polymeric Microelectronics

High Performance Thin Film Optical Coatings Technical Reference Document 09/13. Coatings Capabilities. Heat Control - Hot Mirror Filters

Fabrication of microstructures on photosensitive glass using a femtosecond laser process and chemical etching

StarBright XLT Optical Coatings

University of New Orleans. Jian Liu. Rasheed M.A. Azzam University of New Orleans,

Dual band antireflection coatings for the infrared

Spectrally Selective Photocapacitance Modulation in Plasmonic Nanochannels for Infrared Imaging

Photolithography Technology and Application

Angela Piegari ENEA, Optical Coatings Laboratory, Roma, Italy

Part 5-1: Lithography

The Simulation, Design, and Fabrication of Optical Filters

REOSC PIXELATED AND ADVANCED IR COATINGS

BARR ASSOCIATES, INC.

Mobile Electrostatic Carrier (MEC) evaluation for a GaAs wafer backside manufacturing process

Characterization of Silicon-based Ultrasonic Nozzles

SUPPLEMENTARY INFORMATION

2. Pulsed Acoustic Microscopy and Picosecond Ultrasonics

Optical Characterization and Defect Inspection for 3D Stacked IC Technology

GSM OPTICAL MONITORING FOR HIGH PRECISION THIN FILM DEPOSITION

SC Index Ratio Varied

A large-area wireless power transmission sheet using printed organic. transistors and plastic MEMS switches

3-5μm F-P Tunable Filter Array based on MEMS technology

Monolithically integrated InGaAs nanowires on 3D. structured silicon-on-insulator as a new platform for. full optical links

Optics Communications

Chapter 2 Silicon Planar Processing and Photolithography

arxiv: v1 [astro-ph.im] 22 Jul 2014

State-of-the-art device fabrication techniques

True Three-Dimensional Interconnections

A thin foil optical strain gage based on silicon-on-insulator microresonators

POLYMER MICROSTRUCTURE WITH TILTED MICROPILLAR ARRAY AND METHOD OF FABRICATING THE SAME

Infrared frequency selective surfaces: design, fabrication and measurement

Fabrication of a submicron patterned using an electrospun single fiber as mask. Author(s)Ishii, Yuya; Sakai, Heisuke; Murata,

Bandpass filter arrays patterned by photolithography for multispectral

High Resolution Backside Imaging and Thermography using a Numerical Aperture Increasing Lens

Design and Analysis of Resonant Leaky-mode Broadband Reflectors

Fabrication and application of a wireless inductance-capacitance coupling microsensor with electroplated high permeability material NiFe

Tunable Color Filters Based on Metal-Insulator-Metal Resonators

Design, Fabrication and Characterization of Very Small Aperture Lasers

Module - 2 Lecture - 13 Lithography I

Horizontal single and multiple slot waveguides: optical transmission at λ = 1550 nm

Development of a MEMS-based Dielectric Mirror

Inverted-COR: Inverted-Occultation Coronagraph for Solar Orbiter

Fabrication of Sub-THz Oscillators Using Resonant Tunneling Diodes Integrated with Slot Antennas

Supplementary Figure 1: Optical Properties of V-shaped Gold Nanoantennas a) Illustration of the possible plasmonic modes.

University of New Orleans. S. R. Perla. R. M.A. Azzam University of New Orleans,

Components of Optical Instruments. Chapter 7_III UV, Visible and IR Instruments

Miniature Mid-Infrared Thermooptic Switch with Photonic Crystal Waveguide Based Silicon-on-Sapphire Mach Zehnder Interferometers

Si Nano-Photonics Innovate Next Generation Network Systems and LSI Technologies

Evaluation of infrared collimators for testing thermal imaging systems

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

Lithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004

REPORT DOCUMENTATION PAGE

why TECHSPEC? From Design to Prototype to Volume Production

Manufacturing Process of the Hubble Space Telescope s Primary Mirror

TECHNICAL QUICK REFERENCE GUIDE MANUFACTURING CAPABILITIES GLASS PROPERTIES COATING CURVES REFERENCE MATERIALS

Design and fabrication of indium phosphide air-bridge waveguides with MEMS functionality

Etched Silicon Gratings for NGST

Title detector with operating temperature.

Chapter 3 Fabrication

High Speed pin Photodetector with Ultra-Wide Spectral Responses

Development of Orderly Micro Asperity on Polishing Pad Surface for Chemical Mechanical Polishing (CMP) Process using Anisotropic Etching

Development of a Thin Double-sided Sensor Film EXCLEAR for Touch Panels via Silver Halide Photographic Technology

Soft Electronics Enabled Ergonomic Human-Computer Interaction for Swallowing Training

Smart Vision Chip Fabricated Using Three Dimensional Integration Technology

A Laser-Based Thin-Film Growth Monitor

Spectral and Polarization Configuration Guide for MS Series 3-CCD Cameras

Chapter Ray and Wave Optics

High-yield Fabrication Methods for MEMS Tilt Mirror Array for Optical Switches

CCD Analogy BUCKETS (PIXELS) HORIZONTAL CONVEYOR BELT (SERIAL REGISTER) VERTICAL CONVEYOR BELTS (CCD COLUMNS) RAIN (PHOTONS)

Transcription:

Verification of the controllability of refractive index by subwavelength structure fabricated by photolithography: toward single-material mid- and far-infrared multilayer filters Hironobu Makitsubo* a,b, Takehiko Wada b, Makoto Mita b a Department of Astronomy, Graduate School of Science, the University of Tokyo, 7-3-1 Hongo, Bunkyo-ku, Tokyo 113-0033, Japan; b Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency, 3-1-1 Yoshinodai, Chuo-ku, Sagamihara, Kanagawa 252-5210, Japan ABSTRACT We are developing high performance mid-infrared (especially 30-40μm wavelength regions) multilayer interference filters with mechanical strength and robustness for thermal cycling toward cryogenic infrared astronomical missions. Multilayer interference filters enable us to design a wide variety of spectral response by controlling refractive index and thickness of each layer. However, in mid- and far-infrared (MIR/FIR) regions, there are a few optical materials so that we can only use limited refractive index values to design filters, which makes difficult to realize high performance filters. It is also difficult to deposit thick layers required for MIR/FIR multilayer filters. Furthermore, deposition of two materials, which have different coefficients of thermal expansion, makes filters fragile for thermal cycling. To clear these problems, we introduce sub-wavelength structures (SWS) for controlling the refractive index. Then, only one material is necessary for fabricating filters, which enables us to fabricate filters with mechanical strength and robustness for thermal cycling. According to the effective medium approximation (EMA) theory, the refractive index of randomly mixing materials in sub-wavelength scale is controllable by changing the ratio of mixing materials. However, it is not clear that EMA can be applied to such simple SWS, periodic cylindrical holes on a bulk material, which is easily fabricated by photolithography. In order to verify the controllability of refractive index by simple SWS, we have fabricated simple SWS on a silicon substrate and measured its transmittance. Comparing measured transmittance with theoretical transmittance calculated by EMA, we confirm that EMA can be applied to simple SWS fabricated by photolithography. Keywords: multilayer filters, sub-wavelength structure, silicon, photolithography, mid-infrared, far-infrared 1. INTRODUCTION In astronomical instruments, optical filters such as bandpass filters and dichroic beam splitters are essential optical components in order to obtain both spectral and spatial information. In optical and near-infrared (NIR) wavelength regions, thin film coating multilayer interference filters are commonly used to realize optical filters. Multilayer interference filters enable us to design a wide variety of spectral response by controlling refractive index and thickness of each layer 1,2. In optical and NIR wavelength regions, there are a lot of transparent and chemically stable optical materials so that we can use many values of refractive index, which enables us to design high performance filters. It is also established to fabricate multilayer structures by using vacuum deposition technology. Recently, multilayer interference filters are applied to longer (mid-infrared/mir) wavelength regions. Thin film coating MIR (5-28μm) multilayer interference bandpass filters are developed for the James Webb Space Telescope 3. However, in MIR (30-40μm) wavelength regions, there are a few transparent materials 4,5 so that we can only use limited values of refractive index to design multilayer filters, which becomes difficult to design high performance filters. It is also difficult to deposit thick layers required for MIR multilayer filters. Furthermore, in case of the thin film coating multilayer interference filters, filters are fabricated by deposition of two or more materials whose coefficients of thermal expansion are different, which makes filters fragile for thermal cycling. The robustness for thermal cycling is essential for high sensitivity astronomical observation, because astronomical optics must be extremely cooled (< 10 K) *makitsu@ir.isas.jaxa.jp; phone +81-50-336-23909; fax +81-42-786-7202

in order to decrease thermal background radiations which prevent high sensibility observation. Therefore it is difficult to realize thin film coating multilayer interference filters in 30-40μm wavelength regions for cryogenic infrared astronomical missions. In this paper, so as to overcome these difficulties, we propose single-material (all-silicon) multilayer interference filters with sub-wavelength structures (SWS) for cryogenic infrared astronomical missions. 2. SINGLE-MATERIAL MULTILAYER INTERFERENCE FILTERS 2.1 Concept In order to realize high performance MIR (especially 30-40μm wavelength regions) bandpass filters with mechanical strength and robustness for thermal cycling, we are trying to develop multilayer interference filters using only one material. Using only one material, it is expected that we can realize multilayer interference filters with robustness for thermal cycling because a coefficient of thermal expansion is same all over the filters. Adopting multilayer interference filters, it is expected that we can fabricate filters with mechanical strength because the thickness of substrate is commonly 0.5 mm. Furthermore, multilayer interference filters enable rectangular spectral response as the number of layers is increased. In 30-40μm wavelength regions there are a few transparent materials, but fortunately silicon is transparent in 30-40μm wavelength regions and furthermore silicon is chemically stable and adequate material for microfabrication, that is we can use very suitable optical material for realizing single-material multilayer interference filters with SWS. Using only one material, however, we cannot use different refractive index values other than that of a bulk material. Then we introduce sub-wavelength structures (SWS) for controlling the refractive index which is essential for making multilayer interference filters. According to the effective medium approximation (EMA) theory, the refractive index of randomly mixing materials in sub-wavelength scale is controllable by changing the ratio of mixing materials 6-9. In this case, we can make mixing materials which consist of silicon and vacuum. Using vacuum as a mixing material, we can realize multilayer interference filters which is composed of only one material (silicon). Therefore, it is expected that we can get the medium whose refractive index is arbitrary value of 1.0 to 3.4 by changing the ratio of silicon and vacuum i.e. porosity. Figure 1. Conceptual schematic of single-material (all-silicon) multilayer interference filters with SWS. In order to realize mechanically tough filters we propose alternate structures of bulk silicon layers and SWS silicon layers.

Figure 1 shows the conceptual schematic of single-material (all-silicon) multilayer interference filters with SWS. Multilayer structures are composed of SWS layers and bulk layers alternately, which is expected to make filters mechanically tough. We can also design high performance filters by taking advantage of the fact that we can use arbitrary refractive index values by changing the porosity of SWS layers 9. 2.2 Fabrication Fabrication of single-material multilayer interference filters is following three steps; dry etching, wafer bonding, and wafer thinning. At first, to make mixing materials layers in sub-wavelength scale, we use MEMS technology: photolithography and reactive ion etching. Photolithography enables us to manufacture easily simple SWS (such as periodic cylindrical holes on a bulk material) and to control the porosity precisely. Furthermore, we are also plannig to control the thickness of SWS layers by adjusting etching condition and etching time. Then we can fabricate SWS layers with expected porosity (i.e. refractive index) and thickness at the same time, which are key point to realize the expected multilayer interference filters. The next step is to fabricate multilayer structures. Making multilayer filters which consists of only one material is the key of our research, so we cannot use a different material such as adhesive to bond a SWS layer and a bulk layer. That is why we use MEMS technology: wafer direct bonding technique. To obtain stronger bonding, we are planning to use surface activated room temperature wafer bonding technique 10. In this technique, surfaces of two silicon substrates are activated by argon beam etching and bonded in a vacuum. Surface activated bonding is so strong that in the tensile test fracture occurred not at the bonding surface but mainly in the bulk of silicon. To obtain adequate thickness of bulk layers, we use wafer thinning technique. Controlling the polishing time and polishing condition, we will get bulk layers having expected thicknesses. Figure 2. The proposed fabrication method of single-material multilayer interference filters with SWS. We plan to use MEMS technology: photolithography and dry etching, wafer bonding technique, and wafer thinning technique.

3. VERIFICATION OF THE CONTROLLABILITY OF REFRACTIVE INDEX BY SUBWAVELENGTH STRUCTURE According to the effective medium approximation (EMA) theory, the mixing materials in sub-wavelength scale are regarded as a homogeneous medium having effective refractive index determined by the ratio of mixing materials. Then, it is expected that we can regard sub-wavelength periodic cylindrical holey structures on a bulk silicon as a homogeneous thin film having effective refractive index n eff (1.0 < n eff < 3.4) determined by porosity. However, it is not clear that the EMA theory can be applied to such simple SWS, periodic cylindrical holes on a bulk material, which is easily fabricated by photolithography and dry etching. In order to verify the controllability of refractive index by such simple SWS, we have fabricated such simple SWS on a silicon substrate by photolithography and dry etching, and have measured its transmittances. Comparing measurement transmittances with theoretical transmittances calculated by the EMA theory, we verify whether the refractive index control by such simple SWS is possible or not. 3.1 Fabrication of sub-wavelength structure We have fabricated two simple SWS (periodic cylindrical holes on a silicon substrate) samples at ISAS/JAXA by using photolithography and inductively coupled plasma reactive ion etching (ICP-RIE) in order to examine whether or not the effective medium approximation theory can be applied and the refractive index control by such simple SWS is possible. Fabricated samples are Sample 1 (porosity: 59%) and Sample 2 (porosity: 30%). See Figure 4 for more details. Figure 5 shows the scanning electron microscope (SEM) images of Sample 1. Figure 3. Optical image of SWS (porosity: 59%) fabricated on the surface of a silicon wafer. Dry etchings are processed within the central square region. Figure 4. Optical microscope images (top view) of SWS fabricated on the surface of a silicon wafer. Left figure is Sample 1 (porosity: 59%, hole diameter: 4.2μm, hole separation: 5.2μm) and Right figure is Sample 2 (porosity: 30%, hole diameter: 4.2μm, hole separation: 7.3μm). Hole separation means the distance between the centers of two adjacent holes.

Figure 5. SEM images of SWS Sample 1 (porosity: 59%) fabricated on the surface of a silicon wafer. Left figure is cross section image. The depth of holes (Sample 1; porosity 59%) is 12.3 ± 0.1μm. The depth of holes (Sample 2; porosity 30%) is 14.3 ± 0.1μm. 3.2 Measurement of transmittance We have measured transmittances of the fabricated samples between 25 to 120μm wavelength regions using Fourier transform spectrometer (BOMEM DA8) at ISAS/JAXA. The transmittances are measured with a mercury lamp beam (aperture is 7 mm) at a room temperature. A Mylar beam splitter of 6μm thickness and a deuterated triglycine sulfate (DTGS) pyroelectric detector are used. The measured transmittances are plotted in Figure 6. Measured samples are Sample 1 (59% porosity SWS on a silicon substrate), Sample 2 (30% porosity SWS on a silicon substrate), and a silicon substrate. The thickness of a silicon substrate is 0.5 mm. Anti-reflection effects by SWS are easily confirmed. Figure 6. Measured transmittances of SWS Sample 1 (porosity: 59% red lines), SWS Sample 2 (porosity: 30% blue lines), and a bulk silicon wafer (green lines).

3.3 Verification of the controllability of refractive index by sub-wavelength structure In order to verify the controllability of refractive index by simple SWS, we compare measured transmittances of SWS samples with theoretical transmittances of one-layer thin film anti-reflection filters (See Figure 7). The results are shown in Figure 8 and Figure 9. Figure 8 and 9 shows Sample 1 (porosity: 59%) and Sample 2 (porosity: 30%) respectively. Relative transmittance means SWS sample transmittance divided by silicon transmittance as a function of wavelength. The transmittances of 59% and 30% porosity SWS samples fit well with the theoretical calculation in case of refractive index n=1.95 and n=2.6 respectively. Furthermore, in the case of 59% porosity SWS sample, relative transmittance is 130% at the peak wavelength, which means that 59% porosity sub-wavelength periodic cylindrical holey structures play a nearly perfect anti-reflection layer. That is we have realized a nearly perfect AR coat on a silicon substrate by photolithography and dry etching. Figure 7. Conceptual schematic of the effective medium approximation theory. Figure 8. Relative transmittance of SWS Sample 1 (porosity 59%) on a silicon substrate compared with that of a bulk silicon wafer. The lines show the theoretical calculations of one-layer thin film AR filters whose refractive index is 1.85 (blue dotted lines), 1.95 (red solid lines), and 2.05 (black dotted lines). The thickness of the SWS layer (d=12.3μm) is given by the SEM observation. Note that 59% porosity SWS sample is worked as a nearly perfect AR coat, because relative transmittance is 130% at the peak wavelength.

Figure 9. Relative transmittance of SWS Sample 2 (porosity 30%) on a silicon substrate compared with that of a bulk silicon wafer. The lines show the theoretical calculations of one-layer thin film AR filters whose refractive index is 2.5 (blue dotted lines), 2.6 (red solid lines), and 2.7 (black dotted lines). The thickness of the SWS layer (d=14.3μm) is given by the SEM observation. 4. SUMMARY We are developing high performance MIR (especially 30-40μm wavelength regions) and FIR multilayer interference bandpass filters for cryogenic infrared astronomical missions. The requirements for the filters are having mechanical strength and robustness for thermal cycling. In order to realize these filters, we introduce sub-wavelength structures (SWS) to control the refractive index, and we are trying to develop single-material (all-silicon) multilayer interference bandpass filters. As a first step to realize these filters, we have fabricated one-layer simple SWS (periodic cylindrical holes on a silicon substrate) so as to confirm the controllability of refractive index by sub-wavelength structures the key point to develop single-material multilayer interference filters with mechanical strength and robustness for thermal cycling. The results show that the simple SWS fabricated easily by photolithography have refractive index different from that of bulk silicon, so we conclude that simple SWS (periodic cylindrical holes on bulk silicon) can be applied for single-material multilayer interference filters. We also confirm that 59% porosity sub-wavelength periodic cylindrical holey structures play a nearly perfect anti-reflection layer.

REFERENCES [1] Macleod, H. A., [Thin-Film Optical Filters 3rd edition], Institute of Physics Publishing, (2001). [2] Lee, C. C., [Optical Thin Film and Coating Technologies], ULVAC, (2002). [3] Hawkins, G. and Sherwood, R., Cooled infrared filters and dichroics for the James Webb Space Telescope Mid-Infrared Instrument, Appl. Opt. 47, C25-C34 (2007). [4] Palik, E. D., [Handbook of Optical Constants of Solids], Academic Press, (1985). [5] Klocek, P., [Handbook of Infrared Optical Materials], CRC, (1991). [6] Bruggeman, D. A. G., Berechnung Verschiedeneren Physcalischer Konstanten von Heterogenen Substanzen, Ann. Phys. 24, 636-679 (1935). [7] Hanai, T., Dielectric Theory on the Interfacial Polarization for Two-Phase Mixtures, Bull. Inst. Chem. Res. 39, 341-367 (1961). [8] Kikuta, H., Toyota, H., and Yu, W., Optical Elements with Subwavelength Structured Surfaces, Opt. Rev. 10, 63-73 (2003). [9] Toyohara, N., Wada, Y., Kikuchi, K., and Kawamata, K., Design of Optical Filters Using Arbitrary Index Film and Fabrication of the Optical Filters with Two Materials Mixed Layers by Sputtering Using the Shielding Plate, Kougaku 36, 339-344 (2007). [10] Takagi, H., Maeda R., Chung T. R., Hosoda N., and Suga T., Effect of Surface Roughness on Room- Temperature Wafer Bonding by Ar Beam Surface Activation, Jpn. J. Appl. Phys. 37, 4197-4203 (1998).