DFN2020MD-6 plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body 23 January 2017 Package information 1. Package summary Table 1. Package summary Terminal position code Package type descriptive code Package type industry code Package style descriptive code Package body material type Mounting method type D (double) DFN2020MD-6 DFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date 3-5-2012 Manufacturer package code Symbol Parameter Min Typ Nom Max Unit D package length 1.9-2 2.1 mm E package width 1.9-2 2.1 mm seated height 0.65 - - - mm e nominal pitch - - 0.65 - mm n 2 actual quantity of termination - - 6 -
2. Package outline DFN2020MD-6: plastic thermal enhanced ultra thin small outline package; no leads; 6 terminals; body 2 x 2 x 0.65 mm (8 ) pin 1 index area E B X D solderable lead end protrusion max. 0.02 mm (6 ) 1 detail X C E 2 L p y 1 C y D 2 3 4 J 1 J 2 5 e bp (6 ) D 1 e v B 1 6 pin 1 index area E 1 Dimensions (mm are the original dimensions) 0 2 mm scale Unit 1 bp D D 1 D 2 E E 1 E 2 e J J 1 L p v y y 1 mm min nom max 0.25 1.9 1.0 0.65 0.04 0.35 2.1 1.2 Note 1. Dimension is including plating thickness. 0.2 0.3 1.9 2.1 1.1 0.51 0.2 0.65 0.27 0.64 1.3 0.61 0.3 0.1 0.05 0.1 sot1220_po Outline version References IEC JEDEC JEIT European projection Issue date 12-04-23 12-04-30 Fig. 1. Package outline DFN2020MD-6 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 23 January 2017 2 / 5
3. Soldering Footprint information for reflow soldering of DFN2020MD-6 package 0.33 (6 ) 0.76 0.43 (6 ) 0.53 (6 ) 0.66 0.56 0.25 0.35 0.45 0.775 0.65 2.06 0.285 1.35 1.25 1.05 0.35 (6 ) 0.65 0.25 (6 ) 0.45 (6 ) 0.9 1.1 1.2 0.935 0.935 2.5 solder land solder land plus solder paste solder paste deposit occupied area solder resist Dimensions in mm sot1220_fr Fig. 2. Reflow soldering footprint for DFN2020MD-6 () ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 23 January 2017 3 / 5
4. Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 23 January 2017 4 / 5
5. Contents 1. Package summary...1 2. Package outline... 2 3. Soldering... 3 4. Legal information... 4 NXP Semiconductors N.V. 2017. ll rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 January 2017 ll information provided in this document is subject to legal disclaimers. NXP Semiconductors N.V. 2017. ll rights reserved Package information 23 January 2017 5 / 5