Single Pole, Normally Open OptoMOS Relay Parameters Ratings Units Blocking Voltage 6 V P Load Current ma rms / ma DC On-Resistance (max) 22 LED Current to Operate ma Features E is % Tested for Partial Discharge: DIN EN 6747-- V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 6-Pin Package Machine Insertable, Wave Solderable Applications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment: Patient/Equipment Isolation Aerospace Industrial Controls Pin Configuration + Control 2 - Control 3 Do Not Use DC Only Configuration 6 Load Do Not Use 4 Load Description IXYS Integrated Circuits Division's is a single-pole, normally open (-Form-A) solid state relay that provides V rms of input to output isolation. In addition to all the features and benefits of the, the E meets the partial discharge demands of DIN EN 6747-- (previously VDE 884). All versions of the can be used to replace mechanical relays, while offering the superior reliability associated with semiconductor devices. Optically coupled outputs that use the patented OptoMOS architecture are controlled by a highly efficient GaAIAs infrared LED. Because they have no moving parts, they offer bounce-free switching in more compact surface mount or thru-hole packages. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 7739 EN/IEC 69- Certified Component: TUV Certificate B 2 82667 2 DIN EN 6747-- Certified ("E" Suffix Only) VDE Certificate 43663 Ordering Information Part # E ES ESTR S STR Form-A Description 6-Pin DIP (/Tube) 6-Pin Surface Mount (/Tube) 6-Pin Surface Mount (/Reel) 6-Pin DIP (/Tube) 6-Pin Surface Mount (/Tube) 6-Pin Surface Mount (/Reel) Switching Characteristics of Normally Open Devices + Control 2 - Control 3 Do Not Use 6 4 + Load - Load 9% I LOAD % t on t off Pb e3 DS--R7 www.ixysic.com
Absolute Maximum Ratings @ 2ºC (Unless Otherwise Noted) Parameter Rating Units Blocking Voltage 6 V P Reverse Input Voltage V Input Control Current ma Peak (ms) A Input Power Dissipation mw Total Package Dissipation 2 8 mw Isolation Voltage, Input to Output (6 Seconds) V rms ESD Rating, Human Body Model 4 kv Operational Temperature -4 to +8 ºC Storage Temperature -4 to +2 ºC Derate linearly.33 mw / ºC 2 Derate linearly 6.67 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 2ºC (Unless Otherwise Noted) Parameters Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous, - - - ma I rms / ma DC Continuous, DC-Only Configuration - L - - 22 ma DC Peak t=ms I LPK - - ±4 ma P On-Resistance I L =ma - 3.3 22 R DC-Only Configuration I ON L =22mA - 4. 8 Off-State Leakage Current V L =6V P I LEAK - - A Switching Speeds Turn-On t =ma, V L =V on - - Turn-Off t off - - ms Output Capacitance V L =V, f=mhz C OUT - - pf Input Characteristics Input Control Current to Activate I L =ma -.22 ma Input Control Current to Deactivate -..2 - ma Input Voltage Drop =ma V F.9.2.4 V Reverse Input Current V R =V I R - - A Common Characteristics Input to Output Capacitance - C I/O - 3 - pf E Safety and Insulation Ratings Parameters Conditions Symbol Min Max Units Pollution Degree 2 according to DIN VDE 9 - - - - - Highest Allowable Over-Voltage Transient Voltage V IOTM 77 - V P Maximum Working Insulation Voltage Recurring Voltage V IORM - V P Partial Discharge Test Voltage DIN EN 6747-- Method B V PR - 87 V P Isolation Test Voltage - V ISO - V rms Creepage Distance - - 7.6 - mm Clearance Distance - - 7.6 - mm R7 2 www.ixysic.com
PERFORMANCE DATA (@ 2ºC Unless Otherwise Noted)* 3 Typical LED Forward Voltage Drop (N=, =ma) 3 Typical Turn-On Time (N=, =ma, I L =ma DC ) 3 Typical Turn-Off Time (N=, =ma, I L =ma DC ) 3 3 3 2 2 2 2 2 2.2.26.27.28.29 LED Forward Voltage Drop (V).6.7.8.9 2. 2. Turn-On Time (ms).23.26.29.32.3.38 Turn-Off Time (ms) 3 Typical for Switch Operation (N=, I L =ma) 4 Typical On-Resistance Distribution (N=, =ma, I L =ma) 3 DC-Only On-Resistance Distribution (N=, =ma, I L =22mA) 2 2 3 3 2 2 2 2.2.2.22.23.24.2.26 LED Current (ma) 3. 3.2 3.3 3.4 3. 3.6 4. 4. 4. 4.2 4.2 4.3 3 2 Typical Blocking Voltage Distribution (N=) 2 7 7 72 73 74 7 Blocking Voltage (V P ) LED Forward Voltage Drop (V).6..4.3.2. Typical LED Forward Voltage Drop =ma =2mA =ma =ma. -4-2 2 4 6 8 Turn-On Time ( s) 4 4 3 3 2 2 Typical Turn-On Time vs. LED Forward Current =ma) 2 3 4 LED Current (ma) Turn-Off Time ( s) 36 36 39 38 37 36 3 Typical Turn-Off Time vs. LED Forward Current =ma) 2 3 4 Forward Current (ma) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 www.ixysic.com 3
PERFORMANCE DATA (@ 2ºC Unless Otherwise Noted)* LED Current to Operate (ma).3.28.26.24.22.2.8 Typical for Switch Operation =ma).6-4 -2 2 4 6 8 Turn-On Time ( s) Typical Turn-On Time =ma) 4 4 =2mA 3 3 2 =ma 2 =ma -4-2 2 4 6 8 Turn-Off Time ( s) 4 4 3 3 2 Typical Turn-Off Time =ma) =ma =ma =2mA 2-4 -2 2 4 6 8 8 6 4 2 Typical AC/DC On-Resistance ( =ma, I L =ma) 7 6 4 3 2 Typical DC-Only On-Resistance ( =ma, I L =22mA) Load Current (ma) 2 2 Maximum Load Current ( =ma) DC-Only Configuration 8-4 -2 2 4 6 8-4 -2 2 4 6 8-4 -2 2 4 6 8. Typical Load Current vs. Load Voltage ( =ma).2 Typical Load Current vs. Load Voltage DC-Only Configuration ( =ma) 77 Typical Blocking Voltage Current (A)... -. -. -. -3-2 - 2 3 Voltage (V) Current (A).2......2.4.6.8..2 Voltage (V) Blocking Voltage (V P ) 76 7 74 73 72 7 7-4 -2 2 4 6 8 Leakage ( A).6..4.3.2. -4 Typical Leakage Measured across Pins 4&6 (V L =6V) -2 2 4 6 8 Temperature º(C) Output Capacitance (pf) Output Capacitance vs. Load Voltage ( =ma, f=mhz) 8 6 4 2 8 6 4 2. Load Voltage (V) Load Current (A).2..8.6.4.2 Energy Rating Curve ( =ma) s s ms ms ms s s s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating All Versions MSL ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device All Versions Maximum Temperature x Time 2ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in the standard (without the "E" suffix); the use of a short drying bake could be necessary if a wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R7 www.ixysic.com
& E MECHANICAL DIMENSIONS 8.382 ±.38 (.33 ±.) 2.4 ±.27 (. ±.) Pin.6 ±.24 (.6 ±.) 6.3 ±.27 (.2 ±.) 7.62 ±.24 (.3 ±.) 7.239 TYP (.28 TYP) 9.44 ±.8 (.36 ±.2).24 ±.27 (. ±.) 6 -.8 DIA. (6 -.3 DIA.) 6.3 ±.27 (.2 ±.) PCB Hole Pattern 2.4 ±.27 (. ±.).8 ±.27 (.2 ±.) 7.62 ±.27 (.3 ±.) 3.32 ±. (.3 ±.2).47 ±.76 (.8 ±.3) 4.64 TYP (.6 TYP) Dimensions mm (inches) S & ES 8.382 ±.38 (.33 ±.) 2.4 ±.27 (. ±.).63 ±.27 (.2 ±.) PCB Land Pattern 2.4 (.) 9.24 ±.8 (.37 ±.2) Pin 3.32 ±. (.3 ±.2).47 ±.76 (.8 ±.3).6 ±.24 (.6 ±.) 6.3 ±.27 (.2 ±.) 7.62 ±.24 (.3 ±.).24 ±.27 (. ±.).6 (.649).6 (.2) 8.9 (.33) 4.44 ±.24 (.7 ±.).6 ±.24 (.6 ±.) Dimensions mm (inches) R7 6 www.ixysic.com
STR & ESTR Tape & Reel 33.2 Dia (3. Dia) Top Cover Tape Thickness.2 Max (.4 Max) W=6. (.63) B =. (.398) Embossed Carrier Embossment K = 4.9 (.9) K = 3.8 (.) P = 2. (.472) User Direction of Feed A =. (.398) Dimensions mm (inches) NOTES:. All dimensions carry tolerances of EIA Standard 48-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-48-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS--R7 Copyright 23, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 2/28/23