GaN Power IC Enable Next Generation Power

Similar documents
GaN Power ICs: Integration Drives Performance

GaN Power ICs at 1 MHz+: Topologies, Technologies and Performance

Breaking Speed Limits with GaN Power ICs March 21 st 2016 Dan Kinzer, COO/CTO

Unlocking the Power of GaN PSMA Semiconductor Committee Industry Session

Design Considerations of Highly-Efficient Active Clamp Flyback Converter Using GaNFast Power ICs

Designing reliable and high density power solutions with GaN. Created by: Masoud Beheshti Presented by: Paul L Brohlin

Designing High density Power Solutions with GaN Created by: Masoud Beheshti Presented by: Xaver Arbinger

GaN in Practical Applications

Get Your GaN PhD in Less Than 60 Minutes!

GaN Reliability Through Integration and Application Relevant Stress Testing

PCB layout guidelines. From the IGBT team at IR September 2012

The First Step to Success Selecting the Optimal Topology Brian King

High voltage GaN cascode switches shift power supply design trends. Eric Persson Executive Director, GaN Applications and Marketing

Implementation and Design Considerations of High Voltage Gate Drivers Richard Herring, Application Engineer

Designing a 99% Efficient Totem Pole PFC with GaN. Serkan Dusmez, Systems and applications engineer

The Quest for High Power Density

Unleash SiC MOSFETs Extract the Best Performance

Designing Reliable and High-Density Power Solutions with GaN

Gate Drive Optimisation

NV V GaNFast Power IC. 2. Description. 1. Features. 3. Topologies / Applications. 4. Typical Application Circuits

Power of GaN. Enabling designers to create smaller, more efficient and higher-performing AC/DC power supplies

Evaluation and Applications of 600V/650V Enhancement-Mode GaN Devices

Presentation Content Review of Active Clamp and Reset Technique in Single-Ended Forward Converters Design Material/Tools Design procedure and concern

Frequency, where we are today, and where we need to go

GaN is Crushing Silicon. EPC - The Leader in GaN Technology IEEE PELS

GaN Transistors for Efficient Power Conversion

Driving egan TM Transistors for Maximum Performance

Making Reliable and High-Density GaN Solutions a Reality

100V ENHANCEMENT MODE HIGH ELECTRON MOBILITY TRANSISTOR (HEMT) Michele Rossitto. Marketing Director MOSFETs and Power ICs

Fig. 1 - Enhancement mode GaN has a circuiut schematic similar to silicon MOSFETs with Gate (G), Drain (D), and Source (S).

Multitrack Power Factor Correction Architecture

Maximizing efficiency of your LLC power stage: design, magnetics and component selection. Ramkumar S

Incorporating Active-Clamp Technology to Maximize Efficiency in Flyback and Forward Designs

A Solution to Simplify 60A Multiphase Designs By John Lambert & Chris Bull, International Rectifier, USA

Vishay Siliconix AN724 Designing A High-Frequency, Self-Resonant Reset Forward DC/DC For Telecom Using Si9118/9 PWM/PSM Controller.

Drive and Layout Requirements for Fast Switching High Voltage MOSFETs

In Search of Powerful Circuits: Developments in Very High Frequency Power Conversion

GaAs PowerStages for Very High Frequency Power Supplies. Greg Miller Sr. VP - Engineering Sarda Technologies

235 W Maximum Power Dissipation (whole module) 470 T J Junction Operating Temperature -40 to 150. Torque strength

High Performance ZVS Buck Regulator Removes Barriers To Increased Power Throughput In Wide Input Range Point-Of-Load Applications

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance

High-Power-Density 400VDC-19VDC LLC Solution with GaN HEMTs

Switch mode power supplies Low gate charge. Power factor correction modules Low intrinsic capacitance

CHAPTER 3 DC-DC CONVERTER TOPOLOGIES

VDSS (V) 650 V(TR)DSS (V) 800. RDS(on)eff (mω) max* 85. QRR (nc) typ 90. QG (nc) typ 10

Hysteresis loss in high voltage MOSFETs: Findings and effects for high frequency AC-DC converters. Bernard Keogh

Announcements. Outline. Power Electronics Circuits. malfunctioning, for report. Experiment 1 Report Due Tuesday

Server Power System for Highest Efficiency and Density: Practical Approach Step by Step

Application Note 0009

PC Krause and Associates, Inc.

Zero Voltage Switching In Practical Active Clamp Forward Converter

A HIGHLY EFFICIENT ISOLATED DC-DC BOOST CONVERTER

AN Analog Power USA Applications Department

A new way to PFC and an even better way to LLC Bosheng Sun

Appendix: Power Loss Calculation

An Experimental Comparison of GaN E- HEMTs versus SiC MOSFETs over Different Operating Temperatures

Interleaved PFC technology bring up low ripple and high efficiency

Digital Control for Power Electronics 2.0

Designing High-Efficiency ATX Solutions. Practical Design Considerations & Results from a 255 W Reference Design

Lecture 4 ECEN 4517/5517

PRELIMINARY. VDSS (V) 600 V(TR)DSS (V) 750 RDS(on)eff (mω) max* 60. QRR (nc) typ 120. QG (nc) typ 22 PRELIMINARY

AC-DC SMPS: Up to 15W Application Solutions

High Current Voltage Regulator Module (VRM) Uses DirectFET MOSFETs to Achieve Current Densities of 25A/in2 at 1MHz to Power 32-bit Servers

Switch mode power supplies Excellent reverse recovery. Power factor correction modules Low gate charge Motor drives Low intrinsic capacitance

Introducing egan IC targeting Highly Resonant Wireless Power

VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mω) max* 180. QRR (nc) typ 52. QG (nc) typ 6.2 VIN=230VAC; VOUT=390VDC VIN=380VDC; VOUT=240VAC

MP6909 Fast Turn-Off Intelligent Rectifier

Si, SiC and GaN Power Devices: An Unbiased View on Key Performance Indicators

[High side bias challenges and solutions in half bridge gate drivers] [Ritesh Oza]

GS66516T Top-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

UF3C120080K4S. 1200V-80mW SiC Cascode DATASHEET. Description. Features. Typical applications CASE D (1) CASE G (4) KS (3) S (2) Rev.

IR3101 Series 1.6A, 500V

35mW V SiC Cascode UJ3C120040K3S Datasheet. Description. Typical Applications. Maximum Ratings

TPH3207WS TPH3207WS. GaN Power Low-loss Switch PRODUCT SUMMARY (TYPICAL) Absolute Maximum Ratings (T C =25 C unless otherwise stated)

VDS (V) min 600 VTDS (V) max 750 RDS(on) (mω) max* 63. Qrr (nc) typ 136. * Dynamic R(on)

Designers Series XII. Switching Power Magazine. Copyright 2005

Advanced Silicon Devices Applications and Technology Trends

VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mω) max* 60. QRR (nc) typ 136. QG (nc) typ 28 VIN=230VAC; VOUT=390VDC VIN=380VDC; VOUT=240VAC

GS66508P Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

Class D Audio Amplifier Design

A New Phase Shifted Converter using Soft Switching Feature for Low Power Applications

AN TEA1836XT GreenChip SMPS control IC. Document information

VDSS (V) 650 V(TR)DSS (V) 800 RDS(on)eff (mω) max* 180. QRR (nc) typ 47. QG (nc) typ 10

VDSS (V) 650. V(TR)DSS (V) 800 RDS(on)eff (mω) max* 180. QRR (nc) typ 52. QG (nc) typ 6.2

27mW - 650V SiC Cascode UJ3C065030K3S Datasheet. Description. Typical Applications. Maximum Ratings

80mW - 650V SiC Cascode UJ3C065080K3S Datasheet. Description. Typical Applications. Maximum Ratings

Demands for High-efficiency Magnetics in GaN Power Electronics

Improving Totem-Pole PFC and On Board Charger performance with next generation components

FSFR-XS Series Fairchild Power Switch (FPS ) for Half-Bridge Resonant Converters

Simulation of a novel ZVT technique based boost PFC converter with EMI filter

Monolithic integration of GaN power transistors integrated with gate drivers

IRF7821PbF. HEXFET Power MOSFET

GS66516B Bottom-side cooled 650 V E-mode GaN transistor Preliminary Datasheet

ZERO VOLTAGE TRANSITION SYNCHRONOUS RECTIFIER BUCK CONVERTER

VDSS (V) 900. V(TR)DSS (V) 1000 RDS(on)eff (mω) max* 205. QRR (nc) typ 49. QG (nc) typ 10

VDS (V) min 650 VTDS (V) max 800 RDS(on) (mω) max* 60. Qrr (nc) typ 136. Qg (nc) typ 28. * Dynamic RDS(on)

Recommended External Circuitry for Transphorm GaN FETs. Zan Huang Jason Cuadra

ACEEE Int. J. on Control System and Instrumentation, Vol. 02, No. 02, June 2011

Power Electronics Circuits. Prof. Daniel Costinett. ECE 482 Lecture 3 January 26, 2017

8 S1, D2. Storage Temperature Range Soldering Temperature, for 10 seconds 300 (1.6mm from case )

Transcription:

GaN Power IC Enable Next Generation Power Adaptor Design Peter Huang, Director, FAE & Technical Marketing peter.huang@navitassemi.com 2018 前瞻電源設計與功率元件技術論壇 Jan -30 th

Navitas Semiconductor Inc. World s first & only GaN power IC company Founded January 2014 HQ in El Segundo, CA, USA World-class team World-class manufacturing partners www.navitassemi.com 2

Power Density (W/in 3 ) (AC-DC converters ~300W) The First Revolution in Power Electronics 100 Linear Regulators Switching Regulators 50 Hz 30 khz Switching Regulators 65 khz 10 Si BJT Si FETs New Magnetics New Controllers New Topologies 5x Lower Loss 3x Lower $/W 90% 1 80% Better Si FET (Super junction) SR QR 0.1 40% efficiency 1977 1987 2017 3

Power Density (W/in 3 ) (AC-DC converters ~300W) Today s Power Revolution Linear Regulators Switching Regulators Switching Regulators HF Switching Regulators 100 50 Hz 30 khz 65 khz 1 MHz 10 1 0.1 Si BJT Si FETs New Magnetics New Controllers New Topologies 5x Lower Loss 3x Lower $/W 80% 40% efficiency 1977 1987 Better Si FET (Super junction) SR QR 90% 2x Lower Loss 3x Lower $/W New GaN Power ICs New Magnetics New Controllers New Topologies 2017 95-98% 2027 4

Key Factors for Next Generation Power Adaptor HF Power Switch GaN Power IC, GaN FET, SiC FET HF Magnetics 300kHZ~2MHz HF Controllers ASIC ACF (up to 2MHz) ASIC TP PFC (up to 2MHz) ASIC LLC (up to 2MHz) 5

Modified Performance factor F 3/4 =Bf 3/4 (T Hz 3/4 ) HF Magnetics 3.0x10 3 P v =500 mw/cm 3 2.5 2.0 ML91S ~2010s 67 ~2015s Future 1.5 1.0 3C90 ~1990s 3F35 ~2000s 0.5 0.01 0.1 1 10 100 F SW (MHz) Y. Han, G. Cheung, A. Li, C. R. Sullivan and D. J. Perreault, "Evaluation of Magnetic Materials for Very High Frequency Power Applications," in IEEE Transactions on Power Electronics, vol. 27, no. 1, pp. 425-435, Jan. 2012. A. J. Hanson, J. A. Belk, S. Lim, C. R. Sullivan and D. J. Perreault, "Measurements and Performance Factor Comparisons of Magnetic Materials at High Frequency," in IEEE Transactions on Power Electronics, vol. 31, no. 11, pp. 7909-7925, Nov. 2016. 6

HF Power Switch: Navitas GaN Power IC Speed enables small size, low-cost and faster charging Efficiency enables energy savings With Silicon or Discrete GaN power devices, you can get one or the other With GaN power ICs, you get both at the same time, unequaled Speed & Efficiency 7

Hard-Switch Soft-Switch with emode GaN Primary Switch Power Loss: Minimized Reduced 开关频率有关损耗 P FET = P COND * k + P DIODE + P T-ON + P T-OFF + P DR + P QRR + P QOSS k-factor P T-On P DR P QRR P DIODE P Qoss P T-OFF >1 due to increased circulating current, duty cycle loss(deadtime) = 0 (soft-switch) 10X (GaN P DR negligible up to 2Mhz) = 0(NO Reverse recovery) emode GaN 消除的损耗 2X (reverse conduction loss reduced due to short deadtime) 10X (GaN Coss charging/discharging loss negligible up to 2Mhz) = Reduced (limited by I-V crossover loss due to drive loop impedance) 8

Hard-Switch Soft-Switch with Navitas GaN Power IC Primary Switch Power Loss: Minimized Reduced P FET = P COND * k + P DIODE + P T-ON + P T-OFF + P DR + P QRR + P QOSS k-factor P T-On P DR P QRR P DIODE P Qoss P T-OFF >1 due to increased circulating current, duty cycle loss(deadtime) = 0 (soft-switch) 10X (GaN P DR negligible up to 2Mhz) = 0(NO Reverse recovery) 2X (reverse conduction loss reduced due to short deadtime) 10X (GaN Coss charging/discharging loss negligible up to 2Mhz) = 0 (Due to driver Integration, No gate loop impedance) 9

Ideal Switching = No Switching Loss @ High F SW Navitas GaN ICs provide Ideal Switching How? 10

HF Power Switch: World s First AllGaN Power ICs Fastest, Most Efficient GaN Power FETs First & Fastest Integrated GaN Gate Drivers World s First AllGaN Power IC >20x faster than silicon >5x faster than cascoded GaN Proprietary design >3x faster than any other gate driver Proprietary design 30+ patents granted/applied Up to 40MHz switching, 5x higher density & 20% lower system cost 11

AllGaN : Monolithic GaN Power IC Monolithic integration at 650 V GaN FET (range 110-560 mω) GaN Driver (idrive ) GaN Logic Digital In, Power Out NV6115 PFC Boost 应用线路 10 30V NV6115 NV6115 Half-bridge waveform 5 x 6 mm QFN 12

Integrated Drive Simple & Robust Wide-range V CC (10-30 V) Total layout flexibility & simplicity Regulator ensures V GS within SOA Gate protected from external noise PWM hysteresis for noise immunity PWM V GS No inductance or ringing in gate loop PWM (5 V/div) V GS (2 V/div) 9

Clean, Controlled FET Gate Discrete driver Gate loop inductance creates overshoot (even with good layout) Reliability concern idrive GaN Power IC No gate loop parasitic Clean and fast gate signal 2 V Overshoot Discrete Driver & Discrete FET GaN Power IC V GS V GS 4V Undershoot 14

Fast & Clean Hard Switching V IN IC prevents noise coupling into gate L load I Load = 5 A Clean HV hard switching L d 500 V VDD ~100 V/ns dv/dt V PWM (2 V/div) V DRAIN (100 V/div) PWM Driver HV power FET Gate driver loop Zero gate-loop inductance Eliminate turn-off loss L s Prop delay 10-20 ns 50 ns/div 11

Turn-off Loss (μ J) Speed & Integration Eliminate Turn-off Losses External drivers Just 1-2 nh of gate loop inductance can cause unintended turn-on Gate resistors reduce spikes but create additional losses Integrated GaN drivers (idrive ) Eliminate the problem Negligible turn-off losses Removes unintended dv/dt turn-on 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 External driver, no Rg External driver+1ω External driver+2ω External driver+4ω Integrated driver, no Rg 0 1 2 3 4 5 6 7 8 9 10 Load Current (A) Discrete FET and drive, no R G = out of control Discrete FET and drive, with R G = slow, lossy Integrated FET and drive, no R G = fast, efficient 12

Hard-Switch Soft-Switch with Navitas GaN Power IC Primary Switch Power Loss: Minimized Reduced P FET = P COND * k + P DIODE + P T-ON + P T-OFF + P DR + P QRR + P QOSS k-factor P T-On P DR P QRR P DIODE P Qoss P T-OFF >1 due to increased circulating current, duty cycle loss(deadtime) = 0 (soft-switch) 10X (GaN P DR negligible up to 2Mhz) = 0(NO Reverse recovery) 2X (reverse conduction loss reduced due to short deadtime) 10X (GaN Coss charging/discharging loss negligible up to 2Mhz) = 0 (Due to driver Integration, No gate loop impedance) 17

High Power Density = More Integration 18

AllGaN Half-Bridge GaN Power IC Monolithic integration at 650V 2x GaN FETs (110-560 mω) 2x GaN drivers (idrive ) GaN Logic (level-shift, bootstrap, UVLO, shoot-through, ESD) Digital In, Power Out 6 x 8 mm QFN 19

GaN Level-Shift: Low Loss, High-Frequency I/F Chip Si CMOS On-chip Transformer SiO 2 / Polyimide Gate Driver Chip Si CMOS Bootstrap Diode Si / SiC Half-Bridge FETs Si AllGaN Technology Lateral 650V GaN-on-Si Disparate Technologies Hybrid isolator, discrete driver, discrete power, bootstrap diode High Power Loss Driver loss, R G loss Bootstrap diode Q RR, V F Pulsed high current level shifter power (?) Monolithic Platform Lateral GaN-on-Si, Half-Bridge GaN Power IC Low Power Loss No gate driver loop parasitics, matched driver- FET capability, negligible loss vs. frequency Zero Q RR,low V DS in synchronous charging Very fast, low-power loss, MHz+ 20

Complex Design Easy-to-Use Half-Bridge Discrete GaN Half-Bridge GaN Power IC 20x smaller PCB area Lower cost Robust & protected Simple Easy layout PCB Area: 6 x 8 = 48 mm 2 PCB Area: 24 x 42 ~ 1,000 mm 2 20

HF Topology for Low Power Adaptor(<75W) Active Clamp Flyback 22

QR vs ACF QR Flyback Active Clamp Flyback RCD loss(leakage loss) Hard switching loss(high Line) Switching loss increases with high fsw No RCD loss(leakage loss) ZVS over all AC line, all load conditions ZCS achieved ACF operates at > 1MHz 23

ACF Operation (S1 ON) S1 ON S2 ON ilm S2 V sw V SW S1 i Lm i Lr i D S1 ON, linearly charging L m, like a QR flyback 24

ACF Operation (S2 ON, S1 OFF) S1 ON S2 ON ilm S2 V sw V SW S1 i Lm i Lr S2 ON with ZVS, effective clamping since current can go both direction, no overshoot Leakage resonates with clamping capacitor Rectifier diode conducts and delivers power Interval ends when rectifier current drops to zero i D 25

ACF Operation (Building Negative Lm) S1 ON S2 ON ilm S2 S1 V SW V sw i Lm i Lr S2 current equals to magnetizing current Magnetizing current becomes negative i D 26

ACF Operation (S1 ZVS Transition) S1 ON S2 ON ilm S2 S1 V SW V sw i Lm i Lr i D Negative il m discharge S1 C OSS S1 can be turned on later in ZVS 27

ACF Enables ZVS and High Frequency Switching Lossless snubber Zero-voltage switching ilm S2 S1 V SW V sw i Lm i Lr Zero-current switching No snubber losses, all leakage energy is recovered ZVS turn-on over entire operation range ZCS turn-off for output rectifier Clean waveforms reduce EMI Enable small adapter design with high frequency switching 28

38 mm 65W USB-PD ACF: World s Smallest Adapter 15.5 mm 46 mm Input Output Frequency Primary FET : Universal AC (85-265V AC, 47-63Hz) : USB-PD (5-20V) (65W) Controller(ACF) : UCC28780 Magnetic Core Size Efficiency Power Density Construction : 300~400kHz(Full Load) : NV6115 (160 mω) + NV6117 (110 mω) GaN Power ICs : N49 : 38 x 46 x 15.5 mm = 27 cc uncased 43 x 51 x 20.5 mm = 45 cc with 2.5 mm case : 93.4% at 90 V AC, Full Load : 2.4 W/cc (39 W/in 3 ) uncased 1.5 W/cc (24 W/in 3 ) cased : 4-layer, 2-oz Cu PCB, SMT powertrain No heatsink design NV6115 NV6117 29

65W USB-PD ACF Efficiency at 20 V OUT (25 C, no airflow) Efficiency measured at PCB 30

65W USB-PD ACF Efficiency (25 C, no airflow) 4-point Average Efficiency Controller(ACF) : UCC28780 10% Load Efficiency Standby: 25 mw at 115 V AC, 40 mw at 230 V AC (CoC Tier 2 spec is < 75mW, DoE Level VI spec <= 210 mw) Efficiency measured at PCB 31

38 mm 600kHz 65W Planar Prototype 47 mm Input : Universal AC (85-265V AC, 47-63Hz) Output : Fixed 20 V (65W) Powertrain : NV6115 (160 mω) + NV6117 (110 mω) GaN Power ICs Control : ACF = TI UCC28780 Frequency : 500-600 khz Size : 38 x 47 x 12.5 mm = 22 cc uncased 43 x 52 x 17.5 mm = 39 cc with 2.5 mm case Power Density : 2.9 W/cc (47 W/in 3 ) uncased 1.7 W/cc (27 W/in 3 ) cased Construction : 4-layer, 2-oz Cu PCB, SMT powertrain No heatsink design 12.5 mm In progress, available Q2 18 32

1MHz 150 W State-of-the-art Si 12W/in 3 1MHz GaN 35W/in 3 Totem-Pole: 2 x Navitas Power ICs 2 x Si FETs LLC transformer LLC Primary 2 x GaN Power ICs Microcontroller not shown 33

HB driver 53.3 mm 1.2 MHz, 300W Totem-Pole PFC (Preliminary) Input : Universal AC (85-265V AC, 47-63Hz) Output : 400V (300W) Fast FETs : NV6117 (110mΩ) GaN Power ICs Slow (AC) FETs : Si Superjunction (62mΩ) Frequency : 300-1,200 khz 57.5 mm Size : 53.3 x 57.5 x 20 mm = 62 cc uncased (DSP controller board not included) Power Density : 4.9 W/cc (80 W/in 3 ) uncased Target Efficiency : 98.5% @ 220V AC, 98% @ 110V AC, 97.5% at 90V AC, full load Comp ZCD V BUS 20 mm AC L cm L dm L S 1 S 3 S L S L i AC_ave S 2 S 4 S N S N S 1 S 2 S 3 S 4 S L S N In progress, report available APEC 18 V AC i AC_ave TMS320F28075 ZCD V BUS 34

Summary Navitas GaN Power IC Enable - Market adoption of HF magnetics - ACF topology adoption in low power application - HF ASIC for ACF, TP-PFC, LLC, SR invention & Next Generation High Power Density Adaptor 35

GaN Power ICs: Integration Drives Performance 36