Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Product features High current carrying capacity in a compact standard 8 ( metric) footprint Magnetically shielded, Low EMI Rugged construction Self resonant frequency (SRF) greater than MHz Inductance range from. μh to 4.7 μh Current range from. A to 7. A.7 mm x. mm footprint surface mount package in. mm,. mm heights Moisture Sensitivity Level (MSL): Applications Mobile/smart phones Handheld/mobile equipment Tablets/e-readers Digital cameras Wearable devices Notebook/netbook/laptop regulators Portable media players Environmental data Storage temperature range (Component): -4 C to + C Operating temperature range: -4 C to + C (ambient plus self-temperature rise) Solder reflow temperature: J-STD- (latest revision) compliant Halogen free, lead free, RoHS compliant Pb HALOGEN HF FREE
Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Product specifications Part Number OCL (μh) ±% I rms (A) I sat (A) DCR (mω) typical @ + C DCR (mω) maximum @ + C SRF (MHz) typical K-factor 4. mm height MPIV-R-R. 4.8 6.6 66 MPIV-R47-R.47 4.4 6. 9 9 MPIV-R68-R.68. 4. 7 44 8 7 MPIV-R-R.. 4. 4 7 MPIV-R-R... 6 8 4 469 MPIV-R-R...8 88 4 87 MPIV-R-R..6. 4 7 89 MPIV-4R7-R 4.7..8 6 66. mm height MPIV-R-R.. 7. 4 9 66 MPIV-R47-R.47 4.9 6.7 7 68 MPIV-R68-R.68.4 6. 9 7 6 MPIV-R-R.. 4.4 6 44 7 8 MPIV-R-R... 64 77 4 48 MPIV-R-R... 7 87 94 MPIV-R-R..8.8 96 MPIV-4R7-R 4.7.4.9 96 8. Open Circuit Inductance (OCL) Test Parameters:. MHz,. Vrms,. Adc, + C.. I rms : DC current for an approximate temperature rise of 4 C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed + C under worst case operating conditions verified in the end application.. I sat : Peak current for approximately % rolloff @ + C. Dimensions (mm) 4. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI. Bp-p :(Gauss), K: (K-factor from table), L: (Inductance in uh), ΔI (Peak to peak ripple current in Amps).. Part Number Definition: MPIxxV-xxx-R MPI = Product code xx= Height indicator V=Version indicator xxx= inductance value in μh, R= decimal point, If no R is present then last character equals number of zeros -R suffix = RoHS compliant Dimension A MPIV. maximum MPIV. maximum, No marking All soldering surfaces to be coplanar within. millimeters Tolerances are ±. millimeters unless stated otherwise Pad layout tolerances are ±. millimeters unless stated otherwise Do not route traces or vias underneath the inductor
MPI-V High current, low profile, miniature power inductors Technical Data 649 Effective July 8 Packaging information (mm) Supplied in tape and reel packaging, parts per 7 diameter reel Core loss vs. Bp-p (+ C). MPIV-R-R. MPIV-R47-R.. khz khz khz.. khz khz khz....
Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Core loss vs. Bp-p (+ C) MPIV-R68-R MPIV-R-R... khz khz khz... khz khz khz..... MPIV-R-R. MPIV-R-R.. khz khz khz.. khz khz khz..... MPIV-R-R. MPIV-4R7-R.. khz khz khz.. khz khz khz.... 4
MPI-V High current, low profile, miniature power inductors Technical Data 649 Effective July 8 Core loss vs. Bp-p (+ C) MPIV-R-R MPIV-R47-R.... khz khz khz.. khz khz khz..... MPIV-R68-R. MPIV-R-R.. khz khz khz.. khz khz khz....... MPIV-R-R khz khz khz... MPIV-R-R khz khz khz....
Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Core loss vs. Bp-p (+ C). MPIV-R-R. MPIV-4R7-R. khz. khz. khz khz. khz khz.... Inductance and Q vs. Frequency MPIV-R-R MPIV-R47-R.4 6.7.4.. 4..........,. 4.6 4..4.... MPIV-R68-R. 7 6.8 4.6.4.. MPIV-R-R. 6.8.6.4 4...8.6.4....... 6
MPI-V High current, low profile, miniature power inductors Technical Data 649 Effective July 8 Inductance and Q vs. Frequency MPIV-R-R MPIV-R-R.. 4........... 4. 4.............. MPIV-R-R 9 4 8 4 7 6 4. MPIV-4R7-R. 4 9. 8. 7. 6.. 4.......... MPIV-R-R.4.4 9. 8. 7 6.. 4..... MPIV-R47-R.8.7 9 8.6 7. 6.4. 4... 7
Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Inductance and Q vs. Frequency. MPIV-R68-R 8. MPIV-R-R 6..8.6.4. 7 6 4.8.6.4...8.6.4. 4.... Frequency (MHz). MPIV-R-R 4. MPIV-R-R 4 4 4 4 4... value Q..... MPIV-R-R MPIV-4R7-R 9 4 8 7 6 4 9 8 7 6 4.. 8
MPI-V High current, low profile, miniature power inductors Technical Data 649 Effective July 8 Inductance and temperature rise vs. Current.4 MPIV-R-R.6 MPIV-R47-R........ 4 6 7 8 9 8 7 6 4..4.... 4 6 7 8 9 8 7 6 4 MPIV-R68-R MPIV-R-R.8.7.6..4... 9 8 7 6 4...8.6.4. 9 8 7 6 4. 4 6. 4 MPIV-R-R MPIV-R-R.6.4...8.6.4. 9 8 7 6 4..... 9 8 7 6 4. 4..... 4 9
Technical Data 649 Effective July 8 MPI-V High current, low profile, miniature power inductors Inductance and temperature rise vs. Current. MPIV-R-R. MPIV-4R7-R. 9 8 4. 4. 9 8..... 7 6 4....... 7 6 4........ MPIV-R-R MPIV-R47-R........ 4 6 7 8 9 8 7 6 4..4.4........ 4 6 7 8 9 8 7 6 4 MPIV-R68-R MPIV-R-R.8.7.6..4... 9 8 7 6 4...8.6.4. 9 8 7 6 4. 4 6 7. 4 6
MPI-V High current, low profile, miniature power inductors Technical Data 649 Effective July 8 Inductance and temperature rise vs. Current.6 MPIV-R-R. MPIV-R-R.4 9 9...8.6.4. 8 7 6 4.... 8 7 6 4. 4..... 4........ MPIV-R-R.... 4 9 8 7 6 4 6.. 4..... MPIV-4R7-R... 9 8 7 6 4
Technical Data 6 Effective July 8 MPI-V High current, low profile, miniature power inductors Solder reflow profile T P Max. Ramp Up Rate = C/s Max. Ramp Down Rate = 6 C/s t P T C - C Table - Standard SnPb Solder (T c ) Package Thickness Volume mm < Volume mm T L <.mm) C C Temperature T smax T smin Preheat A ts t.mm C C Table - Lead (Pb) Free Solder (T c ) Package Thickness Volume mm < Volume mm - Volume mm > <.6mm 6 C 6 C 6 C.6.mm 6 C C 4 C >.mm C 4 C 4 C C Time C to Peak Time Reference JDEC J-STD- Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak Temperature min. (T smin ) C C Temperature max. (T smax ) C C Time (T smin to T smax ) (t s ) 6- Seconds 6- Seconds Average ramp up rate T smax to T p C/ Second Max. C/ Second Max. Liquidous temperature (Tl) Time at liquidous (t L ) 8 C 6- Seconds Peak package body temperature (T P )* Table Table 7 C 6- Seconds Time (t p )** within C of the specified classification temperature (T c ) Seconds** Seconds** Average ramp-down rate (T p to T smax ) 6 C/ Second Max. 6 C/ Second Max. Time C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Eaton Electronics Division Eaton Boulevard Cleveland, OH 44 United States 8 Eaton All Rights Reserved Printed in USA Publication No. 649 BU-MC84 July 8 Eaton is a registered trademark. All other trademarks are property of their respective owners.