LED SMD Pb Lead-Free Part LG-195/-CT-88-A1 DATA SHEET DOC. NO : QW95-LG-195/-CT-88-A1 REV. : A DATE : 11 - Jul. - 211 發行 立碁電子 DCC
Page 1/12 Features: 1. Package in 8.mm carrier tape on 7" diameter reel. 2. Compatible with automatic placement equipment. 3. Compatible with infrared and vapor phase reflow solder process. Descriptions: 1. The LG-195 SMD Taping is much smaller than lead frame type components, thus enable smaller board size, higher packing density, reduced storage space and finally smaller equipment to be obtained. 2. Besides, lightweight makes them ideal for miniature applications. etc. Applications: 1. Automotive : backlighting in dashboard and switch. 2. Telecommunication : indicator and backlighting in telephone and fax. 3. Flat backlight for LCD, switch and symbol 4. General use. Device Selection Guide: PART NO MATERIAL Emitted COLOR Lens LG-195/-CT-88-A1 AlGaInP AlGaInP Red Green Water Clear
Page 2/12 Package Dimensions 2 1.55 1.5.18 Soldering Terminal.25.4 1.6 Die2 Die1 1.1.85 4 3 RESIN 2 _ 1 _.4 PCB.6.6 Note : 1.All dimension are in millimeter tolerance is ±.1mm unless otherwise noted. 2.Specifications are subject to change without notice. + Recommended Soldering Pad Dimensions 4 + 3 2.2.9 1.5.5 Note : The tolerances unless mentioned is ±.1mm,Angle±.5. Unit=mm.
Page 3/12 Absolute Maximum Ratings at Ta=25 Parameter Symbol Ratings UNIT Power Dissipation PD 72 78 mw Peak Forward Current Duty 1/1@1KHz IFP 9 6 ma Forward Current IF 3 3 ma Reverse Current @5V Ir 1 1 μa Electrostatic Discharge ESD 2 2 V Operating Temperature Topr -4 ~ +85 Storage Temperature Tstg -4 ~ +1 Typical Electrical & Optical Characteristics (Ta=25 ) Items Symbol Min. Typ. Max. UNIT CONDITION 5 ---- 125 Luminous Intensity Iv mcd IF=2mA 2 ---- 5 Peak Wavelength λp ---- 642 ---- ---- 575 ---- nm IF=2mA Dominant Wavelength λd 627 ---- 633 57 ---- 576 nm IF=2mA Spectral Line Half-Width λ ---- 2 ---- ---- 2 ---- nm IF=2mA Forward Voltage VF 1.5 ---- 2.4 1.7 ---- 2.6 V IF=2mA Viewing Angle 2θ 1/2 ---- 13 ---- ---- 13 ---- deg IF=2mA Note : 1.The forward voltage data did not including ±.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.
Page 4/12 Luminous Intensity Classification BIN CODE Min. Iv(mcd) at 2mA Max. P 5 8 Q 8 125 BIN CODE M N Iv(mcd) at 2mA Min. 2 32 Max. 32 5 Dominant Wavelength Classification BIN CODE 3 31 λd(nm) at 2mA Min. Max. 627 63 63 633 BIN CODE 8 9 1 Min. 57 572 574 λd(nm) at 2mA Max. 572 574 576
Page 5/12 Typical Electro-Optical Characteristics Curve 8 CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 1 3.5 Forward Current(mA) 1 1 Relative Intensity Normalize @2mA 3. 2.5 2. 1.5.5.1 1.5 2. 2.5 3. 1 1 1 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature 1.2 3. Forward Voltage@2mA Normalize @25 1.1.9.8-4 -2-2 4 Relative Intensity@2mA Normalize@25 2.5 2. 1.5.5 6 8 1-4 -2 2 4 6 8 1 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity@2mA.5 55 6 65 7 Wavelength (nm)
Page 6/12 Typical Electro-Optical Characteristics Curve 8 CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current 6 2. Forward Current(mA) 5 4 3 2 1.5 1.5 2. 2.5 3. Relative Intensity Normalize @2mA 1 1 1 Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@2mA Normaliz @25 1.2 1.1.9.8-2 2 4 6 8 Relative Intensity @2mA Normalize @25 2.5 2. 1.5.5-2 2 4 6 8 Ambient Temperature( ) Ambient Temperature( ) Fig.5 Relative Intensity vs. Wavelength Fig.6 Directive Radiation Relative Intensity @2mA.5 5 55 6 65 Wavelength (nm)
Page 7/12 Carrier Tape Dimensions.23 4.±.2 2. 1.75 1.75 8.±.3 5.3 3.5±.2.7 1.65 4.±.2 Note : The tolerances unless mentioned is ±.1mm,Angle±.5. Unit=mm. Packing Specifications Label Aluminum Moist-Proof bag Label Part No. LG-195/-CT Description 8.mm tape,7"reel Quantity/Reel 4 devices
Page 8/12 Label Explanation Pb PART : LOT : QTY(PCS): LIGITEK ELECTRONICS CO., LTD. LG-195/-CT-88-A1 GS1-8168 4 VF:1.5-2.4 BIN/HUE : P/3 - M/8 VF:1.7-2.6 BIN : Luminous Intensity HUE : Dominant Wavelength 1.5-2.4 : Red Chip Forward Voltage 1.7-2.6 : Blue Chip Forward Voltage Reel Dimensions 2.±.5.8.6.4.2.2.4.6.8 178±1.5 6± ψ13.5± 9.± 12.±
Page 9/12 Box Explanation 1. 5 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L 3. 1 INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H
Page 1/12 Recommended Soldering Conditions 1. Hand Solder Basic spec is 28 3 sec one time only. LIGITEK ELECTRONICS CO.,LTD. 2. Wave Solder Soldering heat Max. 26 245±5 within 5 sec 12 ~ 15 Preheat 12 ~ 18 sec 3 PB-Free Reflow Solder 1~5 C/sec 26 C MaX. 1sec.Max 1~5 C/sec Preheat 18~2 C Above 22 C 6 sec.max. 6 C/sec 12 sec.max. Note: 1.Reflow soldering should not be done more than two times. 2.When soldering,do not put stress on the LEDs during heating. 3.After soldering,do not warp the circuit board.
Page 11/12 Precautions For Use: Storage time: 1.The operation of Temperatures and RH are : 5 ~35,RH6%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year at <3 and <9% relative humidity(rh) (from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH6%, they should be treated at 6 ± 5 fo r 15hrs. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 4% of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded.
Page 12/12 Reliability Test: Classification Test Item Test Condition Reference Standard Operating Life Test 1.Ta=Under Room Temperature As Per Data Sheet Maximum Rating. 2.If=2mA 3.t=1 hrs (-24hrs, +72hrs) MIL-STD-75D: 126 MIL-STD-883D: 15 JIS C 721: B-1 High Temperature Storage Test 1.Ta=15 ±5 2.t=1 hrs (-24hrs, +72hrs) MIL-STD-883D:18 JIS C 721: B-1 Endurance Test Low Temperature Storage Test 1.Ta=-4 ±5 2.t=1 hrs (-24hrs, +72hrs) JIS C 721: B-12 High Temperature High Humidity Storage Test 1.Ta=65 ±5 2.RH=9%~95% 3.t=1hrs Ó2hrs MIL-STD-22F:13B JIS C 721: B-11 Thermal Shock Test 1.Ta=15 ±5 &-4 ±5 (1min) (1min) 2.total 1 cycles MIL-STD-22F: 17D MIL-STD-75D: 151 MIL-STD-883D: 111 Solderability Test 1.T.Sol=235 ±5 2.Immersion time 2 ±.5sec 3.Coverage 95% of the dipped surface MIL-STD-22F: 28D MIL-STD-75D: 226 MIL-STD-883D: 23 IEC 68 Part 2-2 JIS C 721: A-2 Environmental Test Temperature Cycling 1.15 ~ 25 ~ -55 ~ 25 3mins 5mins 3mins 5mins 2.1 Cyeles MIL-STD-22F: 17D MIL-STD-75D: 151 MIL-STD-883D: 11 JIS C 721: A-4 IR Reflow 1.T=26 C Max. 1sec.Max. 2. 6 Min MIL-STD-75D:231.2 J-STD-2