Core Business: Semiconductor-related Inspection Equipment

Similar documents
Plan Optik AG. Plan Optik AG PRODUCT CATALOGUE

Advanced Packaging Solutions

Nanotechnology, the infrastructure, and IBM s research projects

Advanced Stepper Lithography Technology to Enable Flexible AMOLED Displays. Keith Best Roger McCleary Elvino M da Silveira 5/19/17

450mm patterning out of darkness Backend Process Exposure Tool SOKUDO Lithography Breakfast Forum July 10, 2013 Doug Shelton Canon USA Inc.

GSEF 2019 Advisory Board

SOLAR CELL INSPECTION WITH RAPTOR PHOTONICS OWL (SWIR) AND FALCON (EMCCD)

Lithography. Development of High-Quality Attenuated Phase-Shift Masks

Applications of Maskless Lithography for the Production of Large Area Substrates Using the SF-100 ELITE. Jay Sasserath, PhD

Lithography Industry Collaborations

Outline. 1 Introduction. 2 Basic IC fabrication processes. 3 Fabrication techniques for MEMS. 4 Applications. 5 Mechanics issues on MEMS MDL NTHU

MAPPER: High throughput Maskless Lithography

Contributing to Society through Business

EUV Substrate and Blank Inspection

450mm and Moore s Law Advanced Packaging Challenges and the Impact of 3D

Nikon Medium Term Management Plan

Triple i - The key to your success

Partner for Success Secure & Smart Future Home

Capacitive sensors capancdt

SEMI Connects: An Overview of SEMI Worldwide. Theresia Fasinski - Manager Membership Relations, SEMI Europe

AGC Glass Technology Solution to Highly Functional Display Needs

Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography

LSI ON GLASS SUBSTRATES

The End of Thresholds: Subwavelength Optical Linewidth Measurement Using the Flux-Area Technique

Results of Proof-of-Concept 50keV electron multi-beam Mask Exposure Tool (emet POC)

Electron Multi-Beam Technology for Mask and Wafer Direct Write. Elmar Platzgummer IMS Nanofabrication AG

Direct printing tools for flexible hybrid electronics assembly. David Grierson, Ph.D. President & CTO of systemech, LLC

Feature-level Compensation & Control

FINDINGS. REU Student: Philip Garcia Graduate Student Mentor: Anabil Chaudhuri Faculty Mentor: Steven R. J. Brueck. Figure 1

i- Line Photoresist Development: Replacement Evaluation of OiR

Addressing the Design Challenges of RF/ Millimeter Wave Semiconductor Packaging

Lithography in our Connected World

Manufacturing Process of the Hubble Space Telescope s Primary Mirror

Recommended Dressing per Application

PHGN/CHEN/MLGN 435/535: Interdisciplinary Silicon Processing Laboratory. Simple Si solar Cell!

Optical Requirements

Photolithography I ( Part 1 )

Introduction of Nikon s Large Silica Glass Plate

Technology for the MEMS processing and testing environment. SUSS MicroTec AG Dr. Hans-Georg Kapitza

Global Artificial Intelligence (AI) Semiconductor Market: Size, Trends & Forecasts ( ) August 2018

Microsystem Technology for Eddy Current Testing Johannes PAUL, Roland HOLZFÖRSTER

Part 5-1: Lithography

In 1984, a cell phone in the U.S. cost $3,995 and

Major Fabrication Steps in MOS Process Flow

Consumer Electronics: from chip to system

End-of-line Standard Substrates For the Characterization of organic

EE-527: MicroFabrication

Combined expertise in the field of optical 3D gauging technology ensures market advantage

From Sand to Silicon Making of a Chip Illustrations May 2009

Enabling rich and varied image creation

Day One 13 March Day Two 14 March 2019

No soft touch only automated systems can boost productivity and quality when lapping/polishing fragile GaAs wafers

Intel's 65 nm Logic Technology Demonstrated on 0.57 µm 2 SRAM Cells

Creating a Public Safety Ecosystem

Chapter 15 Summary and Future Trends

New Structured Light Projection and Image Processing Sensor. Phoenix

Energy & Space. International Presentations

How material engineering contributes to delivering innovation in the hyper connected world

Process Optimization

Section 2: Lithography. Jaeger Chapter 2. EE143 Ali Javey Slide 5-1

Finishing first how automated systems improve the productivity and repeatability of wafer lapping and polishing

ASM Webinar Digital Microscopy for Materials Science

Two major features of this text

INDUSTRIAL TECHNOLOGIES FOR SCHOOLS

AOARD REPORT The Photomask Japan '94 Held 22 April 94 at Kawasaki Science Park, Kanagawa, Japan

Inspection of templates for imprint lithography

Miniaturization trends in medical imaging enabled by full wafer level integration if micro camera modules

World Semiconductor Council Anticounterfeiting Task Force

All-Glass Gray Scale PhotoMasks Enable New Technologies. Che-Kuang (Chuck) Wu Canyon Materials, Inc.

32nm High-K/Metal Gate Version Including 2nd Generation Intel Core processor family

National Projects on Semiconductor in NEDO

Mask Technology Development in Extreme-Ultraviolet Lithography

Image sensor combining the best of different worlds

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. The lithographic process

KÜNSTLICHE INTELLIGENZ JOBKILLER VON MORGEN?

Application Bulletin 240

Section 2: Lithography. Jaeger Chapter 2 Litho Reader. EE143 Ali Javey Slide 5-1

UV LED CHIP SPECIFICATION

Beyond Moore the challenge for Europe

The Advantages of Integrated MEMS to Enable the Internet of Moving Things

shaping global nanofuture ULTRA-PRECISE PRINTING OF NANOMATERIALS

The Future is Now: Are you ready? Brian David

Opto-Mechanical Equipment of KBTEM: Present Day and the Future

A Review of Related Work on Machine Learning in Semiconductor Manufacturing and Assembly Lines

Advanced Packaging Lithography and Inspection Solutions for Next Generation FOWLP-FOPLP Processing

Advanced wafer processing: Ready for the new PV generation 5 th Annual c-si PVMC Workshop Christoph Eggimann

Electromechanical devices MM2EMD. Lecture 1 - Counting to 1024 on your fingers and getting robots to pour beer.

Semiconductor Process Diagnosis and Prognosis for DSfM

Machine Vision Beyond the Factory. Jeff Burnstein President October 18, 2012 Beijing

MicroPG 101 Pattern Generator Standard Operating Procedure Draft v.0.2

Aptina MT9P111 5 Megapixel, 1/4 Inch Optical Format, System-on-Chip (SoC) CMOS Image Sensor

B. Flip-Chip Technology

The Future of Technology

Photolithography Technology and Application

Hermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films

(Complementary E-Beam Lithography)

Performance data of a new 248 nm CD metrology tool proved on COG reticles and PSM s

Exhibit 2 Declaration of Dr. Chris Mack

Brief Introduction of Sigurd IC package Assembly

Infineon at a glance

Transcription:

Core Business: Semiconductor-related Inspection Equipment Lasertec manufactures unique inspection and measurement systems that incorporate the cutting-edge technologies of applied optics and offers them to customers worldwide. Our core business is the manufacture and sale of semiconductor-related inspection equipment.

1 Ubiquitous semiconductor devices Semiconductor devices are used in almost every electronic device and industrial product around us today. Their applications span a wide range of areas, from consumer products such as smartphones, PCs, TVs, and air-conditioning systems, to cars and trains, and to credit cards and digital currencies. Communication products Smartphone Telephone Tablet PC TV Automotive Digital camera Game console Surveillance camera Semiconductor Device Air-conditioning system Home electronics Train Industrial robot Washing machine Microwave oven 太陽光発電 Solar cell Vending machine Infrastructure and industrial equipment

2 Lasertec plays an important role behind the scenes Semiconductor devices are manufactured using photomasks, which serve as the source of original patterns for integrated circuits. Lasertec s inspection systems are designed to optically inspect photomasks and their pre-patterned substrates called mask blanks. 1 2 Mask Substrate Mask Blank (Blank) A glass plate from which a mask blank is made. A plate with light-shield metal coating applied to the surface of a mask substrate. A photomask is made from a mask blank. 3 Photomask (Mask) A plate with a circuit pattern defined on the surface of a mask blank. It provides the original pattern to be transferred to wafers in lithography. 4 Wafer Lithography A circular and thin semiconductor material made by slicing a crystalline silicon ingot extruded in a cylindrical shape. Circuit patterns are printed on a wafer in lithography to form integrated circuits. 5 Semiconductor Device Once integrated circuits are formed, the wafer is diced into individual chips. Each chip is then sealed with resin.

3 Mask to Semiconductor Device As electronic devices become more downsized and better performing, more masks are required. Photomask (Mask) Lithography Lithography Mask Reduction optics Light source Wafer Wafer Semiconductor device Electronic device The original circuit pattern on the mask is transferred to wafers in lithography using reduction optics. The process is repeated many times with different masks to print multiple-layer patterns on each wafer to create semiconductor devices.

4 Size of defects detected by Lasertec s inspection systems 1m Capybara (large rodent) 1m Semiconductor Mask Blanks Inspection System Semiconductor Mask Inspection System 1mm Water flea 2mm Hair 100µm 1µm E. coli 1µm Defect on blank material Defect on patterned mask 5µm Influenza virus 100nm 1nm DNA 2nm One nanometer is a billionth of one meter.

5 Semiconductor devices will be used in greater numbers. Mobile / IoT Data Center AI Automotive Various things connected to the Internet Massive data storage Emergence of artificial intelligence Electric vehicles, onboard electronics, and self-driving cars The expansion of these four areas will dramatically increase the demand for semiconductor devices. Logic devices for calculation and image processing Image sensors for light sensing and imaging Memories for data storage Power devices for optimum power conversion and control As the scope of semiconductor application expands and the demand for semiconductor devices increases, inspection systems will be required in greater numbers. Lasertec will offer the cutting-edge technologies of inspection and metrology to meet the requirement and contribute to society.