(Chairperson) Session Chair Ms. Bettina WEISS SEMI (Global Headquarters), USA Vice President, Business Development and Product Management As Vice President of Business Development and Product Management, Bettina Weiss supports the diverse product needs of association members, as well as assesses strategic emerging opportunities for member company engagement in the extended global manufacturing supply chain. Weiss joined SEMI in 1996 and held a variety of positions in SEMI s International Standards department, including department lead, until 2008. From 2008 to 2012 she had global responsibility for SEMI's Photovoltaic/Solar Business Unit which then expanded into a broader business development role including the integration of SEMI Strategic Association Partners FlexTech and MEMS & Sensors Industry Group. In addition, since 2017, Weiss has been responsible for developing strategy and global implementation plans of SEMI s Smart Transportation vertical platform, with its current emphasis on the automotive electronics supply chain. Prior to joining SEMI, Weiss worked in sales and marketing positions at Metron Semiconductor and Varian Semiconductor in Munich, Germany. She holds a BA from the International School for Applied Languages in Munich, Germany, and is a certified translator for Anglo-American Law and Economics.
(13:05-13:30hrs) Ms. Jian ZHANG NXP Semiconductors Singapore Pte Ltd, Singapore Vice President, Front End Innovation, Global Technology Innovation Machine, Integral Part of Human Society Moore s Law is dead! - this voice grew louder over last few years as for each new process generation, process development cycle is longer, product design cost is higher, manufacturing die cost is increasing. Customers are hesitating to join the new process node band-wagon Looking beyond seemingly staling CMOS scaling, however, semiconductor industry just ushered in a new era, characterized by its readiness for: new memory solution, new extremely low power design, new packaging, new peripheral sensory nodes This is an era of ubiquitous human/machine communication, where machines are integral part of human society. Multi-facet innovation, investment and integration will enable tremendous growth in semiconductor industry, and transform our everyday life. Jian Zhang is Vice President in NXP Semiconductors, heading Front End Innovation, NXP s global Si technology development group that delivers Si technologies that support all new products in diverse markets, including automotive (high performance auto MCU, battery management, infotainment, radar, V2X), mobile (secure transaction, power delivery and secure interface, mobile LNA and switch) and consumer, IoT. Prior to NXP, Jian was senior director of Integration and Product Yield engineering in Global Foundries, Singapore. Jian has also served various leadership positions in HiSilicon, SMIC, Avago (HP).
(13:30-13:55hrs) Dr. Bo HUANG McKinsey &, Singapore Senior Engagement Manager Key Disruptions and Impact on Semiconductor Industry Disruption 2.0 (2015 onwards) is creating a step change in productivity and enable new experiences. We automate activities, experience productivity leap, and enablers new types of interactions. Five key disruptions will fundamentally change how companies function, and have deep implication for semiconductor industry, namely artificial intelligence/machine learning, virtual reality/augmented reality, FinTech, Industrial IoT, Connected car. 1. AI/ML: Data explosion, algorithmic advances, and computing hardware improvement accelerated development and adoption of AI/ML applications. AI will grow at 50% annually in the next decade with Machine Learning being the dominant technology. How does this drive semiconductor s next wave of growth? 2. IIoT: Industrial IoT could have over $4T economic impact by 2025. Primarily factories use IIoT, covering 80% of total IloT. Among all tech stacks in the Industrial IoT, ranging from security, Apps, platform, cloud infrastructure, connectivity, hardware, where are the companies playing? How do Semiconductor players capture value besides sensors, actuators, and other components that collect and relay contextual/real-world data? 3. Connected car: more than 50% of cars by 2025 will be partially automated. Where can Semiconductor players integrate into the autonomous driving architecture, beyond central computer hardware (High-performance, graphic-intensive, low-power, multi-core processing), real-time onboard processing (noise filtering, obstacle detection, distance monitoring), and sensors (camera/sonar)? 4. VR/AR market size is projected to be above 40B by 2020. How much demand does that generate for display and semi components (IC, memory, sensors etc) 5. FinTech: market size could reach 200B by 2025, while hardware component market is expected to grow from 7B in 2016 to 15B in 2025. Which component represents the largest growth potential? NFC chips for mobiles, fingerprint ID for mobile, point of sales terminals (processors, RAM, flash, display)? What are the winners doing to capture opportunities in Disruption 2.0? What are the key questions you need to ask yourself before getting started?
Bo is currently a Singapore-based Senior Engagement Manager at global management consulting firm McKinsey and. He is a core leader at McKinsey s Semiconductor Industry Practice in Southeast Asia. Bo has served multiple semiconductor clients through performance improvement programs for both front-end and back-end operations. His client spans geographies including Thailand, Malaysia, Singapore, and China. His focus in semiconductor work is on labor productivity improvement, shop floor automation, material cost optimization, subcontractor performance management, yield loss reduction and manufacturing technology roadmap. In addition to semiconductor industry, Bo has also served clients from multiple other sectors, including medical devices, basic material, and industrial equipment.
(13:55-14:20hrs) Mr. Dhruv SUBBIAH Festo Sdn Bhd, Malaysia Country Manager of Festo Malaysia and Festo Vietnam Smart Factory of the Future - Next Era of Manufacturing FESTO is a Global Leader in Industrial Automation, and has been deploying its products and services to meet the challenge of smart production for the future. FESTO has been a pioneer in Germany regarding the topic of Smart Production and Industry 4.0 and has set-up a Technology Factory/Smart Factory in Scharnhausen-Germany to manufacture valves, valve terminals and electronics. The factory is characterized by productive and energy-efficient processes, top-quality products and a pronounced customer focus, as well as sustainable and green fabrication. This was an important step & trend in Germany to shape the future world of Production, the Industry 4.0 in practice. Many of the aspects and elements of Industry 4.0 are already a reality in the Technology Plant, so in other words, the FESTO Technology Plant in Scharnhausen-Germany is a tangible example in the Production world, in which elements of Industry 4.0 have been implemented. Dhruv Subbiah is the Country Manager of FESTO Malaysia and Vietnam. He started his career with FESTO Germany in 1999 after his Masters in Engineering from the University of Karlsruhe-Germany. Dhruv has over 18 years of experience with FESTO in Engineering, Sales and Operations, and has been located in Germany, India, Singapore and Malaysia. He is a passionate Engineer and very actively involved with the topic Industry 4.0 in Malaysia.
(14:20-14:45hrs) Mr. Michael LEONG SESTO Robotics Pte Ltd, Singapore Chief Executive Officer Intelligent Robots for Automation Enablement in Industry 4.0 In a business climate where global competition is getting increasingly intense, enterprises today are required to re-examine existing work processes. To meet stringent demands of productivity and accuracy, companies are exploring Industry 4.0 practices and adopting robotics solutions. The presentation will explore the use of automated guided vehicles and intelligent mobile robots as smart manufacturing tools for the semiconductor manufacturing industry to maintain its competitive edge. Michael is the Chief Executive Officer of SESTO Robotics, a subsidiary of HOPE Technik specialising in the field of autonomous technology. In his capacity, he oversees the business goals of the company and has steered SESTO Robotics to achieve a strong global footprint. This includes securing major contracts and the setup of a subsidiary office in less than a year of company formation. Michael s experience with robotics technology coupled with his in-depth knowledge of the industry has led him to be appointed as the chairman of SPRING Singapore s Technical Committee for Automation and Robotics which focuses on identifying and evaluating new standards in automation and robotics. Previous appointments include a subcommittee member of The Committee of the Future Economy (Ministry of Finance, Singapore) to review Singapore s economic strategies, committee member of Singapore Manufacturing Federation s Personal Care Robot Standards to develop standards for use of robotics in Singapore as well as for Singapore International Robo Expo, steering the conference and exhibition content to suit industrial needs in Singapore. Prior to managing SESTO Robotics, Michael co-founded HOPE Technik in 2006 which has since grown from a start-up to a successful group that has developed over 400 integrated solutions and world-class products. At HOPE Technik, Michael held various roles such as design engineer, project manager and manufacturing team leader. He was also responsible for executive duties pertaining to finance, corporate development and administration. Before HOPE Technik, Michael worked at Asian Touring Car Championship and was the Chief Engineer of the company s professional race team. He is also an alumni of National University of Singapore.
(15:15-15:40hrs) Mr. Clark TSENG SEMI, Taiwan Senior Research Manager SEMI Market Outlook - Fab Investments, Equipment and Materials Forecasts Following the record setting pace of 2017, 2018 is forecasted to be another growth year for the semiconductor industry. Equipment spending for 2018 spending is currently expected to surpass 2017. In addition, as applications for advanced devices and advanced packages grows the semiconductor materials market will expand as well. The presentation will provide the latest forecasts from SEMI for fab investment, capacity trend, equipment and materials spending, including updated information specific to packaging materials. Clark is a senior research manager at SEMI. His major responsibility is to track and evaluate semiconductor front-end fab investment in Asia Pacific region. His research also spans over LED, flat panel display and PV industries. His expertise includes in-depth analysis of the industry dynamics, as well as the fundamentals of market forecasting, competitive analysis, and strategic planning. Prior to SEMI, Clark worked for Qimonda as the manager at Strategy and Business Development division, where he managed market & competitive intelligence function in Asia/Pacific. Clark Tseng received a Bachelor of Business Administration and a Bachelor of Arts in International Relations from National Chengchi University in Taiwan.
(15:40-16:05hrs) Mr. Richard YAMAGUCHI Tokyo Electron Ltd (TEL), Japan Vice President, Corporate Technical Marketing Driver of the Future: Semiconductor Technology As semiconductors are further evolved and adopted for many applications, it is expected that the market will grow dramatically around data centers. In the device technology that supports the evolution, the direction of evolution varies depending on the type of the device. Logic devices require scaling and complicated structures, DRAM is reaching scaling limits and alternative memory elements are currently being developed. NAND, which had already reached its physical scaling limits in two-dimension, has changed to a three-dimensional structure. The evolutions of semiconductor devices can realize AI society by lower power consumption. Richard Yamaguchi is currently the Vice President of the Corporate Technical Marketing Department at Tokyo Electron Limited (TEL). He is broadly responsible for technology development at TEL, including Device Technology Project and Emerging technology Project. Besides, he is also responsible for key account technology management, which leads to more efficient development strategy and better technical engagement with customers. Prior to current position, he worked at TEL Coater/Developer Business Unit for 27 years since 1990. During which, he has served various management positions including marketing, strategic account management and new product development.
(16:05-16:30hrs) Mr. Dick JAMES TechSearch International Inc, USA Senior Analyst Drivers and Applications for FO-WLP: What s Next? Volumes for fan-out wafer level packages (FO-WLPs) continue to be driven by application processors, RF transceivers and switches, power management integrated circuits (PMICs), audio CODEC, connectivity modules, sensors, and radar modules for automobiles. The adoption of TSMC s InFO in Apple iphone 7, 8 and X indicate the electrical performance advantages of the high-density FO-WLP. What is the future for FO-WLP? What formats will be the most popular? What new applications are expected? How will the package cost be reduced? This presentation examines the constructions of various FO-WLPs in production today and addresses these questions. Dick James is a Senior Analyst with TechSearch International, Inc. providing market research and technology trend analysis in the semiconductor industry since 1987. Prior to joining TechSearch, Dick was Senior Fellow/Technology Analyst at Chipworks (now TechInsights) for over 20 years, acting as a consultant to staff and customers, dealing with the microstructural characterization of devices, both process and packaging. He is now a Fellow Emeritus at TechInsights and presents at many technical conferences. He also writes a blog at TechInsights.com and Solid State Technology. Dick graduated in 1971 with a M.Sc. in Microelectronics and Semiconductor Devices from the University of Southampton in England, and a B.Sc. in Applied Chemistry from the University of Salford. He has over 45 years of experience in process development, design, manufacturing, packaging and reverse engineering of semiconductor devices.