Standard ectifier Module 2x2 M I A FA F.4 Phase leg Part number MDMAP2TG Backside: isolated 2 3 Features / Advantages: Applications: Package: TO-24AA Package with DCB ceramic Improved temperature and power cycling Planar passivated chips ery low forward voltage drop ery low leakage current Diode for main rectification For single and three phase bridge configurations Supplies for DC power equipment Input rectifiers for PWM inverter Battery DC power supplies Field supply for DC motors Isolation oltage: 48 ~ Industry standard outline ohs compliant Height: 3 mm Base plate: DCB ceramic educed weight Advanced power cycling Terms Conditions of usage: The data contained in this product data sheet is exclusively intended for technically trained staff. The user will have to evaluate the suitability of the product for the intended application and the completeness of the product data with respect to his application. The specifications of our components may not be considered as an assurance of component characteristics. The information in the valid application- and assembly notes must be considered. Should you require product information in excess of the data given in this product data sheet or which concerns the specific application of your product, please contact your local sales office. Due to technical requirements our product may contain dangerous substances. For information on the types in question please contact your local sales office. Should you intend to use the product in aviation, in health or life endangering or life support applications, please notify. For any such application we urgently recommend - to perform joint risk and quality assessments; - the conclusion of quality agreements; - to establish joint measures of an ongoing product survey, and that we may make delivery dependent on the realization of any such measures.
ectifier Symbol SM M I I Definition 2 2 T 25 C J T 5 C atings typ. max. 3 F forward voltage drop I A T 25 C.2 F T C C thermal resistance junction to case.3 K/W FA max. non-repetitive reverse blocking voltage reverse current I F Conditions A T 25 C J F threshold voltage T J 5 C.82 for power loss calculation only r F slope resistance 2.8 mω thjc thch max. repetitive reverse blocking voltage T 25 C J average forward current thermal resistance case to heatsink I F 22 A I F 22 A rectangular d.5 P tot total power dissipation T 25 C 45 W J J T 25 C I FSM max. forward surge current t ms; (5 Hz), sine T J 45 C t 8,3 ms; (6 Hz), sine t ms; (5 Hz), sine t 8,3 ms; (6 Hz), sine C J junction capacitance 4 ; f MHz T 25 C 73 J C T J 5 C I²t value for fusing t ms; (5 Hz), sine T 45 C t 8,3 ms; (6 Hz), sine t ms; (5 Hz), sine t 8,3 ms; (6 Hz), sine T J 5 C T 5 C J J min..2 2 2.44.4.44 2. 2.6.7.84 2. 9.4 4.5 4. Unit µa ma A K/W ²s ²s ²s ²s J pf
Package atings Symbol Definition Conditions min. typ. max. Unit I MS MS current per terminal 2 A T J virtual junction temperature -4 5 C T op operation temperature -4 25 C Weight M D M T dspp/app dspb/apb TO-24AA T stg storage temperature -4 25 C ISOL mounting torque 2.5 terminal torque 2.5 creepage distance on surface striking distance through air isolation voltage t second t minute terminal to terminal terminal to backside 5/6 Hz, MS; I ISOL ma 3. 9.7 6. 6. 48 4 76 4 4 g Nm Nm mm mm Date Code + Assembly Line yywwaa Part Number Lot.No: xxxxxx Circuit Data Matrix Part description M D M A P 2 TG Module Diode Standard ectifier (up to 8) Current ating Phase leg everse oltage [] TO-24AA Ordering Standard Ordering Number Marking on Product Delivery Mode Quantity Code No. MDMAP2TG MDMAP2TG Box 36 5434 Equivalent Circuits for Simulation * on die level T 5 C I ectifier J max threshold voltage.82 max slope resistance *.6 mω
Outlines TO-24AA 2 3
ectifier 3 5 25 6 2 I F 5 I FSM 2 T J 45 C I 2 t T J 45 C 4 [A 2 s] T J 5 C T J 5 C 5 8 T J 25 C T J 25 C T J 5 C.5..5 2. F [] Fig. Forward current versus voltage drop per diode 8 5 Hz, 8% M... t [s] Fig. 2 Surge overload current vs. time per diode 3 2 2 3 4 5 6 7 8 9 t [ms] Fig. 3 I 2 t versus time per diode 5 2 P tot 9 [W] 6 DC.5.4.33.7.8 thha. K/W.2 K/W.4 K/W.6 K/W.8 K/W. K/W 6 2 I F(A)M 8 DC.5.4.33.7.8 3 4 2 4 6 8 2 I F(A)M Fig. 4 Power dissipation vs. forward current and ambient temperature per diode 5 5 T amb [ C] 5 5 T C [ C] Fig. 5 Max. forward current vs. case temperature per diode.35.3.25 Z thjc.2 [K/W].5..5 Constants for Z thjc calculation: i thi (K/W) t i (s).. 2.4.3 3.6.7 4.9.4. t [ms] Fig. 6 Transient thermal impedance junction to case vs. time per diode