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DATA SHEET: SpiceLED TM InGaN S-Spice : SSx-HLD-I2 SpiceLED TM Like spice, its diminutive size is a stark contrast to its standout performance in terms of brightness, durability and reliability. Despite being the smallest in size yet the SpiceLED packs a powerful performance and is a highly reliable design device. Its versality enables its application in automotive applicances, key-pad illumination, hand-held devices such as PDAs, notebooks, compact back-lighting applications, consumer appliances, office equipment, audio and video equipment. Features: > High brightness surface mount LED. > Super wide viewing angle of 160. > Equivalent to 0603 package outline. Copper lead-frame construction. > Qualified according to JEDEC moisture sensitivity Level 2. > Compatible to IR reflow soldering. > Environmental friendly; RoHS compliance. > Compliance to automotive standard; AEC-Q101. Applications: > Automotive: interior applications, eg: switches, telematics, climate control system, dashboard, etc. > Consumer Appliances: LCD illumination as in PDAs, LCD TV. > Communication: indicator and backlight in mobilephone. > Display: full color display video notice board. > Industrial: white goods (eg: Oven, microwave, etc.). 2005 SpiceLED is a trademark of. All rights reserved. Product specifications are subject to change without notice. 1

Optical Characteristics at Tj=25 C Part Ordering Number Color Viewing Angle Luminous Intensity @ IF = 2mA IV (mcd) Min. Typ. Max. Appx. 1.1 SSB-HLD-KL2-1-I2 Blue, 470 nm 160 7.2 11.2 18.0 SST-HLD-P2Q-1-I2 True Green, 525nm 160 56.0 90.0 112.5 Electrical Characteristics at Tj=25 C Part Number Min. (V) Appx. 3.1 Vf @ If = 2mA Typ. (V) Max. (V) Vr @ Ir = 10uA Min. (V) SSx-HLD 2.50 2.75 3.00 5 Absolute Maximum Ratings DC forward current Maximum Value 20 Unit ma Peak pulse current; (tp 10µs, Duty cycle = 0.1) 100 ma Reverse voltage; Ir max = 10µA 5 V ESD threshold (HBM) 2000 V LED junction temperature 120 C Operating temperature -40 +110 C Storage temperature -40 +110 C Power dissipation (at room temperature) 75 mw Thermal resistance - Junction / ambient, R th JA - Junction / solder point, R th JS (Mounting on FR4 PCB, pad size >= 16 mm2 per pad) 480 280 K/W K/W 2

Wavelength Grouping at Tj=25 C SSB; Blue Color Group Full A B Wavelength distribution (nm) 464-476 464-470 470-476 Appx. 2.2 SST; True Green Full A B C 520-535 520-525 525-530 530-535 Luminous Intensity Group at Tj=25 C Brightness Group K1 K2 L1 L2 P2 Q1 Q2 Luminous Intensity IV (mcd) 7.2... 9.0 9.0... 11.2 11.2... 14.0 14.0... 18.0 56.0... 71.5 71.5... 90.0 90.0... 112.5 Appx. 1.1 3

Forward Current I F (ma) Allowable Forward Current I F ( ma ) Relative Wavelength λrel (nm) Forward Current I F (ma) TM Relative Luminous Intensity Vs Forward Current I V /I V (2mA) = f(i F ); Tj = 25 C 7.0 20 Forward Current Vs Forward Voltage I F = f(v F ); T j = 25 C Relative Luminous Intensity I rel 6.0 5.0 4.0 3.0 2.0 1.0 18 16 14 12 10 8 6 4 2 0.0 0 5 10 15 20 Forward Current I F (ma) 0 2.6 2.7 2.8 2.9 3.0 3.1 3.2 Forward Voltage V F (V) 30 25 20 15 10 5 Maximum Current Vs Temperature I F =f(t) T a = Ambient Temperature 0 0 10 20 30 40 50 60 70 80 90 100 110 120 T a Temperature T( C) Relative Luminous Intensity I rel 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 Relative Spectral Emission I rel = f(λ); T j = 25 C; I F = 2mA Blue True Green 400 450 500 550 600 650 700 750 800 Wavelength λ (nm) 1000 Allowable Forward Current Vs Duty Ratio ( T j = 25 C; t p 10μs) Relative Wavelength Shift Vs Forward Current λdom = f(i F ); Tj = 25 C 2.00 1.00 dom F j 0.00-1.00 Blue 100-2.00-3.00 True Green -4.00-5.00 10 0.1 1 10 100 Duty Ratio, % -6.00 0 2 4 6 8 10 12 14 16 18 20 Forward Current I F (ma) 4

Relative Wavelength λdom(nm) Relative Forward Voltage V F (V) TM 30 o 20 o Radiation Pattern 10 o 0 o 1.0 Relative Forward Voltage Vs Junction Temperature V F = V F - V F (25 C) = f(t j ); I F =2mA 0.4 0.3 40 o 0.8 0.2 True Green 50 o 60 o 0.6 0.4 0.1 0.0-0.1 Blue 70 o 0.2-0.2 80 o -0.3 90 o 0-0.4-50 -30-10 10 30 50 70 90 110 130 Junction Temperature T j ( C) Relative Luminous Intensity Vs Junction Temperature I V /I V (25 C) = f(t j ); I F = 2mA 2.0 10.0 Relative Wavelength Vs Junction Temperature λdom = λdom - λdom (25 C) = f(tj); IF =2mA Relative Luminous Intensity I rel 1.8 1.6 1.4 True Green 1.2 1.0 0.8 Blue 0.6 0.4 0.2 0.0-50 -30-10 10 30 50 70 90 110 130 Junction Temperature T j ( C) 8.0 6.0 4.0 2.0 True Green 0.0-2.0 Blue -4.0-6.0-8.0 10.0-50 -30-10 10 30 50 70 90 110 Junction Temperature T j ( C) 5

SpiceLED TM InGaN S-Spice : SSx-HLD-I2 Package Outlines Note : Primary thermal path is through Cathode lead of LED package Material Material Lead-frame Cu Alloy With NiPdAu Plating Package High Temperature Resistant Epoxy Resin Note: product is Pb free 6

Recommended Solder Pad Note: Component is based on a new package platform, which features Bottom Only Terminations. Solder joints are only formed at the bottom of the component and solder fillet will not be observable as the sides of the component. Surface are not intended for soldering 7

Taping and orientation Reels come in quantity of 3000 units. Reel diameter is 180 mm. 8

Packaging Specification 9

Packaging Specification Moisture sensitivity level Barcode label (L) Lot No : lotno (P) Part No : partno (C) Cust No : partno ML TEMP 2 260 C RoHS Compliant (Q) Quantity : quantity (G) Grouping : group (D) D/C : date code Made in Malaysia (S) S/N : serial no Moisture absorbent material + Moisture indicator Reel Label The reel, moisture absorbent material and moisture indicator are sealed inside the moisture proof foil bag Average 1pc SpiceLED 1 completed bag (3000pcs) Weight (gram) 0.034 0.002 190 140 ± 10 TM Cardboard Box For SpiceLED TM Cardboard Box Size Dimensions (mm) Empty Box Weight (kg) Reel / Box Super Small 325 x 225 x 190 0.38 9 reels MAX Small 325 x 225 x 280 0.54 15 reels MAX Medium 570 x 440 x 230 1.46 60 reels MAX Large 570 x 440 x 460 1.92 120 reels MAX 10

Recommended Pb-free Soldering Profile Classification Reflow Profile (JEDEC J-STD-020C) 300 275 255-260 C 10-30s 250 225 217 C Ramp-up 3 C/sec max. Temperature ( C) 200 175 150 125 100 75 Preheat 60-180s 50 480s max 25 0 50 100 150 200 Time (sec) 60-150s Rampdown 6 C/sec max. 11

Appendix 1) Brightness: 1.1 Luminous intensity is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3). 1.2 Luminous flux is measured with an internal reproducibility of ± 8 % and an expanded uncertainty of ± 11 % (according to GUM with a coverage factor of k=3). 2) Color: 2.1 Chromaticity coordinate groups are measured with an internal reproducibility of ± 0.005 and an expanded uncertainty of ± 0.01 (accordingly to GUM with a coverage factor of k=3). 2.2 wavelength is measured with an internal reproducibility of ± 0.5nm and an expanded uncertainty of ± 1nm (accordingly to GUM with a coverage factor of k=3). 3) Voltage: 3.1 Forward Voltage, Vf is measured with an internal reproducibility of ± 0.05V and an expanded uncertainty of ± 0.1V (accordingly to GUM with a coverage factor of k=3). 12

Revision History Page - Subjects Initial release Date of Modification 15 Aug 2016 NOTE All the information contained in this document is considered to be reliable at the time of publishing. However, does not assume any liability arising out of the application or use of any product described herein. reserves the right to make changes to any products in order to improve reliability, function or design. products are not authorized for use as critical components in life support devices or systems without the express written approval from the Managing Director of. 13

About Us is a dynamic Malaysian Corporation that is among the world s leading SMT LED Manufacturers. An excellence driven organization, it offers a comprehensive product range for diverse industries and applications. Featuring an internationally certifi ed quality assurance acclaim, s extra bright LEDs are perfectly suited for various lighting applications in the automotive, consumer and communications as well as industrial sectors. With extensive industry experience and relentless pursuit of innovation, s state-of-art manufacturing, research and testing capabilities have become a trusted and reliable brand across the globe. More information about can be found on the Internet at http://www.dominant-semi.com. Please contact us for more information: Sdn. Bhd Lot 6, Batu Berendam, FTZ Phase III, 75350 Melaka, Malaysia. Tel: +606 283 3566 Fax: +606 283 0566 E-mail: sales@dominant-semi.com TM