N-channel 650 V, Ω typ., 16 A MDmesh M2 Power MOSFET in D2PAK, TO-220FP and TO-220 packages. Features STP24N65M2.

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Transcription:

STB24N65M2, STF24N65M2, STP24N65M2 N-channel 650 V, 0.185 Ω typ., 16 A MDmesh M2 Power MOSFET in D2PAK, TO-220FP and TO-220 packages Datasheet - production data Features Order codes VDS RDS(on) max ID STB24N65M2 STF24N65M2 STP24N65M2 650 V 0.23 Ω 16 A Extremely low gate charge Excellent output capacitance (Coss) profile 100% avalanche tested Zener-protected Figure 1: Internal schematic diagram Applications Switching applications Description These devices are N-channel Power MOSFETs developed using MDmesh M2 technology. Thanks to their strip layout and improved vertical structure, the devices exhibit low on-resistance and optimized switching characteristics, rendering them suitable for the most demanding high efficiency converters. Table 1: Device summary Order codes Marking Package Packaging STB24N65M2 STF24N65M2 STP24N65M2 24N65M2 D 2 PAK TO-220FP TO-220 Tape and reel Tube November 2014 DocID026475 Rev 2 1/20 This is information on a product in full production. www.st.com

Contents STB24N65M2, STF24N65M2, STP24N65M2 Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 9 4 Package mechanical data... 10 4.1 D2PAK package information... 10 4.2 TO-220FP package information... 13 4.3 TO-220 type A package information... 15 5 Packaging mechanical data... 17 6 Revision history... 19 2/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Electrical ratings 1 Electrical ratings Symbol Table 2: Absolute maximum ratings Parameter D 2 PAK TO-220 Value TO-220FP VGS Gate-source voltage ± 25 V ID Drain current (continuous) at TC = 25 C 16 16 (1) A ID Drain current (continuous) at TC = 100 C 10 10 (1) A IDM (2) Drain current (pulsed) 64 64 (1) A PTOT Total dissipation at TC = 25 C 150 30 W dv/dt (3) Peak diode recovery voltage slope 15 V/ns dv/dt (4) MOSFET dv/dt ruggedness 50 V/ns VISO Tstg Tj Notes: Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; TC = 25 C) Storage temperature Max. operating junction temperature (1) Limited by maximum junction temperature. (2) Pulse width limited by safe operating area. (3) ISD 16 A, di/dt 400 A/µs; VDS(peak) < V(BR)DSS, VDD = 80% V(BR)DSS. (4) VDS 520 V Unit 2500 V - 55 to 150 C Table 3: Thermal data Value Symbol Parameter D 2 PAK TO-220 TO-220FP Unit Rthj-case Thermal resistance junction-case max 0.83 4.2 C/W Rthj-pcb Thermal resistance junction-pcb max (1) 30 C/W Rthj-amb Thermal resistance junction-ambient max 62.5 C/W Notes: (1) When mounted on 1 inch² FR-4, 2 Oz copper board. Table 4: Avalanche characteristics Symbol Parameter Value Unit IAR Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax) 2.2 A EAS Single pulse avalanche energy (starting Tj=25 C, ID= IAR; VDD=50V) 650 mj DocID026475 Rev 2 3/20

Electrical characteristics STB24N65M2, STF24N65M2, STP24N65M2 2 Electrical characteristics (TC = 25 C unless otherwise specified) Table 5: On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS Drain-source breakdown voltage ID = 1 ma, VGS = 0 650 V IDSS IGSS Zero gate voltage drain current (VGS = 0) Gate-body leakage current (VDS = 0) VDS = 650 V 1 µa VDS = 650 V, TC=125 C 100 µa VGS = ± 25 V ±10 µa VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µa 2 3 4 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 8 A 0.185 0.23 Ω Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 1060 - pf Coss Output capacitance VDS = 100 V, f = 1 MHz, VGS = 0-47.5 - pf Crss Reverse transfer capacitance - 1.65 - pf C oss eq. (1) Equivalent output capacitance VDS = 0 to 520 V, VGS = 0-229 - pf RG Intrinsic gate resistance f = 1 MHz, ID = 0-7 - Ω Qg Total gate charge - 29 - nc VDD = 520 V, ID = 16 A, Qgs Gate-source charge - 3.8 - nc VGS = 10 V Qgd Gate-drain charge - 14 - nc Notes: (1) C oss eq. is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS Table 7: Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time - 10 - ns tr Rise time VDD = 325 V, ID = 8 A, - 9.5 - ns td(off) Turn-off delay time RG = 4.7 Ω, VGS = 10 V - 68 - ns tf Fall time - 25.5 - ns 4/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Electrical characteristics Table 8: Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 16 A ISDM (1) Source-drain current (pulsed) - 64 A VSD (2) Forward on voltage ISD = 16 A, VGS = 0-1.6 V trr Reverse recovery time - 350 ns ISD = 16 A, di/dt = 100 A/µs Qrr Reverse recovery charge - 4.5 µc VDD = 60 V IRRM Reverse recovery current - 26 A trr Reverse recovery time - 496 ns ISD = 16 A, di/dt = 100 A/µs Qrr Reverse recovery charge - 6.5 µc VDD = 60 V, Tj = 150 C IRRM Reverse recovery current - 25.5 A Notes: (1) Pulse width limited by safe operating area. (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID026475 Rev 2 5/20

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Safe operating area for D2PAK and TO-220 STB24N65M2, STF24N65M2, STP24N65M2 Figure 3: Thermal impedance for D2PAK and TO-220 Figure 4: Safe operating area for TO-220FP Figure 5: Thermal impedance for TO-220FP Figure 6: Output characteristics GIPD180920141533FSR ID (A) VGS= 7, 8, 9, 10 V 35 6V 30 5V 25 20 Figure 7: Transfer characteristics GIPD180920141600FSR ID (A) VDS= 20 V 35 30 25 20 15 10 5 4V 15 10 5 0 0 4 8 12 16 20 24 28 VDS(V) 0 0 2 4 6 8 VGS(V) 6/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Figure 8: Gate charge vs gate-source voltage VGS (V) 12 10 VDS VDD = 520 V ID = 16 A GIPD041020141607FSR VDS(V) 600 500 Electrical characteristics Figure 9: Static drain-source on-resistance GIPD180920141613FSR RDS(on) (Ω) VGS= 10V 0.196 0.193 8 400 0.190 6 300 4 2 0 200 100 0 0 5 10 15 20 25 30 Qg(nC) 0.187 0.184 0.181 0.178 0.175 0 4 8 12 16 ID(A) Figure 10: Capacitance variations GIPD041020141619FSR C (pf) Figure 11: Normalized gate threshold voltage vs temperature 1000 Ciss 100 Coss 10 1 f= 1 MHz Crss 0.1 0.1 1 10 100 VDS(V) Figure 12: Normalized on-resistance GIPD180920141459FSR RDS(on) (norm) Figure 13: Normalized V(BR)DSS vs temperature 2.2 VGS= 10V 1.8 1.4 1 0.6 0.2-75 -25 25 75 125 Tj( C) DocID026475 Rev 2 7/20

Electrical characteristics Figure 14: Source-drain diode forward characteristics GIPD041020141624FSR VSD (V) 1.1 Tj= -50 C STB24N65M2, STF24N65M2, STP24N65M2 Figure 15: Output capacitance stored energy GIPD041020141629FSR E (µj) 8 1 0.9 0.8 Tj= 25 C 6 4 0.7 Tj= 150 C 0.6 0.5 0 4 8 12 16 ISD(A) 2 0 0 100 200 300 400 500 600 VDS(V) 8/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Test circuits 3 Test circuits Figure 16: Switching times test circuit for resistive load Figure 17: Gate charge test circuit Figure 18: Test circuit for inductive load switching and diode recovery times Figure 19: Unclamped inductive load test circuit Figure 20: Unclamped inductive waveform Figure 21: Switching time waveform DocID026475 Rev 2 9/20

Package mechanical data STB24N65M2, STF24N65M2, STP24N65M2 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 D2PAK package information Figure 22: D²PAK (TO-263) drawing 10/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Package mechanical data Table 9: D²PAK (TO-263) mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 A1 0.03 0.23 b 0.70 0.93 b2 1.14 1.70 c 0.45 0.60 c2 1.23 1.36 D 8.95 9.35 D1 7.50 7.75 8.00 D2 1.10 1.30 1.50 E 10 10.40 E1 8.50 8.70 8.90 E2 6.85 7.05 7.25 e 2.54 e1 4.88 5.28 H 15 15.85 J1 2.49 2.69 L 2.29 2.79 L1 1.27 1.40 L2 1.30 1.75 R 0.4 V2 0 8 DocID026475 Rev 2 11/20

Package mechanical data Figure 23: D²PAK footprint STB24N65M2, STF24N65M2, STP24N65M2 All the dimensions are in millimeters. 12/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Package mechanical data 4.2 TO-220FP package information Figure 24: TO-220FP package outline DocID026475 Rev 2 13/20

Package mechanical data Dim. STB24N65M2, STF24N65M2, STP24N65M2 Table 10: TO-220FP mechanical data mm Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 14/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Package mechanical data 4.3 TO-220 type A package information Figure 25: TO-220 type A package outline DocID026475 Rev 2 15/20

Package mechanical data STB24N65M2, STF24N65M2, STP24N65M2 Table 11: TO-220 type A mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.70 c 0.48 0.70 D 15.25 15.75 D1 1.27 E 10 10.40 e 2.40 2.70 e1 4.95 5.15 F 1.23 1.32 H1 6.20 6.60 J1 2.40 2.72 L 13 14 L1 3.50 3.93 L20 16.40 L30 28.90 øp 3.75 3.85 Q 2.65 2.95 16/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Packaging mechanical data 5 Packaging mechanical data Figure 26: Tape DocID026475 Rev 2 17/20

Packaging mechanical data Figure 27: Reel STB24N65M2, STF24N65M2, STP24N65M2 T 40mm min. Access hole At slot location B D A C N Full radius Tape slot In core for Tape start 2.5mm min.width G measured At hub AM06038v1 Table 12: D²PAK (TO-263) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 10.5 10.7 A 330 B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 13.2 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 26.4 F 11.4 11.6 N 100 K0 4.8 5.0 T 30.4 P0 3.9 4.1 P1 11.9 12.1 Base qty 1000 P2 1.9 2.1 Bulk qty 1000 R 50 T 0.25 0.35 W 23.7 24.3 18/20 DocID026475 Rev 2

STB24N65M2, STF24N65M2, STP24N65M2 Revision history 6 Revision history Table 13: Document revision history Date Revision Changes 09-Jun-2014 1 First release. 11-Nov-2014 2 Document status promoted from preliminary to production data. DocID026475 Rev 2 19/20

STB24N65M2, STF24N65M2, STP24N65M2 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2014 STMicroelectronics All rights reserved 20/20 DocID026475 Rev 2