High Luminous Flux Density Warm White LED Emitter LZC-00WW00

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LUXEON c. Power Light Source

1-Watt SMD 6x6mm With Dome Lens

LuxiGen Platform ENTERTAINMENT LIGHTING ARCHITECTURAL LIGHTING HIGH-END INTERIOR SPACES UV CURING INFRARED ILLUMINATION HORTICULTURE & SPECIALTY

LUXEON MZ Best combination of brightness, uniformity and luminance enabling precision light control

Transcription:

High Luminous Flux Density Warm White LED Emitter LZC-00WW00 Key Features High Luminous Flux Density 12-die Warm White LED More than 40 Watt power dissipation capability Ultra-small foot print 9.0mm x 9.0mm Very low Thermal Resistance (0.7 C/W) Surface mount ceramic package with integrated glass lens Spatial color uniformity across radiation pattern Excellent Color Rendering Index JEDEC Level 1 for Moisture Sensitivity Level Lead (Pb) free and RoHS compliant Reflow solderable (up to 6 cycles) Emitter available with several MCPCB options Recommend use with LL-3T08 lens family to provide standard beam patterns suitable for general lighting applications Typical Applications General lighting Down lighting Architectural lighting Street lighting Stage and Studio lighting Refrigeration lighting Portable lighting Description The LZC-series 12-die White LED emitter has an electrical input power dissipation capability of more than 40 Watt electrical power in an extremely small package. With a small 9.0mm x 9.0mm ultra-small footprint, this package provides exceptional luminous flux density. LED Engin s patent-pending thermally insulated phosphor layer provides a spatial color uniformity across the radiation pattern and a consistent CCT over time and temperature. The high quality materials used in the package are chosen to minimize stresses and optimize light output which results in superior reliability and lumen maintenance. The robust product design thrives in outdoor applications with high ambient temperatures and high humidity.

Product Nomenclature The LZ Series part number designation is defined as follows: L Z A B C D E F G Where: A designates the number of LED die in the package ( C for 12-die) B designates the package level ( 0 for Emitter or other number for MCPC options) C designates the radiation pattern ( 0 for Lambertian) D and E designate the color ( WW for Warm White: 2600 K < CCT < 3800 K) Bin Code Minimum Luminous Flux (Φ V ) @ I F = 700mA [1,2] (lm) Luminous Flux Bins Table 1: Maximum Luminous Flux (Φ V ) @ I F = 700mA [1,2] (lm) Typical Luminous Flux (Φ V ) @ I F = 1000mA [2] (lm) X 1,085 1,357 1,540 Y 1,357 1,696 1,920 Z 1,696 2,120 2,400 Notes for Table 1: 1. Luminous flux performance guaranteed within published operating conditions. LedEngin maintains a tolerance of ± 10% on flux measurements. 2. Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current. Bin Code Forward Voltage Bins Table 2: Minimum Forward Voltage (V F ) @ I F = 700mA [1,2] (V) Maximum Forward Voltage (V F ) @ I F = 700mA [1,2] (V) 0 38.40 49.92 Notes for Table 2: 1. LedEngin maintains a tolerance of ± 0.04V for forward voltage measurements. 2. Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series. 2

y Warm White Chromaticity Groups 0.47 0.45 0.43 3800 K 3600 K 3400 K 3200 K 3000 K 2800 K 2600 K 0.41 W4 W3 W2 W1 0.39 W6 W5 0.37 Planckian locus 0.35 0.33 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 x Figure 1: Standard Chromaticity Groups plotted on excerpt from the CIE 1931 (2 ) x-y Chromaticity Diagram. Coordinates are listed below in Table 3. Warm White Chromaticity Coordinates Table 3: Bin Code x y Typical CCT (K) Bin Code x y Typical CCT (K) W1 0.4574 0.4778 0.4612 0.4424 0.3950 0.4290 0.4260 0.3910 2700 W4 0.4165 0.4315 0.4185 0.4052 0.3820 0.4170 0.4118 0.3770 3300 W2 0.4424 0.4612 0.4459 0.4288 0.3910 0.4260 0.4220 0.3865 2900 W5 0.4052 0.4185 0.4066 0.3949 0.3770 0.4118 0.4065 0.3720 3500 W3 0.4288 0.4459 0.4315 0.4165 0.3865 0.4220 0.4170 0.3820 3100 W6 0.3949 0.4066 0.3954 0.3857 0.3720 0.4065 0.4005 0.3675 3700 3

IPC/JEDEC Moisture Sensitivity Level Table 4 - IPC/JEDEC J-STD-20.1 MSL Classification: Soak Requirements Floor Life Standard Accelerated Level Time Conditions Time (hrs) Conditions Time (hrs) Conditions 1 unlimited 30 C/ 85% RH 168 +5/-0 85 C/ 85% RH Notes for Table 4: 1. The standard soak time includes a default value of 24 hours for semiconductor manufacturer s exposure time (MET) between bake and bag and includes the maximum time allowed out of the bag at the distributor s facility. n/a n/a Average Lumen Maintenance Projections Lumen maintenance generally describes the ability of a lamp to retain its output over time. The useful lifetime for solid state lighting devices (Power LEDs) is also defined as Lumen Maintenance, with the percentage of the original light output remaining at a defined time period. Based on long-term WHTOL testing, LedEngin projects that the LZ Series will deliver, on average, 70% Lumen Maintenance at 100,000 hours of operation at a forward current of 700 ma per die. This projection is based on constant current operation with junction temperature maintained at or below 125 C. Typical Radiation Pattern Figure 2: Typical representative spatial radiation pattern. 4

Absolute Maximum Ratings Table 5: Parameter Symbol Value Unit DC Forward Current at T jmax =130C I F 1200 ma DC Forward Current at T jmax =150C I F 1000 ma [2] Peak Pulsed Forward Current I FP 1500 ma Reverse Voltage V R See Note 3 V Storage Temperature T stg -40 ~ +150 C Junction Temperature T J 150 C Soldering Temperature [4] T sol 260 C Allowable Reflow Cycles 6 ESD Sensitivity [5] > 8,000 V HBM Class 3B JESD22-A114-D Notes for Table 5: 1. Maximum DC forward current (per die) is determined by the overall thermal resistance and ambient temperature. Follow the curves in Figure 10 for current derating. 2: Pulse forward current conditions: Pulse Width 10msec and Duty cycle 10%. 3. LEDs are not designed to be reverse biased. 4. Solder conditions per JEDEC 020D. See Reflow Soldering Profile Figure 5. 5. LedEngin recommends taking reasonable precautions towards possible ESD damages and handling the LZC-00WW00 in an electrostatic protected area (EPA). An EPA may be adequately protected by ESD controls as outlined in ANSI/ESD S6.1. Optical Characteristics @ T C = 25 C Table 6: Parameter Symbol Typical Unit Luminous Flux (@ I F = 700mA) Φ V 1400 lm Luminous Flux (@ I F = 1000mA) Φ V 1800 lm Luminous Efficacy (@ I F = 350mA) 65 lm/w Correlated Color Temperature [2] CCT 3100 K Chromaticity Coordinates x,y 0.430, 0.402 Color Rendering Index (CRI / R9) R a / R 9 85 / 30 Viewing Angle [3] 2Θ 1/2 110 Degrees Notes for Table 6: 1. Luminous flux typical value is for all 12 LED dice operating concurrently at rated current. 2. Viewing Angle is the off-axis angle from emitter centerline where the luminous intensity is ½ of the peak value. Electrical Characteristics @ T C = 25 C Table 7: Parameter Symbol Typical Unit Forward Voltage (@ I F = 700mA) V F 42.0 V Forward Voltage (@ I F = 1000mA) V F 43.8 V Temperature Coefficient of Forward Voltage ΔV F /ΔT J -33.6 mv/ C Thermal Resistance (Junction to Case) RΘ J-C 0.7 C/W Notes for Table 7: 1. Forward Voltage is binned with 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series. 5

Mechanical Dimensions (mm) Pin Out Pad Series Function 2 1 Cathode 3 1 Cathode 5 2 Cathode 6 2 Cathode 14 2 Anode 15 2 Anode 17 1 Anode 18 1 Anode 17 18 14 15 2 3 5 6 Notes for Figure 1: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Thermal contact, Pad is electrically neutral. Figure 1: Package outline drawing. Recommended Solder Pad Layout (mm) Figure 2: Recommended solder mask opening (hatched area) for anode, cathode, and thermal pad. Note for Figure 2: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Recommended stencil thickness is 125µm. 6

Relative Spectral Power Reflow Soldering Profile Figure 5: Reflow soldering profile for lead free soldering. Typical Relative Spectral Power Distribution 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480 530 580 630 680 730 780 830 880 Wavelength (nm) Figure 6: Typical relative spectral power vs. wavelength @ T C = 25 C. 7

Relative Light Output (%) Relative Light Output (%) Typical Relative Light Output 140 120 100 80 60 40 20 0 0 200 400 600 800 1000 I F - Forward Current (ma) Figure 7: Typical relative light output vs. forward current @ T C = 25 C. Notes for Figure 7: 1. Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current. 120 Typical Relative Light Output over Temperature 110 100 90 80 70 60 0 20 40 60 80 100 Case Temperature ( C) Figure 8: Typical relative light output vs. case temperature. Notes for Figure 8: 1. Luminous Flux typical value is for all 12 LED dice operating concurrently at rated current. 8

I F - Maximum Current (ma) I F - Forward Current (ma) 1200 Typical Forward Current Characteristics 1000 800 600 400 200 0 36 37 38 39 40 41 42 43 44 45 V F - Forward Voltage (V) Figure 9: Typical forward current vs. forward voltage @ T C = at 25 C. Note for Figure 9: 1. Forward Voltage assumes 12 LED dice connected in series. The actual LED is configured with two strings of 6 dice in series. 1200 Current De-rating 1000 800 700 (Rated) 600 400 200 0 RΘ J-A = 2.0 C/W RΘ J-A = 3.0 C/W RΘ J-A = 4.0 C/W 0 25 50 75 100 125 150 Maximum Ambient Temperature ( C) Figure 10: Maximum forward current vs. ambient temperature based on T J(MAX) = 150 C. Notes for Figure 10: 1. Maximum current assumes that all LED dice are operating concurrently at the same current. 2. RΘ J-C [Junction to Case Thermal Resistance] for the LZC-00xx00 is typically 0.7 C/W. 3. RΘ J-A [Junction to Ambient Thermal Resistance] = RΘ J-C + RΘ C-A [Case to Ambient Thermal Resistance]. 9

MCPCB Option Serial 1x12 configuration LZC-7xxxxx Typical Thermal Resistance for MCPCB adds only 0.6 C/W Serial configuration allows for easy driver control with low current MCPCB contains Zener Diodes for enhanced ESD protection The LZC-7xxxxx Serial MCPCB option provides a convenient method to mount LedEngin s single color LZC emitters. The six recessed features allow the use of M3 or #4 screws to attach the MCPCB to a heat sink. The MCPCB also contains Zener diodes for enhanced ESD protection. RΘ J-B Lookup Table Table 8: Product Typical Emitter RΘ J-C + Typical MCPCB RΘ C-B = Typical Emitter + MCPCB RΘ J-B LZC-7 0.7 C/W + 0.6 C/W = 1.3 C/W Ts Pin Out Pad Function + Anode Ch1 - Cathode Ch1 Serial 1x12MCPCB outline dimensions (mm) Notes for MCPCBs: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4 mounting screws. 3. LedEngin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces. 4. LedEngin recommends using thermally conductive tape or adhesives when attaching MCPCB to a heat sink. 5. Check the compatibility of the MCPCB with the emitter datasheet. 10

MCPCB Option Parallel 2x6 configuration LZC-Cxxxxx Typical Thermal Resistance for MCPCB adds only 0.6 C/W Parallel configuration allows for easy driver control with low Vf MCPCB contains Zener Diodes for enhanced ESD protection The LZC-Cxxxxx Parallel MCPCB option provides a convenient method to mount LedEngin s single color LZC emitters. The six recessed features allow the use of M3 or #4 screws to attach the MCPCB to a heat sink. The MCPCB also contains Zener diodes for enhanced ESD protection. RΘ J-B Lookup Table Table 8: Product Typical Emitter RΘ J-C + Typical MCPCB RΘ C-B = Typical Emitter + MCPCB RΘ J-B LZC-C 0.7 C/W + 0.6 C/W = 1.3 C/W Ts Pad Pin Out Function 1+ Anode Ch1 1- Cathode Ch1 2+ Anode Ch2 2- Cathode Ch2 Parallel (2x6) MCPCB outline dimensions (mm) Notes for MCPCBs: 1. Unless otherwise noted, the tolerance = ± 0.20 mm. 2. Slots in MCPCB are for M3 or #4 mounting screws. 3. LedEngin recommends using plastic washers to electrically insulate screws from solder pads and electrical traces. 4. LedEngin recommends using thermally conductive tape or adhesives when attaching MCPCB to a heat sink. 5. Check the compatibility of the MCPCB with the emitter datasheet. 11

Company Information LED Engin, based in California s Silicon Valley, specializes in ultra-bright, ultra compact solid state lighting solutions allowing lighting designers & engineers the freedom to create uncompromised yet energy efficient lighting experiences. Our LuxiGen Platform an emitter and lens combination or integrated module solution, delivers superior flexibility in light output, ranging from 3w to 90w, a wide spectrum of available colors, including whites, multi-color and UV, and the ability to deliver upwards of 5,000 high quality lumens to a target. The small size, yet remarkably powerful output, allows for a previously unobtainable freedom of design wherever high-flux density, directional light is required. Our LuxiLamp _ Series of PAR and MR16 replacement lamps and SPOT lighting modules leverage our LuxiGen emitters and lenses to deliver quality, control and high density white light solutions for a broad range of recessed and downlighting applications. www.ledengin.com Please contact Sales@ledengin.com or (408) 492-0620 for more information. * LedEngin reserves the right to make changes to improve performance without notice. 12