STGFW40V60DF, STGW40V60DF, STGWT40V60DF

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Trench gate field-stop IGBT, V series 600 V, 40 A very high speed Datasheet - production data Features Maximum junction temperature: TJ = 175 C Tail-less switching off VCE(sat) = 1.8 V (typ.) @ IC = 40 A Tight parameters distribution Safe paralleling Low thermal resistance Very fast soft recovery antiparallel diode Figure 1: Internal schematic diagram Applications Photovoltaic inverters Uninterruptible power supply Welding Power factor correction Very high frequency converters Table 1: Device summary Description This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the V series IGBTs, which represent an optimum compromise between conduction and switching losses to maximize the efficiency of very high frequency converters. Furthermore, the positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. Order code Marking Package Packing STGFW40V60DF GFW40V60DF TO-3PF Tube STGW40V60DF GW40V60DF TO-247 Tube GWT40V60DF TO-3P Tube October 2017 DocID024402 Rev 9 1/21 This is information on a product in full production. www.st.com

Contents Contents STGFW40V60DF, STGW40V60DF, 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics curves... 6 3 Test circuits... 13 4 Package information... 14 4.1 TO-3PF package information... 14 4.2 TO-247 package information... 16 4.3 TO-3P package information... 18 5 Revision history... 20 2/21 DocID024402 Rev 9

Electrical ratings 1 Electrical ratings Symbol Table 2: Absolute maximum ratings Parameter TO-247 TO-3P Value TO-3PF VCES Collector-emitter voltage (VGE = 0 V) 600 V IC Continuous collector current at TC = 25 C 80 A Continuous collector current at TC = 100 C 40 A ICP (1) Pulsed collector current 160 A VGE Gate-emitter voltage ±20 V IF Continuous forward current at TC = 25 C 80 A Continuous forward current at TC = 100 C 40 A IFP (1) Pulsed forward current 160 A PTOT Total dissipation at TC = 25 C 283 62.5 W VISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s, TC = 25 C) Unit 3.5 kv TSTG Storage temperature range -55 to 150 C TJ Operating junction temperature range -55 to 175 C Notes: (1) Pulse width is limited by maximum junction temperature. Table 3: Thermal data Value Symbol Parameter TO-247 Unit TO-3PF TO-3P RthJC Thermal resistance junction-case IGBT 0.53 2.4 C/W RthJC Thermal resistance junction-case diode 1.14 2.6 C/W RthJA Thermal resistance junction-ambient 50 C/W DocID024402 Rev 9 3/21

Electrical characteristics STGFW40V60DF, STGW40V60DF, 2 Electrical characteristics TJ = 25 C unless otherwise specified Table 4: Static characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)CES VCE(sat) VF Collector-emitter breakdown voltage Collector-emitter saturation voltage Forward on-voltage VGE = 0 V, IC = 2 ma 600 V VGE = 15 V, IC = 40 A 1.8 2.3 VGE = 15 V, IC = 40 A, TJ = 125 C VGE = 15 V, IC = 40 A, TJ = 175 C 2.15 2.35 IF = 40 A 1.7 2.45 IF = 40 A, TJ = 125 C 1.4 IF = 40 A, TJ = 175 C 1.3 VGE(th) Gate threshold voltage VCE = VGE, IC = 1 ma 5 6 7 V ICES Collector cut-off current VGE = 0 V, VCE = 0 V 25 µa IGES Gate-emitter leakage current VCE = 0 V, VGE = ±20 V ±250 na V V Table 5: Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Cies Input capacitance - 5400 - pf Coes Output capacitance VCE = 25 V, f = 1 MHz, VGE = 0 V - 220 - pf Cres Reverse transfer capacitance - 180 - pf Qg Total gate charge VCC = 480 V, IC = 40 A, - 226 - nc Qge Gate-emitter charge VGE = 0 to 15 V (see Figure 35: " Gate - 38 - nc Qgc Gate-collector charge charge test circuit") - 95 - nc 4/21 DocID024402 Rev 9

Table 6: IGBT switching characteristics (inductive load) Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time - 52 - ns tr Current rise time - 17 - ns (di/dt)on Turn-on current slope VCE = 400 V, IC = 40 A, - 1850 - A/µs RG = 10 Ω, VGE = 15 V td(off) Turn-off delay time - 208 - ns (see Figure 34: " Test tf Current fall time circuit for inductive load - 20 - ns Eon (1) Turn-on switching energy switching" ) - 456 - µj Eoff (2) Turn-off switching energy - 411 - µj Ets Total switching energy - 867 - µj td(on) Turn-on delay time - 52 - ns tr Current rise time - 21 - ns VCE = 400 V, IC = 40 A, (di/dt)on Turn-on current slope - 1538 - A/µs RG = 10 Ω, VGE = 15 V, td(off) Turn-off-delay time TJ = 175 C - 220 - ns tf Current fall time (see Figure 34: " Test - 21 - ns circuit for inductive load Eon (1) Turn-on switching energy switching" ) - 1330 - µj Eoff (2) Turn-off switching energy - 560 - µj Ets Total switching energy - 1890 - µj Notes: (1) Including the reverse recovery of the diode. (2) Including the tail of the collector current. Table 7: Diode switching characteristics (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit trr Reverse recovery time - 41 - ns IF = 40 A, VR = 400 V, Qrr Reverse recovery charge VGE = 15 V, - 440 - nc Irrm Reverse recovery current di/dt = 1000 A/µs - 21.6 - A Peak rate of fall of reverse (see Figure 34: " Test dirr/dt circuit for inductive load - 1363 - A/µs recovery current during tb switching") Err Reverse recovery energy - 151 - µj trr Reverse recovery time IF = 40 A, VR = 400 V, - 109 - ns Qrr Reverse recovery charge VGE = 15 V, - 2400 - nc di/dt = 1000 A/µs, Irrm Reverse recovery current TJ = 175 C - 44.4 - A Peak rate of fall of reverse dirr/dt (see Figure 34: " Test - 670 - A/µs recovery current during tb circuit for inductive load switching") Err Reverse recovery energy - 718 - µj DocID024402 Rev 9 5/21

Electrical characteristics 2.1 Electrical characteristics curves Figure 2: Power dissipation vs case temperature for TO-247 and TO-3P STGFW40V60DF, STGW40V60DF, Figure 3: Collector current vs case temperature for TO-247 and TO-3P Figure 4: Power dissipation vs case temperature for TO-3PF Figure 5: Collector current vs case temperature for TO-3PF Figure 6: Output characteristics (TJ = 25 C) Figure 7: Output characteristics (TJ = 175 C) 6/21 DocID024402 Rev 9

Figure 8: VCE(sat) vs junction temperature Electrical characteristics Figure 9: VCE(sat) vs collector current Figure 10: Collector current vs switching frequency for TO-247 and TO-3P Figure 11: Collector current vs switching frequency for TO-3PF Figure 12: Forward bias safe operating area for TO-247 and TO-3P Figure 13: Forward bias safe operating area for TO-3PF DocID024402 Rev 9 7/21

Electrical characteristics Figure 14: Transfer characteristics STGFW40V60DF, STGW40V60DF, Figure 15: Diode VF vs forward current Figure 16: Normalized VGE(th) vs junction temperature Figure 17: Normalized V(BR)CES vs junction temperature Figure 18: Capacitance variations Figure 19: Gate charge vs gate-emitter voltage 8/21 DocID024402 Rev 9

Figure 20: Switching energy vs collector current Electrical characteristics Figure 21: Switching energy vs gate resistance Figure 22: Switching energy vs junction temperature Figure 23: Switching energy vs collector emitter voltage Figure 24: Switching times vs collector current Figure 25: Switching times vs gate resistance DocID024402 Rev 9 9/21

Electrical characteristics Figure 26: Reverse recovery current vs diode current slope STGFW40V60DF, STGW40V60DF, Figure 27: Reverse recovery time vs diode current slope Figure 28: Reverse recovery charge vs diode current slope Figure 29: Reverse recovery energy vs diode current slope 10/21 DocID024402 Rev 9

Figure 30: Thermal impedance for IGBT in TO-247 and TO-3P Electrical characteristics Figure 31: Thermal impedance for IGBT in TO-3PF DocID024402 Rev 9 11/21

Electrical characteristics Figure 32: Thermal impedance for diode in TO-247 and TO-3P STGFW40V60DF, STGW40V60DF, Figure 33: Thermal impedance for diode in TO-3PF 12/21 DocID024402 Rev 9

Test circuits 3 Test circuits Figure 34: Test circuit for inductive load switching Figure 35: Gate charge test circuit C A A G L=100 µh E B B G C 3.3 µf D.U.T 1000 µf V CC + R G E - AM01504v 1 Figure 36: Switching waveform Figure 37: Diode reverse recovery waveform DocID024402 Rev 9 13/21

Package information STGFW40V60DF, STGW40V60DF, 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 TO-3PF package information Figure 38: TO-3PF package outline 14/21 DocID024402 Rev 9

Dim. Table 8: TO-3PF mechanical data mm Package information Min. Typ. Max. A 5.30 5.70 C 2.80 3.20 D 3.10 3.50 D1 1.80 2.20 E 0.80 1.10 F 0.65 0.95 F2 1.80 2.20 G 10.30 11.50 G1 5.45 H 15.30 15.70 L 9.80 10 10.20 L2 22.80 23.20 L3 26.30 26.70 L4 43.20 44.40 L5 4.30 4.70 L6 24.30 24.70 L7 14.60 15 N 1.80 2.20 R 3.80 4.20 Dia 3.40 3.80 DocID024402 Rev 9 15/21

Package information 4.2 TO-247 package information Figure 39: TO-247 package outline STGFW40V60DF, STGW40V60DF, 16/21 DocID024402 Rev 9

Dim. Table 9: TO-247 package mechanical data mm Package information Min. Typ. Max. A 4.85 5.15 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e 5.30 5.45 5.60 L 14.20 14.80 L1 3.70 4.30 L2 18.50 ØP 3.55 3.65 ØR 4.50 5.50 S 5.30 5.50 5.70 DocID024402 Rev 9 17/21

Package information 4.3 TO-3P package information Figure 40: TO-3P package outline STGFW40V60DF, STGW40V60DF, 18/21 DocID024402 Rev 9

Dim. Table 10: TO-3P package mechanical data mm Package information Min. Typ. Max. A 4.60 4.80 5.00 A1 1.45 1.50 1.65 A2 1.20 1.40 1.60 b 0.80 1.00 1.20 b1 1.80 2.00 2.20 b2 2.80 3.00 3.20 c 0.55 0.60 0.75 D 19.70 19.90 20.10 D1 13.70 13.90 14.10 E 15.40 15.60 15.80 E1 13.40 13.60 13.80 E2 9.40 9.60 9.90 e 5.15 5.45 5.75 L 19.80 20.00 20.20 L1 3.30 3.50 3.70 L2 18.20 18.40 18.60 ØP 3.30 3.40 3.50 ØP1 3.10 3.20 3.30 Q 4.80 5.00 5.20 Q1 3.60 3.80 4 DocID024402 Rev 9 19/21

Revision history STGFW40V60DF, STGW40V60DF, 5 Revision history Table 11: Document revision history Date Revision Changes 20-Mar-2013 1 Initial release 17-Apr-2013 2 04-Jun-2013 3 Document status promoted from preliminary data to production data. Added: Section 2.1: Electrical characteristics (curves) Added minimum and maximum values for VGE(th) in Table 4: Static characteristics. 11-Sep-2013 4 Updated VF value in Table 4: Static characteristics. 08-Oct-2013 5 Updated title, features and description in cover page. 10-Jan-2014 6 03-Mar-2014 7 23-Apr-2014 8 27-Oct-2017 9 Updated Figure 8: VCE(sat) vs. junction temperature, Figure 15: Diode VF vs. forward current and Figure 16: Normalized VGE(th) vs junction temperature. Updated test conditions in Table 7: Diode switching characteristics (inductive load). Added new device in TO-3PF. Updated Table 1: Device summary, Table 2: Absolute maximum ratings, Table 3: Thermal data and Section 4: Package mechanical data. Added Figure 4: Power dissipation vs. case temperature for TO-3PF, Figure 5: Collector current vs. case temperature for TO-3PF, Figure 11: Collector current vs. switching frequency for TO-3PF and Figure 12: Forward bias safe operating area for TO-247 and TO-3P. Minor text changes. Updated Table 3: "Thermal data". Added Figure 33: "Thermal impedance for diode in TO-3PF". Updated Section 4: "Package information". Minor text changes 20/21 DocID024402 Rev 9

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2017 STMicroelectronics All rights reserved DocID024402 Rev 9 21/21