Flexible glass substrates for roll-to-roll manufacturing

Similar documents
Flexible Glass Applications & Process Scaling

Single Layer Color Cholesteric Liquid Crystal Display

ORGANIC ELECTRONICS: PHOTOLITHOGRAPHY OR PRINTING. Giles Lloyd Flex Europe Conference, 25th October 2016

Ubiquitous Displays and Sensors Activating Surfaces with Flexible Electronics. Dean Baker, Director FlexEnable. APAC Innovation Summit 2016, Hong Kong

Optically Rewritable Liquid Crystal Display with LED Light Printer

Printed Organic Transistors for Ultraflexible and Stretchable Electronics

National Centre for Flexible Electronics

Application Bulletin 240

OVERVIEW OF PLASTIC SUBSTRATES FOR PRINTED ELECTRONICS

Glass: Enabling Next-Generation, Higher Performance Solutions. Peter L. Bocko, Ph.D CTO Glass Technologies 5 September 2012

Low Temperature Integration of Thin Films and Devices for Flexible and Stretchable Electronics

Analysis of Wet Coating Thickness Effect on Transparent Conductive Electrode Performance using Silver Nanowire

Processes for Flexible Electronic Systems

SEMICON Europa 2016 FLEX Europe Conference Grenoble, France October 25-26, 2016

Context Development Details Anticipated Effects

New Optics for Astronomical Polarimetry

AGC Glass Technology Solution to Highly Functional Display Needs

Technology development for a flexible, low-cost backplane for lighting applications

SUPPLEMENTARY INFORMATION

Specifications subject to change Packaging

Hermetic Packaging Solutions using Borosilicate Glass Thin Films. Lithoglas Hermetic Packaging Solutions using Borosilicate Glass Thin Films

Inkjet Filling of TSVs with Silver Nanoparticle Ink. Behnam Khorramdel, Matti Mäntysalo Tampere University of Technology ESTC 2014 Finland, Helsinki

Low Cost Very Large Diamond Turned Metal Mirror Contract No. NNX09CF40P (SBIR ) (MSFC)

Bend Sensor Technology Mechanical Application Design Guide

Additional information Indium-free, highly transparent, flexible Cu2O/Cu/Cu2O mesh electrodes for flexible touch screen panels

Low-power carbon nanotube-based integrated circuits that can be transferred to biological surfaces

Thin Film Resistor Integration into Flex-Boards

64 Channel Flip-Chip Mounted Selectively Oxidized GaAs VCSEL Array

Semiconductor Back-Grinding

Printing versus coating technology Which way Printed Electronics with solution coating will go?

Plan Optik AG. Plan Optik AG PRODUCT CATALOGUE

A BASIC EXPERIMENTAL STUDY OF CAST FILM EXTRUSION PROCESS FOR FABRICATION OF PLASTIC MICROLENS ARRAY DEVICE

Multilayer Foil Metallization for All Back Contact Cells

Challenges and Requirements for Flexible Displays and Microelectronics

Advancing Consumer Packaging Through Printable Electronics

Asia Microreactors Datasheet

High Performance Thin Film Optical Coatings Technical Reference Document 09/13. Coatings Capabilities. Heat Control - Hot Mirror Filters

Supplementary Materials for

SUPPLEMENTARY INFORMATION

General-purpose Foil Strain Gages KFG

Zig-zag electrode pattern for high brightness in a super in-plane-switching liquid-crystal cell

Part 5-1: Lithography

Making a Material Difference

Chapter 11 Testing, Assembly, and Packaging

A novel QA approach to combined In- Line Defect/Pinhole detection and coating Opacity measurement.

3D SOI elements for System-on-Chip applications

CMP for More Than Moore

Optical Bus for Intra and Inter-chip Optical Interconnects

Semiconductor Physics and Devices

Soft Electronics Enabled Ergonomic Human-Computer Interaction for Swallowing Training

LCOS Devices for AR Applications

KeyTec Suzhou (China) presentation

Diverse Lasers Support Key Microelectronic Packaging Tasks

New Pixel Circuits for Driving Organic Light Emitting Diodes Using Low-Temperature Polycrystalline Silicon Thin Film Transistors

LITE /LAB /SCAN /INLINE:

COIL WINDING ISSUES P. Fabbricatore INFN Genova LCD - Magnet 13Oct09. Coil winding issues

Modeling, Design, and Demonstration of 2.5D Glass Interposers for 16-Channel 28 Gbps Signaling Applications

Block Diagram GND. amplifier 5 GND G R B

ESCC2006 European Supply Chain Convention

Figure 7 Dynamic range expansion of Shack- Hartmann sensor using a spatial-light modulator

Manufacturing Process of the Hubble Space Telescope s Primary Mirror

General-purpose Foil Strain Gages (KFGS)

Three Laminar Profile Spherical Gratings for the Madison SGM Beamline. Technical Specification

Lithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004

Photo-patternable and Transparent Films Using Cellulose Nanofibers for Stretchable, Origami Electronics

Feature-level Compensation & Control

Low Cost Very Large Diamond Turned Metal Mirror! Mirror Technology SBIR/STTR Workshop June 20 th to 23 rd, 2011 Greenbelt Marriott, Greenbelt, Md.

3D flow focusing chips

Operational Experience with the ATLAS Pixel Detector

Supporting Information. Filter-free image sensor pixels comprising silicon. nanowires with selective color absorption

General-purpose Foil Strain Gages KFGS Series

A thin foil optical strain gage based on silicon-on-insulator microresonators

First Demonstration of Single-mode Polymer Optical Waveguides with Circular Cores for Fiber-to-waveguide Coupling in 3D Glass Photonic Interposers

3D Printing for Electronics Manufacturing

Bringing Answers to the Surface

Dark Field Technologies In-Situ Defect Detection Practical Considerations and Results

IR SHORT WAVE QUARTZ EMITTERS IR HALOGEN QUARTZ EMITTERS IR MEDIUM WAVE QUARTZ EMITTERS IR FAST MEDIUM WAVE QUARTZ EMITTERS

PILOT LINE FOR LARGE-AREA PRINTING OF ELECTRONIC AND PHOTONIC DEVICES. Simon Perraud, Ph.D. Vice president for European affairs

Lecture 22 Optical MEMS (4)

Droplet Junction Chips

1. INTRODUCTION ABSTRACT

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

PRINTED ELECTRONICS 3

Chip Assembly on MID (Molded Interconnect Device) A Path to Chip Modules with increased Functionality

UV TECHNOLOGY. Relatively new, but rapidly emerging technology. AZON Q UV PRODUCT CATALOG

New fabrication and packaging technologies for CMOS pixel sensors: closing gap between hybrid and monolithic

Printing Processes and their Potential for RFID Printing

KODAK Matchprint M150DP KODAK Matchprint M120DP

Pressure Sensors for Printed Blast Dosimeters

Organic Photoconductors for Printers

All-Glass Gray Scale PhotoMasks Enable New Technologies. Che-Kuang (Chuck) Wu Canyon Materials, Inc.

Two major features of this text

Bend Sensor Technology Mechanical Application Design Guide Mechanical Application Design Guide

QUALITY SEMICONDUCTOR, INC.

Organic Electronics. Information: Information: 0331a/ 0442/

Surface Topography and Alignment Effects in UV-Modified Polyimide Films with Micron Size Patterns

THE FINISHING TOUCH MID WEB FINISHING SOLUTION FOR DIGITALLY PRINTED FLEXIBLE PACKAGING AND LABELS.

DIRECT FABRICATION OF a-si:h THIN FILM TRANSISTOR ARRAYS ON PLASTIC AND METAL FOILS FOR FLEXIBLE DISPLAYS

Ultra-thin, highly flexible RF cables and interconnections

Drop-on-Demand Inkjet Printing of Liquid Crystals for Photonics Applications

Transcription:

Science & Technology Flexible glass substrates for roll-to-roll manufacturing Corning - S. Garner, G. Merz, J. Tosch, C. Chang, D. Marshall, X. Li, J. Matusick, J. Lin, C. Kuo, S. Lewis, C. Kang ITRI - P. Shih, J. Shih, M. Lu October 25, 2011

Outline Flexible glass for electronic devices Device performance on flexible glass Mechanical reliability of flexible glass Stress Strength R2R processing on flexible glass Summary 2

Flexible Glass Enables High-Quality Electronics Substrate choice critical for device fabrication & performance Substrate integrates designs, materials, & processes Essential for overall optimization Glass enables improved resolution, registration, performance & lifetime Ultra-slim flexible glass ( 200µm thick) compatible with: Sheet-fed & web conveyance continuous processes High strength cutting Reliable device assembly & packaging Flexible glass barrier Flexible glass substrate 3

Glass Enables Device Performance Optimization Flexible glass offers high-quality surface & optical properties 4 Surface Roughness 200 Device applications Display (e-paper, color filter, OLED, LCD) Touch sensor PV Lighting Ra (nm) 3 2 1 0 150 Ra Rpv 100 50 0 A B A B A B Glass PEN Polyimide Rpv (nm) Flexible glass benefits device performance Hermeticity Optical transmission Surface roughness Transmission (%) 100 80 60 40 20 0 Glass Optical Transmission PEN Polyimide 200 400 600 800 Wavelength (nm) 4

Glass Enables Fabrication Process Optimization Flexible glass offers thermal & dimensional stability for R2R Continuous processes Patterning & printing Etching Coating, lamination & deposition Flexible glass benefits device fabrication Thermal capability Dimensional stability Flexible glass enables R2R registration Glass strain <10 µm / 100 mm PEN strain 10 s µm / 100 mm Stress (MPa) Stress (MPa) 50 40 30 20 10 0 Thermal & Dimensional Stability Glass 25 C & 150 C PEN 25 C 150 C 0 0.5 1 1.5 2 Strain (%) Polyimide 25 C 150 C Web Strain Gage Measurement 30 25 Flexible glass 20 15 10 5 PEN 0 0.00 0.05 0.10 Strain (%) 5

Glass Surface & Bulk Properties Enable Performance Flexible glass device capability demonstrated in <170µm LCD Twisted nematic LCD qvga (320 x RGB x 240) 4 diagonal (80mm x 60mm) Pixel size 83µm x 250µm Aperture 52% a-si:h active matrix backplane TFT channel L=10µm, W=50µm Polymeric substrates not compatible 300 C backplane fabrication 210 C frontplane fabrication 75µm thick, 10cm x 12cm flexible glass LC cell <170µm S. Hoehla, et al., Full Color AM-LCDs on Flexible Glass Substrates, IDW 2010, p.1689-1692. 6

Glass Flexibility Enables Conformal Devices Flexible glass device capability demonstrated in <270µm EPD Electrophoretic display 170dpi (640 x 480 pixels) 4.7 diagonal Pixel size 150µm x 150µm Aperture 40% Active Matrix Display Segmented Display Org. TFT active matrix backplane TFT channel L=10µm, W=100µm Driver IC bonding at 180 C 100µm thick, 16cm x 16cm flexible glass Total display thickness <270µm P-Y. Lo, et al., Flexible Glass Substrates for Organic TFT Active Matrix Electrophoretic Displays, SID Display Week, May 18, 2011. 7

Flexible Glass Compatible with Large Area Electronics Flexible glass device capability demonstrated in <210µm ChLCD 5 inch color, 80ppi 10.4 inch monochrome, 120ppi ITO post annealed at 220 C Sheet resistance: <25 Ω/ 100µm thick, 25cm x 37cm flexible glass Substrate bonded to processing carrier Total display thickness <210µm K-W. Wu, et al., Color ChLC E-paper Display with 100mm Flexible Glass Substrates, SID Display Week, May 18, 2011. 8

Mechanical Reliability of Flexible Glass Substrate solutions optimized for continuous processing Mechanical reliability of glass understood Failure due to distributions of defects & applied stresses Bend strength independent of thickness Mechanical reliability requires controlling defects & applied stress Providing high-strength glass forming, including surfaces & edges Protecting substrate from damage Managing stresses during conveyance, handling & application Bend Stress (MPa) 500 400 300 200 100 0 50µm 100µm 500µm 0 5 10 15 20 25 30 Bend Radius (cm) Failure Probability (%) 90 50 20 10 5 2 1 0.01 10 200µm 100µm 0.101 Bend Radius (cm) ~10mm 1.00 0.1 9

Roller Systems Efficiently Convey Flexible Glass Glass web stress managed during device fabrication Flexible glass stiffness similar to other web materials Stiffness ~ E * (thickness) 3 Control stresses through roller handling systems Approach is compatible with sheet-fed or roll-to-roll systems 25 Stiffness (a.u.) 20 15 10 5 0 Glass Aluminum Paper Polymer 50 70 90 110 130 150 Thickness (um) 10

Glass After Forming is Inherently Strong Managing defect size & distribution enables reliability Crack systems form when flaw size & stress reach threshold Bend strengths >6GPa measured after forming Subsequent handling & environment can reduce strength ~100x Glass strength depends on glass history Quality of surfaces & edges critical 9 9 Edge quality affects bend strength F a i l u r e P r o b a b i l i t y ( % ) 90 50 20 10 5 2 Surface quality affects bend strength Surface damage Crack systems 1 1 0 2 0 50 100 200 B e n d S t r e s s ( M P a ) 5 0 0 1 0 0 0 11

Coatings Prevent Defects during Device Manufacturing Edge tabs enable device fabrication directly on glass surface Minimizing contact damage enhances reliability Packaging, shipping Device manufacturing In-service use Flexible Glass Web Cross-Section Hermetically encapsulated device Flexible glass Edge tab Optimize solution for specific scenario Edge tabs protect glass during conveyance, winding & device fabrication Flexible glass substrates Flexible glass web Devices fabricated directly on high-quality, hermetic glass surface Laser cut devices from glass web 12

Flexible Glass Reliability Enables Device Fabrication Reliability based on managing stress & defect distributions Flexible Glass Mechanical Reliability Flexible Glass Roller Conveyance Web conveyance @ CAMM 13

Flexible Glass is Compatible with R2R Processing Demonstrated continuous ITO patterning ITO Deposition Slot Die Coating Exposure Development & Etch Supply Roll Take-Up Roll Cooling Drum Supply Roll Take-Up Roll 10µm ITO lines 30 Ω/ resistivity S. Garner, et al., Flexible glass substrates for continuous manufacturing, Flexible Electronics and Displays Conference, February 9, 2011. 50µm 14

Web Conveyance Testing Flexible glass wound 10 inch width onto 6 inch core ID >180 wrap Flexible glass web with edge tab 15

Screen Printing Demonstration Compatibility of flexible glass web with edge tab shown Step & repeat screen printing process Engage vacuum stage Screen print Ag ink Release vacuum Advance web Thermal cure @ 130 C (switch to UV cure) Compatibility with vacuum stage processing shown Initial results: 150µm width, 14µm height 16

Summary Flexible glass offers advantages for device designs, materials & processes Includes optical, dimensional & thermal stability, and hermeticity Enables high-performance active devices Mechanical reliability of glass understood Form with high initial strength & minimize defect creation Manage stresses with appropriate handling & conveyance Optimized solutions are application specific Flexible glass is compatible with sheet & continuous processing Demonstrated asi TFT LCD, organic TFT EPD, direct addressed ChLCD Demonstrated initial R2R process compatibility The authors would like to acknowledge the financial support of the Ministry of Economic Affairs (MOEA) of the Republic of China via the contract No. A351A11100. 17