Generl Introdution Tehnil Note 7 The Multilyer Cermi Chip Cpitors supplied in bulk, ssette or tped & reel pkge re idelly suitble for thik-film Hybrid iruits nd utomti surfe mounting on printed iruit bords. MLCC s re minly used in eletroni iruits for by-pss, filtering nd smoothing iruit. Constrution nd Physil Dimension BW L B Cross Setion T W Solder Metl Brrier Externl Eletrodes Inner Eletrodes C1 C2 C3 C4 A t Dimensions(mm) [inhes] EIA style L W Tmx. BWmin Bmin. 0201 0.60±0.03 0.30±0.03 0.33 0.10 0.20 [.024±.002] [.011±.002] [.013] [.004] [.008] 0402 1.00±0.05 0.50±0.05 0.55 0.15 0.30 [.039±.002] [.020±.002] [.022] [.006] [.012] 0603 1.60±0.10 0.80±0.10 0.90 0.15 0.40 [.063±.004] [.031±.004] [.035] [.006] [.016] 0805 2.00±0.20 1.25±0.25 1.45 0.20 0.70 [.079±.008] [.049±.008] [.057] [.008] [.028] 1206 3.20±0.30 1.60±0.20 1.80 0.30 1.50 [.126±.012] [.063±.008] [.071] [.012] [.059] 1210 3.20±0.30 2.50±0.20 2.60 0.30 1.60 [.126±.012] [.098±.008] [.102] [.012] [.063] 1808 4.60±0.30 2.00±0.20 2.20 0.30 2.50 [.181±.012] [.079±.008] [.087] [.012] [.098] 1812 4.60±0.30 3.20±0.30 3.00 0.30 2.50 [.181±.012] [.126±.012] [.118] [.012] [.098] 1825 4.60±0.30 6.35±0.40 2.60 0.30 2.50 [.181±.012] [.250±.016] [.102] [.012] [.098] 2208 5.70±0.40 2.00±0.20 2.20 0.30 3.50 [.220±.016] [.197±.008] [.087] [.012] [.137] 2211 5.70±0.40 2.80±0.40 3.00 0.30 3.50 [.220±.016] [.110±.016] [.118] [.012] [.137] 2220 5.70±0.40 5.00±0.40 3.00 0.30 3.50 [.220±.016] [.197±.016] [.118] [.012] [.137] 2225 5.70±0.40 6.35±0.40 3.00 0.30 3.50 [.220±.016] [.250±.016] [.118] [.012] [.137] A C = ε 0 ε N t C : Cpitne ε 0 : Dieletri onstnt in the ir ε : Proportionl dieletri onstnt A : Overlp Are t : Dieletri Thikness N : Lyers Nominl Cpitne nd Tolerne 1. Stndrd Combintion of Nominl Cpitne nd Tolerne 2. E Series (Stndrd Number) Clss EIA Tolerne Nominl Cpitor E- Applition Cpitne Series Ι NPO J (±5%),K (±10%) E-12,E-24 Series Π X7R K(±10%), M(±20%) E-3,E-6 Series X7E K(±10%), M(±20%) E-3,E-6 Series X5R K(±10%), M(±20%) E-3,E-6 Series Y5U M(±20%),Z(+80/-20 %) E-3 Series Y5V M(±20%),Z(+80/-20 %) E-3 Series Z5U M(±20%),Z(+80/-20 %) E-3 Series E-3 1.0 2.2 4.7 E-6 1.0 1.5 2.2 3.3 4.7 6.8 E12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 E24 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.1-109-
Generl Introdution +EIA Designtions For Clss ΙDieletris Coeffiient of pitne (ppm/ ) Multiplier pplible to olumn Ex.: C0G Negtive 0±30ppm/ U2J Negtive 750±120ppm/ Tolerne of temp. oeff.(ppm/ ) 0.0 C -1.0 0 30 G 1.0 M -10 1 60 H 1.5 P -100 2 120 J 2.2 R -1000 3 250 K 3.3 S -10000 4 500 L 4.7 T +1 5 1000 M 7.5 U +10 6 2500 N +100 7 +1000 8 +10000 9 For Clss Π Dieletris Low Temp. High Temp. Mx. % C -55 X +45 3 ±1.0% A -30 Y +65 4 ±1.2% B +10 Z +85 5 ±2.2% C +105 6 ±3.3% D +125 7 ±4.7% E +150 8 ±7.5% F +200 9 ±10.0% P ±15.0% R ±22.0% S +22% /-33% T +22% /-56% U +22% /-82% V Ex.: X7R -55 ~ +125 ±15% Y5V -30 ~ +85 +22%/-82% Opertion Temperture Rnge Clss EIA Dieletri Code Temperture Rnge( ) Cpitne Chnge Referene Temperture Ι NPO N -55 ~ +125 0±30 ppm/ 20 Π X7R X -55 ~ +125 ±15% 20 X7E C -55 ~ +125 ±4.7% 25 X5R B -55 ~ +85 ±15% 20 Y5V Y -30 ~ +85 +22/-82 % 20 Y5U E -30 ~ +85 +22/-56 % 25 Z5U Z +10 ~ +85 +22/-56 % 25 Dieletri Mteril Aging Rte C/C( %) 2 0-2 -4-6 -8-10 Aging Rte NPO X5R/X7R Aging Rte NPO: 0 X7R/X5R : 2 ~ 4 % /dede Y5U/Z5U : 4~6% / dete Y5V : 6~10 % /dede After performing De-Aging t 150±5 for 30 minutes nd plement room temperture for 48 hours. -12-14 Y5U/Z5U -16-18 01 (48Hr) 10 100 Y5V 1000 hour - 110-
Reommended Bord Pttern Improper iruit lyout nd pd/lnd size my use exessive or not enough solder mount on the PC bord. Not enough solder my rete wek joint, nd exessive solder my inrese the potentil of mehnil or therml rks on the ermi pitor. Therefore we reommend the lnd size to be s shown in the following tble: 1. Size nd reommend lnd dimensions for reflow soldering C B Cpitor Slit Lnd E D A Solder Resistor EIA Code Chip (mm) Lnd (mm) L W A B C D E 0201 0.60 0.30 0.2~0.3 0.2~0.4 0.2~0.4 -- -- 0402 1.00 0.50 0.3~0.5 0.3~0.5 0.4~0.6 -- -- 0603 1.60 0.80 0.4~0.6 0.6~0.7 0.6~0.8 -- -- 0805 2.00 1.25 0.7~0.9 0.6~0.8 0.8~1.1 -- -- 1206 3.20 1.60 2.2~2.4 0.8~0.9 1.0~1.4 1.0~2.0 3.2~3.7 1210 3.20 2.50 2.2~2.4 1.0~1.2 1.8~2.3 1.0~2.0 4.1~4.6 1808 4.60 2.00 2.8~3.4 1.8~2.0 1.5~1.8 1.0~2.8 3.6~4.1 1812 4.60 3.20 2.8~3.4 1.8~2.0 2.3~3.0 1.0~2.8 4.8~5.3 1825 4.60 6.35 2.8~3.4 1.8~2.0 5.1~5.8 1.0~4.0 7.1~8.3 2208 5.70 2.00 4.0~4.6 2.0~2.2 1.5~1.8 1.0~4.0 3.6~4.1 2211 5.70 2.80 4.0~4.6 2.0~2.2 2.0~2.6 1.0~4.0 4.4~4.9 2220 5.70 5.00 4.0~4.6 2.0~2.2 3.5~4.8 1.0~4.0 6.6~7.1 2225 5.70 6.35 4.0~4.6 2.0~2.2 5.1~5.8 1.0~4.0 7.1~8.3 2. Mehnil strength vries ording to lotion of hip pitors on the P.C. bord. Design lyout of omponents on the PC bord must be suh wy to minimize the stress imposed on the omponents, upon flexure of the bords in depneliztion or other proesses. e perfortion slit b Component lyout lose to the edge of the bord or the depneliztion line is not reommended. Suseptibility to stress is in the order of: >b> nd d>e d Mounting 1. Sometimes rk is used by the impt lod due to sution nozzle in pik nd ple opertion. In pik nd ple opertion, if the low ded point is too low, exessive stress is pplied to omponent. This my use rks in the ermi pitor, therefore it is required to move low ded point of sution nozzle to the higher level to minimize the bord wrp ge nd stress on the omponents. Nozzle pressure is typilly djusted to 1N to 3N (stti lod) during the pik nd ple opertion. Exessive Stress Wrping of Bord Wrping of Bord Nozzle Crk PCB Exmple : 0805 & 1206 Support pin 2. Amount of Adhesive b b 0.2mm min. 70 ~ 100 μm Do not touh the solder lnd - 111-
Hndling fter hip mounted 1. Proper hndling is reommended, sine exessive bending nd twist of the bord, depends on the orienttion of the hip on the bord, my indue mehnil stress nd use internl rk in the pitor. Higher potentil of rk Lower potentil of rk Bending Twist 2. There is potentil of rk if bord is wrped due to exessive lod by hek pin Support Pin Chek pin Chek pin 3. Exmples of PCB dividing/breking jigs: The outline of PCB breking jig is shown below. It is reommended when dividing or breking PCB tht they re held ner the jig where no bending will our, this wy there will be no ompressive stress pplied to the omponents on the PCB. Do not hold the PCB t position whih is fr wy from the jig, tensile stress to the omponents my use them to rk. PCB V-groove P CB splitting jig No Good Dividing Reommend Dividing PCB V-groove Chip Component Chi p Co mponent - 112-
+Soldering 1. Wve Soldering Most of omponents re wve soldered with solder t 230 to 250 C. Adequte re must be tken to prevent the potentil of therml rks on the ermi pitors. Refer to the soldering methods below for optimum soldering benefits. Temperture ( C) Reommend flow soldering temperture Profile Soldering Pre-heting Cooling 300 250 230 200 T Soldering Method Chnge in Temp.( ) 1206 nd Under T 100~130 mx. 120seonds or more 60seonds or more 2 to 3 se. To optimize the result of soldering, proper preheting is essentil: 1) Prehet temperture is too low. Flux flows to esily b. Possibility of therml rks 2) Prehet temperture is too high. Flux deteriortes even when oxide film is removed b. Cuses wrping of iruit bord. Loss of relibility of hip nd other omponents Cooling Condition: Nturl ooling using ir is reommended. If the hips re dipped into solvent for lening, the temperture differene (ΔT ) between the solvent nd the hips must be less thn 100 C. 2. Reflow Soldering Prehet nd grdul inrese in temperture to the reflow temperture is reommended to derese the potentil of therml rk on the omponents. The reommended heting rte depends on the size of omponent, however it should not exeed 3 C/Se. Reommend reflow profile for Led-Free soldering temperture Profile (MIL-STD-202G #210F) Pre-heting Soldering Cooling Temperture ( C) 260mx. 217 T Soldering Method 260 C mx./ 10 se. Chnge in Temp.( ) 1206 nd Under T 190 1210 nd Over T 130 The yles of soldering : Twie (Mx.) - 113-
150 C /60se. Min. 70 to 90 se. - 114-
3. Hnd Soldering Sudden temperture hnge in omponents, results in temperture grdient reommended in the following tble, nd therefore my use internl therml rks in the omponents. In generl hnd soldering method is not reommended unless proper preheting nd hndling prties hve been tken. Cre must lso be tken not to touh the ermi body of the pitor with the tip of solder Iron. 350 Soldering Method Temperture ( C) 250 200 1206 nd Under 1210 nd Over Chnge in Temp.( ) T 150 T 130 Within 5 seonds. How to Solder Repir by Solder Iron 1) Seletion of the soldering iron tip The required temperture of solder iron for ny type of repir depends on the type of the tip, the substrte mteril, nd the solder lnd size. 2) reommended solder iron ondition.) Prehet the substrte to (60 C to 120 C) on hot plte. Note tht due to the het loss, the tul setting of the hot plte my hve to be higher. (For exmple 100 C to 150 C) b.) Soldering iron power shll not exeed 30 W..) Soldering iron tip dimeter shll not exeed 3mm. d.) Temperture of iron tip shll not exeed 350 C of Vlue,nd the proess should be finished within 5 seonds. (refer to MIL-STD-202G) e.) Do not touh the ermi body with the tip of solder iron. Diret ontt of the soldering iron tip to ermi body my use therml rks. f.) After soldering opertion, let the produts ool down grdully in the room temperture. +Storge Store the pitors where the temperture nd reltive humidity don t exeed 40 C nd 70%RH. We reommend tht the pitors be used within 6 months from the dte of mnufturing. Store the produts in the originl pkge nd do not open the outer wrpped, polyethylene bg, till just before usge. If it is open, sel it s soon s possible or keep it in desint with desition gent. - 115-