7W7W DUAL BRIDGE AMPLIFIER WIDE SUPPLY VOLTAGE RANGE (3.518V) MINIMUM EXTERNAL COMPONENTS NO SWR CAPACITOR NO BOOTSTRAP NO BOUCHEROT CELLS INTERNALLY FIXED GAIN STANDBY & MUTE FUNCTIONS SHORT CIRCUIT PROTECTION THERMAL OVERLOAD PROTECTION DESCRIPTION The TDA766SA is a dual bridge amplifier specially designed for LCD Monitor, PC Motherboard, TV and Portable Radio applications. TECHNOLOGY BI0II CLIPWATT15 ORDERING NUMBER: TDA766SA Pin to pin compatible with: TDA766S, TDA766, TDA766M, TDA766MA, TDA766B, TDA797SA & TDA797. BLOCK AND APPLICATION DIAGRAM V CC IN1 0.µF 4 3 13 1 OUT1 470µF 100nF STBY 7 IN 0.µF SGND 9 Vref 1 15 OUT1 OUT MUTE 6 PWGND 8 14 OUT D94AU175B September 003 1/11
ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V s Supply Voltage 0 V I O Output Peak Current (internally limited) A P tot Total Power Dissipation (T amb = 70 C) 0 W T op Operating Temperature 0 to 70 C T stg, T j Storage and Junction Temperature 40 to 150 C THERMAL DATA Symbol Parameter Value Unit R th jcase Thermal Resistance Junctioncase Typ = 1.8; Max. =.5 C/W R th jamb Thermal Resistance Junctionambient 48 C/W PIN CONNECTION (Top view) 15 14 13 1 11 10 9 8 7 6 5 4 3 1 OUT OUT VCC IN N.C. N.C. SGND PWGND STBY MUTE N.C. IN1 V CC OUT1 OUT1 D03AU1463 ELECTRICAL CHARACTERISTCS (V CC = 11V, R L = 8Ω, f = 1KHz, T amb = 5 C unless otherwise specified) Symbol Parameter Test Condition Min. Typ. Max. Unit V CC Supply Range 3 11 18 V I q Total Quiescent Current 50 65 ma V OS Output Offset Voltage 10 mv P O Output Power THD 10% 6.3 7 W THD Total Harmonic Distortion P O = 1W 0.05 0. % P O = 0.1W to W 1 % f = 100Hz to 15KHz SVR Supply Voltage Rejection f = 100Hz, VR =0.5V 40 56 db CT Crosstalk 46 60 db A MUTE Mute Attenuation 60 80 db T w Thermal Threshold 150 C G V Closed Loop Voltage Gain 5 6 7 db G V Voltage Gain Matching 0.5 db /11
ELECTRICAL CHARACTERISTCS (continued) (V CC = 11V, R L = 8Ω, f = 1KHz, T amb = 5 C unless otherwise specified) Symbol Parameter Test Condition Min. Typ. Max. Unit R i Input Resistance 5 30 KΩ VT MUTE Mute Threshold for V CC > 6.4V; Vo = 30dB.3.9 4.1 V for V CC < 6.4V; Vo = 30dB V CC / 1 V CC / 075 V CC / 0.5 VT STBY Stby Threshold 0.8 1.3 1.8 V I STBY Stby Current V6 = GND 100 µa e N Total Output Voltage A Curve; f = 0Hzto 0KHz 150 µv V APPLICATION SUGGESTION STANDBY AND MUTE FUNCTIONS (A) Microprocessor Application In order to avoid annoying "PopNoise" during TurnOn/Off transients, it is necessary to guarantee the right Stby and mute signals sequence. It is quite simple to obtain this function using a microprocessor (Fig. 1 and ). At first Stby signal (from µp) goes high and the voltage across the Stby terminal (Pin 7) starts to increase exponentially. The external RC network is intended to turnon slowly the biasing circuits of the amplifier, this to avoid "POP" and "CLICK" on the outputs. When this voltage reaches the Stby threshold level, the amplifier is switchedon and the external capacitors in series to the input terminals (C3, C53) start to charge. It's necessary to mantain the mute signal low until the capacitors are fully charged, this to avoid that the device goes in play mode causing a loud "Pop Noise" on the speakers. A delay of 10000ms between Stby and mute signals is suitable for a proper operation. Figure 1. Microprocessor Application VCC IN1 C1 0.µF 4 3 13 1 C5 470µF OUT1 C6 100nF STBY R1 10K 7 C 10µF µp SGND 9 IN C3 0.µF Vref 1 15 OUT1 OUT MUTE R 10K 6 C4 1µF PWGND 8 14 OUT D95AU58A 3/11
Figure. Microprocessor Driving Signals V S (V) V IN (mv) V STBY pin 7 1.8 1.3 0.8 V MUTE pin 6 4.1.9.3 I q (ma) V OUT (V) OFF STBY MUTE PLAY MUTE STBY OFF D96AU59mod B) Low Cost Application In low cost applications where the µp is not present, the suggested circuit is shown in fig.3. The Stby and mute terminals are tied together and they are connected to the supply line via an external voltage divider. The device is switchedon/off from the supply line and the external capacitor C4 is intended to delay the Stby and mute threshold exceeding, avoiding "Popping" problems. 4/11
Figure 3. Standalone lowcost Application VCC R1 47K IN1 C3 0.µF STBY 4 7 3 13 1 C1 470µF OUT1 C 100nF R 47K C4 10µF SGND 9 IN C5 0.µF 1 Vref 15 OUT1 OUT MUTE 6 PWGND 8 14 OUT D95AU60A Figure 4. Distortion vs Frequency Figure 5. Gain vs Frequency THD(%) 10 Level(dBr) 5.0000 1 Vcc = 11 V Rl = 8 ohm 4.0000 3.0000.0000 1.0000 Vcc = 11V Rl = 8 ohm Pout = 1W 0.0 0.1 Pout = 100mW 1.000.000 Pout = W 0.010 100 1k 10k 0k fr equenc y (Hz) 3.000 4.000 5.000 10 100 1k 10k 100k frequency (Hz) 5/11
Figure 6. Mute Attenuation vs Vpin.8 Attenuation (db) 10 0 10 0 30 40 50 60 70 80 90 100 1 1.5.5 3 3.5 4 4.5 5 Vpin.6(V) Figure 8. Quiescent Current vs Supply Voltage Iq (ma) 70 65 60 55 50 45 40 35 30 3 4 5 6 7 8 9 10 11 1 13 14 15 16 17 18 Vsupply(V) Figure 7. StandBy attenuation vs Vpin 9 Attenuation (db) 10 0 10 0 30 40 50 60 70 80 90 100 110 10 0 0. 0.4 0.6 0.8 1 1. 1.4 1.6 1.8..4 Vpin.7 (V) 6/11
Figure 9. PC Board Component Layout Figure 10. Evaluation Board Top Layer Layout Figure 11. Evaluation Board Bottom Layer Layout 7/11
HEAT SINK DIMENSIONING: In order to avoid the thermal protection intervention, that is placed approximatively at T j = 150 C, it is important the dimensioning of the Heat Sinker R Th ( C/W). The parameters that influence the dimensioning are: Maximum dissipated power for the device (P dmax ) Max thermal resistance Junction to case (R Th jc ) Max. ambient temperature T amb max Quiescent current I q (ma) Example: V CC = 11V, R load = 8ohm, R Th jc =.5 C/W, T amb max = 50 C V P dmax = (N channels) cc Π R I q V cc load P dmax = ( 3.0 ) 0.5 = 6.5 W (Heat Sinker) 150 T R amb max Th ca = R P Th jc = 150 50.5 = 1.8 C/W d max 6.5 In figure 1 is shown the Power derating curve for the device. Figure 1. Power derating curve 5 0 Pd (W) 15 10 (b) (a) a) Infinite Heatsink b) 7 C/ W c) 10 C/ W 5 (c) 0 0 40 80 10 160 Tamb ( C) 8/11
Clipwatt Assembling Suggestions The suggested mounting method of Clipwatt on external heat sink, requires the use of a clip placed as much as possible in the plastic body center, as indicated in the example of figure 13. A thermal grease can be used in order to reduce the additional thermal resistance of the contact between package and heatsink. A pressing force of 7 10 Kg gives a good contact and the clip must be designed in order to avoid a maximum contact pressure of 15 Kg/mm between it and the plastic body case. As example, if a 15Kg force is applied by the clip on the package, the clip must have a contact area of 1mm at least. Figure 13. Example of right placement of the clip 9/11
mm inch DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 3. 0.16 OUTLINE AND MECHANICAL DATA B 1.05 0.041 C 0.15 0.006 D 1.55 0.061 Weight: 1.9gr E 0.49 0.55 0.019 0.0 F 0.67 0.73 0.06 0.09 G 1.14 1.7 1.4 0.045 0.050 0.055 G1 17.57 17.78 17.91 0.69 0.700 0.705 H1 1 0.480 H 18.6 0.73 H3 19.85 0.781 L 17.95 0.707 L1 14.45 0.569 L 10.7 11 11. 0.41 0.433 0.441 L3 5.5 0.17 M.54 0.100 Clipwatt15 M1.54 0.100 0044538 10/11
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