Technical ZPower LED Data X10490 Sheet Specification SFT825ZS Drawn SSC Approval CUSTOMER Approval Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet CONTENTS 1. Feature & Application 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Color & Binning 6. Rank of SFT825ZS 7. Outline Dimension 8. Packing 9. Soldering 10. Precaution for use 11. Handling of Silicone Resin LEDs 12. Reliability Test Item and Condition Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet Description SFT825ZS This surfacemount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone. The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range 40 to 100. The high reliability feature is crucial to Automotive interior and Indoor ESS. SFT825ZS Features Pbfree Reflow Soldering application RoHS Compliant 6Pin (R,G,B separate) type White colored SMT package and diffused (milky color) Suitable for all SMT assembly methods ESDwithstand voltage : up to 6 kv (MILSTD883D) Encapsulating Resin : hard silicone resin High Reliability (silicone resin) Applications Indoor and outdoor displays LCD Backlights etc. R G B displays Automotive Signage and Channel letter Indicator Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 2. Absolute maximum ratings Parameter Forward Current Forward Peak Surge Current *2 Symbol M 30 100 Value 30 100 (Ta=25ºC) Unit 30 ma 100 ma Reverse Voltage (per die) V R 5 V Power Dissipation P d 81 *3 120 *3 114 *3 mw 263 *4 Operating Temperature T opr 40 ~ +100 ºC Storage Temperature T stg 40 ~ +100 ºC ESD Sensitivity *5 ±20,000V HBM (G, B) ±6,000V HBM (R) *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio. *3 The value for one LED device.(single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. *5 It is included the zener chip to protect the product from ESD Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 3. Electric & Optical characteristics Parameter Forward Voltage Reverse Current Luminance Intensity *1 1.7 Luminance Flux Φ V (per chip) 2.8 0.93 Peak Wavelength Dominant Wavelength Spectral Bandwidth Viewing Angle *3 R, G, B Symbol V F I V λ P λ d λ 2θ ½ Condition (per chip) (per die) 632 41 Optical Efficiency η op (per chip) 44 15 278 Thermal Resistance (one chip on) Rth I 277 ja F 220 Min 1.8 3.0 3.0 620 520 455 Typ 2.1 3.2 3.2 1 V R =10V I R (per die) 1 µa 1 700 1200 400 518 453 623 527 460 14 33 23 120 (Ta=25ºC) Max 2.3 3.8 3.6 1100 1600 560 625 535 465 Unit V mcd lm nm nm nm deg. lm/w K/W *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2 Please refer to CIE 1931 chromaticity diagram *3 2 ½ is the offaxis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 4. Optical characteristics Forward Current vs. Forward Voltage (per die) Forward Current IFP [ma] (T a =25 O C ) 100 50 20 10 5 1 1.6 2.0 2.4 2.8 3.2 3.6 4.0 4.4 4.8 Forward Voltage VF [V] Relative Luminous Intensity vs Forward Current Relative Luminosity (a.u.) 6 5 4 3 2 1 RED BLUE GREEN (T a =25 O C ) 0 0 20 40 60 80 100 120 Forward Current IFP [ma] Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 4. Optical characteristics Ambient Temperature vs. Allowable Forward Current (per die) Forward Current IF[mA],, 1 CHIP ON 30 3 CHIP ON 20 10 0 0 20 40 60 80 100 Ambient Tenperature[ o C] Radiation Diagram 30 0 30 (T a =25 O C ) 60 60 90 90 Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 4. Optical characteristics 1.0 Spectrum (T A =25, /chip) Relative Intensity [a.u.] 0.8 0.6 0.4 RED GREEN BLUE 0.2 0.0 400 500 600 700 800 Wavelength [nm] Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 0.9 5. Color & Binning y 0.8 0.7 0.6 0.5 0.4 0.3 515 520 525 530 535 510 540 545 550 505 555 560 500 495 490 A B 565 570 575 580 585 590 595 600 610 620 630 830 0.2 0.1 485 480 475 470 460 Bluish White 2 1 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 x Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 5. Color & Binning 0.30 g h 0.28 0.26 e f y 0.24 c d 0.22 a b 0.20 0.22 0.24 0.26 0.28 0.30 x Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 6. Rank of SFT825ZS [Note] All measurements were made under the standardized environment of SSC. In order to ensure availability, single color rank will not be orderable. Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 7.Outline Dimension Package Outlines 6 5 4 Package Marking (Cathode) 1 2 3 ( Tolerance: ±0.2, Unit: mm ) Anode Circuit Diagram 6 5 Anode Cathode 4 Recommended Solder Pad ESD Protection Device 1 Cathode 2 Anode 3 Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS HeatResistant Polymer Hard Silicone Resin (Diffused) Ag Plating Copper Alloy Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 8. Packing Package Marking 2.0±0.05 MAX.5 3.7±0.1 4±0.1 1.7±0.1 2.9±0.1 MAX.5 2.0 ± 0.2 180 +0 3 LABLE 13 ±0.2 11.4 ±0.1 9.0 ± 0.3 30 10 60 22 ( Tolerance: ±0.2, Unit: mm ) (1)Quantity : 2000 pcs/reel (2)Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3)Adhesion Strength of Cover Tape : Adhesion strength to be 0.10.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4)Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet Reel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) TYPE 7inch SIZE (mm) a b c 245 220 102 245 220 142 1 SIDE c QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. TUV Acriche Semiconductor EcoLight RoHS a MADE IN KOREA b 1 Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 9. Lot Number The lot number is composed of the following characters; SFT # ~ # SFT First Part Name Year (6 for 2006, 7 for 2007, 8 for 2008 ) Month ( 01 for Jan., 02 for Feb., 11 for Nov., 12 for Dec.) Day ( 01, 02, 03, 04, 28, 29, 30, 31.) # ~# The number of the internal quality control XXX QUANTITY : 2000 LOT NUMBER : SFT70426 01 512 PART NUMBER : SFT825ZS SEOUL SEMICONDUCTOR CO., LTD. Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 10. Soldering (1) Reflow Soldering Conditions / Profile (Lead Free Solder) Temp [ C] 260 240 220 200 Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Ts : Surface temp of PCB (min) 180 ~ Preheating Rising 5 C/sec Cooling 5 C/sec 150 0 Time [Hr] (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don t guarantee the products. Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 11. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 1012hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moistureproof packing. (11) Repack unused products with antimoisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Document No. : SSCQP70724 (Rev.00)
Technical ZPower LED Data X10490 Sheet 12. Reliability Test Item and Condition Item Thermal Shock Temperature Cycle High Temperature Storage Reference EIAJ ED 4701 EIAJ ED 4701 EIAJ ED 4701 Test Condition T a =40 o C (30MIN) ~ 100 o C (30MIN) T a =40 o C (30MIN) ~ 25 o C (5MIN) ~ 100 o C (30MIN) ~ 25 o C (5MIN) T a =100 o C Duration / Cycle 100 Cycle 100 Cycle 1000 Hours Number of Damage High Temperature High Humidity Storage EIAJ ED 4701 T a =85 o C, RH=85% 1000 Hours Low Temperature Storage EIAJ ED 4701 T a =40 o C 1000 Hours Operating Endurance Test Internal Reference T a =25 o C, 1000 Hours High Temperature High Humidity Life Test Internal Reference T a =85 o C, RH=85%, =15mA 300 Hours High Temperature Life Test Internal Reference T a =85 o C, 500 Hours Low Temperature Life Test Internal Reference T a =40 o C, 1000 Hours ESD(HBM) MILSTD 883D 1KV at 1.5kΩ; 100pF 3 Time Criteria for Judging the Damage Item Symbol Condition Criteria for Judgement MIN MAX Forward Voltage V F USL *1 1.2 Reverse Current I R V R =5V USL *1 2.0 Luminous Intensity I V LSL *2 0.5 Note : *1 USL : Upper Standard Level *2 LSL : Lower Standard Level Document No. : SSCQP70724 (Rev.00)