FEAURES SYMBOL QUICK REFERENCE DAA Low forward volt drop Fast switching Reverse surge capability High thermal cycling performance Low thermal resistance a a2 3 V R = 35 V/ 40 V/ 45 V I O(AV) = 0 A V F 0.6 V GENERAL DESCRIPION Dual, common cathode schottky rectifier diodes in a conventional leaded plastic package and a surface mounting plastic package. Intended for use as output rectifiers in low voltage, high frequency switched mode power supplies. he BYV8 series is supplied in the SO78 conventional leaded package. he BYV8B series is supplied in the SO404 surface mounting package. PINNING SO78 (O220AB) SO404 k 2 PIN DESCRIPION anode (a) 2 cathode (k) 3 anode 2 (a) tab tab 2 tab cathode (k) 23 3 LIMIING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 34) SYMBOL PARAMEER CONDIIONS MIN. MAX. UNI BYV8-35 40 45 BYV8B- 35 40 45 V RRM Peak repetitive reverse - 35 40 45 V voltage V RWM Working peak reverse - 35 40 45 V voltage V R Continuous reverse voltage mb 08 C - 35 40 45 V I O(AV) Average rectified forward square wave; δ = 0.5; - 0 A current (both diodes mb 27 C conducting) I FRM Repetitive peak forward square wave; δ = 0.5; - 0 A current (per diode) mb 27 C I FSM Non-repetitive peak forward t = 0 ms - 00 A current per diode t = 8.3 ms - 0 A sinusoidal; j = 25 C prior to surge; with reapplied V RRM() I RRM Peak repetitive reverse pulse width and repetition rate - A surge current per diode limited by j j Operating junction - 50 C temperature stg Storage temperature - 65 75 C. It is not possible to make connection to pin 2 of the SO404 pckage. May 998 Rev.300
HERMAL RESISANCES SYMBOL PARAMEER CONDIIONS MIN. YP. MAX. UNI R th j-mb hermal resistance junction per diode - - 4.5 K/W to mounting base both diodes - - 3 K/W R th j-a hermal resistance junction SO78 package in free air - 60 - K/W to ambient SO404 package, pcb mounted, minimum - 50 - K/W footprint, FR4 board ELECRICAL CHARACERISICS j = 25 C unless otherwise specified SYMBOL PARAMEER CONDIIONS MIN. YP. MAX. UNI V F Forward voltage per diode I F = 5 A; j = 25 C - 0.52 0.6 V I F = 0 A - 0.72 0.87 V I R Reverse current per diode V R = V RWM - 0.06 0.5 ma V R = V RWM ; j = 00 C - 6 5 ma C d Junction capacitance per V R = 5 V; f = MHz, j = 25 C to 25 C - 55 - pf diode May 998 2 Rev.300
Forward dissipation, PF (W) PBYR045CD 5 Vo = 0.43 V Rs = 0.034 Ohms 4 0.5 3 2 0. 0.2 I tp D = mb() / C 37.5 D =.0 32 55.5 t 0 50 0 2 3 4 5 6 7 8 Average forward current, IF(AV) (A) Fig.. Maximum forward dissipation P F = f(i F(AV) ) per diode; square current waveform where I F(AV) =I F(RMS) x D. tp 46.5 4 Reverse current, IR (ma) 00 0 25 C 00 C 75 C 50 C 0. j = 25 C PBYR645C 0.0 0 25 50 Reverse voltage, VR (V) Fig.4. ypical reverse leakage current per diode; I R = f(v R ); parameter j Forward dissipation, PF (W) 5 Vo = 0.43 V Rs = 0.034 Ohms 4 3 2 4 PBYR045CD mb() / C 37.5 a =.57.9 2.2 2.8 32 46.5 4 000 00 Cd / pf PBYR645C 55.5 0 50 0 2 3 4 5 Average forward current, IF(AV) (A) Fig.2. Maximum forward dissipation P F = f(i F(AV) ) per diode; sinusoidal current waveform where a = form factor = I F(RMS) / I F(AV). 0 0 00 VR / V Fig.5. ypical junction capacitance per diode; C d = f(v R ); f = MHz; j = 25 C to 25 C. 20 Forward current, IF (A) j = 25 C j = 25 C BYV8 0 ransient thermal impedance, Zth j-mb (K/W) 5 0 typ 5 0. P D tp tp D = 0 0 0.2 0.4 0.6 0.8.2.4 Forward voltage, VF (V) Fig.3. ypical and imum forward characteristic I F = f(v F ); parameter j t 0.0 us 0us 00us ms 0ms 00ms s 0s pulse width, tp (s) BYV8 Fig.6. ransient thermal impedance; per diode; Z th j-mb = f(t p ). May 998 3 Rev.300
MECHANICAL DAA Dimensions in mm Net Mass: 2 g 4,5 0,3 3,7,3 2,8 5,9 min 5,8 3,0 not tinned,3 (2x) 2 3 2,54 2,54 3,0 3,5 min 0,9 (3x) 0,6 2,4 Notes. Refer to mounting instructions for SO78 (O220) envelopes. 2. Epoxy meets UL94 V0 at /8". Fig.7. SO78 (O220AB). pin 2 connected to mounting base. May 998 4 Rev.300
MECHANICAL DAA Dimensions in mm Net Mass:.4 g 0.3 4.5.4 5.4 2.5 2.54 (x2) MOUNING INSRUCIONS 0.85 (x2) Fig.8. SO404 : centre pin connected to mounting base. 0.5 Dimensions in mm.5 9.0 7.5 2.0 3.8 5.08 Fig.9. SO404 : minimum pad sizes for surface mounting. Notes. Plastic meets UL94 V0 at /8". May 998 5 Rev.300
DEFINIIONS Data sheet status Objective specification his data sheet contains target or goal specifications for product development. Preliminary specification his data sheet contains preliminary data; supplementary data may be published later. his data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 34). Stress above one or more of the limiting values may cause permanent damage to the device. hese are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 998 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. he information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPOR APPLICAIONS hese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 998 6 Rev.300