RF and Microwave Microelectronics Packaging II

RF and Microwave Microelectronics Packaging II

Ken Kuang Rick Sturdivant Editors RF and Microwave Microelectronics Packaging II

Editors Ken Kuang Torrey Hills Technologies, LLC San Diego, CA, USA Rick Sturdivant Azusa Pacific University Azusa, California, USA ISBN 978-3-319-51696-7 DOI 10.1007/978-3-319-51697-4 ISBN 978-3-319-51697-4 (ebook) Library of Congress Control Number: 2009939146 Springer International Publishing AG 2017 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland

From Ken Kuang: To my family, Zheng, Simon and Andrew, you are my inspiration and support. From Rick Sturdivant: Dedicated to my parents, Jim and Linda Sturdivant.

Foreword The question how to package an electronic component has become a key issue in RF system development. In many cases it decides about the "to be, or not to be". In the end, it is a combination of electrical, thermal and mechanical properties as well as fabrication cost which makes the difference. All these aspects need to be taken into account and this multi-disciplinary approach distinguishes packaging development from classical circuit design. Moreover, when packaging modules in the microwave and mm-wave range, there is no general solution which could be used as a standard overall. The best choice varies depending on frequency range, application, volume and cost limitations, just to name some of the most important boundary conditions. While in the low GHz range the situation is relatively mature and high-volume lowcost approaches are in routine use for the mobile communications market, in the mm- wave frequency range above 100 GHz the lack of cost-competitive and volumecompatible packaging solutions is still a big bottleneck in getting systems to the market. So, writing a book addressing this extensive and multifaceted field is a major challenge. The authors have chosen their own approach and compiled a selection of expert contributions covering the full scope of topics, from modules to materials and from 3D transitions to thermal management. The reader should not expect an in-depth introduction to all of these fields, which would exceed the scope of a single book by far. Rather she/he will find in the different chapters articles on the various topics that help in getting familiar with the subject and explain typical state-of-theart solutions. Thus, this book provides a good overview as well as useful hints for the practitioner and I am sure it will prove to be a worthwhile addition to the hand library of many microwave engineers. Head of Microwave Department Ferdinand-Braun-Institut, Leibniz-Institut für Höchstfrequenztechnik Berlin, Germany Wolfgang Heinrich vii

Foreword The past decade has been an exciting time in RF. We have seen mobile communication become a technology for the masses. This not only lead to the rise of new types of mobile phones: the smartphone like iphones to Android handsets, it also started a wide range of standards from 3G to 4G, LTE, 4.5G and soon 5G. Every new standard adds complexity to the system. Not only because new standards mean more functions but also more challenges for the packaging engineer in putting all different standards in one handy package while reducing interference between them. The contribution of Nozad Karim gives some good examples. Looking at the other side of the mobile communication line, the basestations, we see a similar proliferation of technology. Take for instance the RF Power amplifiers where basestation manufacturers are moving from traditional LDMOS transistors to GaN transistors. The higher power densities of these new semiconductor technologies require heat spreaders with better heat spreading capabilities. Standard CuW or CPC heat spreaders are not, anymore, fulfilling the requirements put on them by advanced amplifier designs. Managing the dissipated power of these amplifiers can be done by new materials as described by Dr. Wei Fan and Kevin Loutfy. The mobile phone industry is one of the more visible areas where RF and microelectronics are used. This does not mean that there are no other applications for high frequency radio waves. Other interesting developments are the use of RF technology in non-traditional applications like RF Cooking (Microwaves), RF Lighting (using RF induced plasmas) and other technologies where RF Energy is used in other ways than for communication. Many of these new areas are more consumer oriented than traditional infrastructure or aerospace and defense electronics. This also has implications on the packaging. Cost becomes more prominent than ever. Also ease of use for customers not used to RF technology is an increasingly important aspect. This drive for lower cost can be found back in the transition from ceramics materials to laminates. It is also seen in new developments in modules and integration of complete RF systems into the package to help customers with less RF knowledge build a working system. Several of these developments are discussed in this book by Rick Sturdivant, amongst others. ix

x Foreword Finally, I would not do justice to all developments in the more traditional RF packaging if I would not mention the progress in packaging of advanced RF systems like shielding, filter design and advanced thermal solutions. Dr. Min Tan and Dr. Jonathan Holmes give some interesting examples of these developments. I m very excited to see this successor to RF and Microwave Microelectronics Packaging, bringing engineers in electronic packaging the latest developments in high frequency electronics. I hope the reader will enjoy the different articles from academics as well as industry research as much as I did. Ampleon Semiconductors Nijmegen, The Netherlands Michel de Langen

Contents 1 Introduction to Radio Frequency and Microwave Microelectronic Packaging... 1 Rick Sturdivant 2 Packaging of Transmit/Receive Modules.... 19 Rick Sturdivant 3 3D Transitions and Connections.... 33 Rick Sturdivant 4 Electromagnetic Shielding for RF and Microwave Packages... 43 Nozad Karim 5 Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate... 63 Min Tan, Yang Xuan, Yong Ma, Li Li, and Yonghe Zhuang 6 Research on High-Reliable Low-Loss HTCC Technology Applied in Millimeter Wave SMT Package.... 75 Pang Xueman 7 Chip Size Packaging (CSP) for RF MEMS Devices... 83 Li Xiao and Honglang Li 8 The Challenge in Packaging and Assembling the Advanced Power Amplifiers... 99 Cai Liang and Jeff Burger 9 High Thermal Conductivity Materials: Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond... 113 Kevin Loutfy, Birol Sonuparlak, and Raouf Loutfy xi

xii Contents 10 Advancement in High Thermal Conductive Graphite for Microelectronic Packaging... 129 Wei Fan and Xiang Liu 11 Carbon Nanotubes and Graphene for Microwave/RF Electronics Packaging... 147 Xiaoxing Lu Erratum to: Chip Size Packaging (CSP) for RF MEMS Devices........ Index... 169 E1