hick Film Chip ype MCR hick Film Chip Features Small size and lightweight with size range per int l standard. Highly stable in auto-placement surface mounting application. Compatible with flow and reflow soldering. Suitable for lead free soldering. Applications Consumer electronics Medical equipment elecom equipment Automotive, industry Computer Soldering Curve ( C ) 1s ( C ) 25 235 C to 26 C second wave 25 23 C Peak : Less than 245 C 2 first wave 5 K/s 2 18 C Pre Heating Zone 15 2 K/s 2 K/s 15 15 C How to Order Part Number Marking Series Series 3 digit marking for E24 ex. 1 5 ypical values (solid line). Process limits (dotted line). 473 1R 1542 C2 473: 47x1^3 = 47KΩ 15: 1x1^5 = 1MΩ 1R5: 15x1^-1 = 1.5Ω : Ω 1 C to 13 C 2 K/s 5 1 15 2 WAVE soldering. 4 digit marking for E241: Ω~1mΩ ex. forced cooling 1R: R47 47mΩ R1 1mΩ 25 t (s) 1 5 4 digit marking for E96 ex. 1542: 154x1^2 = 15K4Ω 9±3s 1 ~ 15s Heating time Example MCR 63 J 123 LF ype Size Packing olerance Value MCR 21 : ape B: ±.1% 123 = 12x1^3 LF = Lead Free 42 C: ±.25% = 12k Ω 63 D: ±.5% 85 F: ±1% 126 G: ±2% 121 J: ±5% 21 Soldering Zone IR Reflow Soldering t (s) 3 digit marking for E96-63 ex. C2 (see table) 12x1^2 = 1K2Ω Fax: (888)82-8884 email: sales@libertycomponents.com website: www.libertycomponents.com 135
hick Film Chip ype MCR hick Film Chip Configuration Dimensions Protective Coating Outer ermination Layer: Solder L C Middle ermination Layer: Nickel Inner ermination Layer: Ag.Pd/Ag W D High Purity Alumina Substrate Resistive Element (RuO2) Size L W C D 21.6 ±.5.3 ±.5.25 ±.5.15 ±.5.25 ±.5 42 1. ±.5.5 ±.5.2 ±.1.25 ±.1.35 ±.5 63 1.6 ±.1.8 ±.1.3 ±.2.3 ±.2.45 ±.1 85 2. ±.15 1.2 ±.15.4 ±.2.4 ±.2.5 ±.1 126 3.1 ±.15 1.6 ±.15.5 ±.25.5 ±.25.55 ±.1 121 3.1 ±.15 2.65 ±.15.5 ±.2.5 ±.25.55 ±.1 21 5. ±.2 2.5 ±.2.6 ±.25.6 ±.25.6 ±.1 6.3 ±.2 3.1 ±.2.6 ±.25.6 ±.25.6 ±.15 1225 3.1 ±.2 6.3 ±.2.6 ±.25.9 ±.25.6 ±.15 units: mm Power Derating Curve For All Except 21 For 21 Only Rated Load (%) 1 5 7 155 7 125 1 Rated Load (%) 5-5 5 1 15 ( C) -5 5 1 15 ( C) *Maximum dissipation in percentage of rated power as a function of the ambient temperature. 136 Fax: (888)82-8884 email: sales@libertycomponents.com website: www.libertycomponents.com
hick Film Chip ype MCR hick Film Chip Rating ype Size Power Rating at 7 C RCWV Voltage olerance (%) Coefficient (CR; ppm/ C ) Range Min. Standard Values 21 1/2W 15V 3V ± 3 1 Ω 42 1/16W 5V 1V 1 Ω 63 1/1W 5V 1V ±. 1%(B) ±.2 5%(C) ± 5 ± 5 2 Ω 2 Ω 51K Ω 51K Ω 85 1/8W 15V 3V ±.5%(D) ± 5 ± 1 ± 5 2 Ω 1 Ω 51K Ω 126 1/4W 2V 4V ± 2%(G) 21 1/2W 2V 4V ± 1 1W 2V 4V ± 1 Jumper : 21,42,63 size maximum resistance Rmax 5m Ω and rated current I R 1A 85,126,21, size maximum resistance Rmax 5m Ω and rated current I R 2A ~1 Ω : Coefficient of for 42,63,85,126 = -3~+5 Low Coefficient of for 21,21, = ± 3 ype Size 63 85 Power Rating at 7 C 1/1W 1/8W RCWV 32mV 337mV Voltage 754mV 843mV olerance (%) Coefficient (CR; ppm/ C ) ± 3 ± 4 Range Min. 1m Ω 5m Ω 91m Ω 91m Ω 126 1/4W 477mV 1192mV 5m Ω 91m Ω 21 1/2W 675mV 1686mV ± 4 ± 6 4m Ω 22m Ω 47m Ω 39m Ω 1W 954mV 2385mV ± 1 1m Ω 2m Ω 1225 2W 1349mV 3373mV ± 1 ± 15 2m Ω 1m Ω 91m Ω 19m Ω Fax: (888)82-8884 email: sales@libertycomponents.com website: www.libertycomponents.com 137
hick Film Chip ype MCR hick Film Chip Specifications and est Methods IEM SPECIFICAION ES MEHOD DC J :± 5% G:± 2% F: ± 1% D:±.5% C: ±.25% B: ±.1% Zero ohm Jumper 5mΩ IEC 6115-1 4.5 / JIS C 522 5.1 Measure the resistance value. Short time J,G: R ± (2% +.1 Ω ) F,D: R ± (1% +.5 Ω ) C,B: R ± (.5% +.5 Ω ) IEC 6115-1 4.13 / JIS C 522 5.5 2.5X Rated voltage or Voltage for 5 sec. measure resistance after 3 minutes Solderability Over 95% of termination must be covered with solder IEC 6115-1 4.17 / JIS C 522 6.5 After immersing flux, dip in the 245 molten solder bath for 3 ±.5 sec. ± 2 C to Solder Heat Coefficient of (CR) Humidity J,G: R ± (1% +.1 Ω ) F,D,C,B: R ± (.5% +.5 Ω ) J,G:ppm/ C F:± 1 ± 5ppm/ C D,C,B:± 5ppm/ C J,G: R ± (3% +.1 Ω ) F,D: R ± (1% +.5 Ω ) C,B: R ± (.5% +.5 Ω ) IEC 6115-1 4.18 / JIS C 522 6.4 With 26 ± 5 C for 1 ± 1 sec. IEC 6115-1 4.8.4.2 / JIS C 522 5.2 est temperature : 25 C (1) -55 C (2) 25 C (1) 125 C (2) R2-R1 1 CR (ppm/ C) = x x 1 6 R1 2-1 1: 25 C 2: est temperature R1: at reference temperature (1) R2: at test temperature (2) IEC 6115-1 4.24.2 / JIS C 522 7.9 Maintain the temperature of the resistor at 4 ± 2 C and 9~95% R.H. with the rated voltage applied.cycle ON for 1.5 hours and OFF for.5 hour for 1+48/- hours. After 1~4 hour, measure the resistance value. J,G: R ± (3% +.1 Ω ) IEC 6115-1 4.25.1 / JIS C 522 7.1 F,D: R ± (1% +.5 Ω ) Permanent resistance change after 1+48/- C,B: R ± (.5% +.5 Ω ) hours (1.5 hours ON,.5 hour OFF) at RCWV or Keep the resistor at 7 ± 2 C ambient Intermittent Cycle R ± (5% +.1 Ω ) J,G: R ± (1% +.1 Ω ) F,D,C,B: R ± (.5% +.5 Ω ) JIS C 522 5.8 4.xRated voltage ( Voltage) 1 sec ON, 25 sec OFF, test 1, cycles IEC 6115-1 4.19 / JIS C 522 7.4 Repeat 5 cycles as follows -55 C(3 min.) ~ + 25 C(2~3 min.) +125 C(3 min.) ~ + 25 C(2~3 min.) for 21-55 C(3 min.) ~ + 25 C(2~3 min.) +155 C(3 min.) ~ + 25 C(2~3 min.) for others Insulation Between termination and coating must be over IEC 6115-1 4.6.1.1 / JIS C 522 5.6 est voltage: 1 ± 15V Bending Strength J,G: R ± (1% +.1 Ω ) F,D,C,B: R ± (.5% +.5 Ω ) IEC 6115-1 4.33 change after bended on the 9mm PCB. Bend: 3mm for 21, 42, 63, 85 2mm for 126, 21, 1225, 138 Fax: (888)82-8884 email: sales@libertycomponents.com website: www.libertycomponents.com
hick Film Chip ype MCR hick Film Chip - Low Specifications and est Methods IEM SPECIFICAION ES MEHOD DC J :± 5%, F: ±1% IEC 6115-1 4.5 / JIS C 522 5.1 Measure the resistance value. Short time J: R ± (2% +.5m Ω ) F: R ± (1% +.5m Ω ) IEC 6115-1 4.13 / JIS C 522 5.5 2.5X Rated voltage or Voltage for 5 sec. measure resistance after 3 minutes Solderability Over 95% of termination must be covered with solder IEC 6115-1 4.17 / JIS C 522 6.5 After immersing flux, dip in the 245 ± 2 C molten solder bath for 3 ±.5 sec. to Solder Heat J: R ± (1% +.5m Ω ) F: R ± (.5% +.5m Ω ) IEC 6115-1 4.18 / JIS C 522 6.4 With 26 ± 5 C for 1 ± 1 sec. Coefficient of (CR) Size : 63, 85 1mΩ ~ 91mΩ :± 3ppm/ C Size : 126, 21, 5mΩ ~ 91mΩ :ppm/ C Size : 1225 2mΩ ~ 91mΩ :± 1ppm/ C referance for other resistance range in page 4 IEC 6115-1 4.8.4.2 / JIS C 522 5.2 est temperature : 25 C (1) -55 C(2) 25 C (1) -125 C(2) R2-R1 1 CR (ppm/ C) = x x 1 6 R1 2-1 1: 25 C 2: est temperature R1: at reference temperature (1) R2: at test temperature (2) Humidity J: R ± (3% +.5m Ω ) F: R ± (1% +.5m Ω ) IEC 6115-1 4.24.2 / JIS C 522 7.9 Maintain the temperature of the resistor at 4 ± 2 C and 9~95% R.H. with the rated voltage applied.cycle ON for 1.5 hours and OFF for.5 hour for 1+48/- hours. After 1~4 hour, measure the resistance value. Cycle J: R ± (3% +.5m Ω ) F: R ± (1% +.5m Ω ) J: R ± (1% + 1m Ω ) F: R ± (.5% +1m Ω ) IEC 6115-1 4.25.1 / JIS C 522 7.1 Permanent resistance change after 1+48/- hours (1.5 hours ON,.5 hour OFF) at RCWV or Keep the resistor at 7 ± 2 C ambient IEC 6115-1 4.19 / JIS C 522 7.4 Repeat 5 cycles as follows -55 C(3 min.) ~ + 25 C(2~3 min.) +125 C(3 min.) ~ + 25 C(2~3 min.) for 21-55 C(3 min.) ~ + 25 C(2~3 min.) +155 C(3 min.) ~ + 25 C(2~3 min.) for others Insulation Between termination and coating must be over IEC 6115-1 4.6.1.1 / JIS C 522 5.6 est voltage: 1 ± 15V Bending Strength J: R ± (1% + 1m Ω ) F: R ± (.5% +1m Ω ) IEC 6115-1 4.33 change after bended on the 9mm PCB. Bend: 3mm for 21, 42, 63, 85 2mm for 126, 21, 1225, Fax: (888)82-8884 email: sales@libertycomponents.com website: www.libertycomponents.com 139