Accelerating Scale Up of Large Area Electronics Duncan Lindsay Business Development Director, CPI 2015 Centre for Process Innovation Limited. All Rights Reserved.
Who are CPI? CPI is a UK technology innovation centre. Part of the UK High Value Manufacturing Catapult. National Printable Electronics Centre Industrial Biotechnology & Biorefining National Formulation Centre National Biologics Manufacturing Centre We use applied knowledge in science and engineering combined with state of the art facilities to enable our clients to develop, prove, prototype and scale-up the next generation of products and processes.
CPI is A world-class open-access asset-based, independent innovation centre with an integrated technology and business development capability that supports the development of the UK process industry and UK manufacturing
UK National Printable Electronics Centre
Printable Electronics at CPI World class, open-access capability in the scale-up and commercialisation of printable electronic applications 1500m 2 of clean room facilities
Organic Large Area Electronics Optoelectronics Materials Barrier Encapsulation Integrated Smart Systems
Optoelectronics Extensive capability to support the development and production of Solid State Lighting and PV technologies Product and process scale-up from proof of concept (100mm) to GEN2 (370 x 470mm)
Materials Development and prototyping for OTFT Material Studies: flexible substrates, dielectrics, photoresists and organic semiconductors Contract Development of OSC formulations and OTFT
Barrier Encapsulation Roll to Roll Atomic Layer Deposition (ALD) Batch Atomic Layer Deposition A range of other sputtering and vacuum coating technologies
Integrated Smart Systems Functional items produced by the integration of conventional electronic components with devices prepared by large area printing processes. Printing of antennae, M2M communications devices, and sensors.
Applications of Large Area Organic Electronics Photovoltaics and Solid State Lighting Thin film Transistors and Flexible Display Sensors and Biosensors Energy Storage Hybrid Devices Wearable Devices Internet of Things Machine to Machine communication
Case Studies
Organic Thin Film Transistors CPI is working with UK SMEs for the application of organic semiconductor materials to Organic Thin Film Transistor Arrays. CPI maintains a world class facility for the development and pilot production of OTFTs on flexible polymer substrates
PolyPhotonix Established in 2009, PolyPhotonix is a materials science and biophotonic research and development company. Grown from 1 employee to >25
Cohda Design Cohda s Crypsis Lighting offers wireless ultra-bright LEDs that can be repositioned and dimmed within a transparent glass panel using an external magnetic control puck
PragmatIC PragmatIC has unique patented technologies to manufacture flexible integrated circuits on ultra-thin plastic delivering low-cost intelligent electronics
PragmatIC thin, flexible, transparent, robust, disposable
Sapient Sensors The creation of a low cost, single use diagnostic sensor for use in a handheld device providing Point of Contact customised screening for a range of diseases, initially Bovine Tuberculosis, without requirement for pathology laboratory support.
Integrated Smart Systems (Hybrid approach) Functional items produced by the integration of electronic components with circuits prepared by traditional printing processes +
Integrated Smart Systems at CPI Combination of traditional print and conventional electronics equipment Print industry recognised equipment Non cleanroom location Nilpeter roll to roll printing press Litho UV / Conventional Screen UV and WB Flexo UV / Solvent / WB Gravure Solvent Heraeus NIR drying Europlacer Lineo Pick and Place Electronic component attach http://www.uk-cpi.com/equipment-market/integrated-smartsystems/ Conductive adhesive dispense
Hybrid approach Printed Power Printed battery (Enfucell, Blue Spark) Thin film solar cell NFC power source Display Electrochromic (Ynvisible) E ink displays OLED (CPI) Memory/Logic Printed logic (PragmatIC Printing) Printed memory (Thin Film ) Printed transistors Circuit Printed conductive tracks Printed dielectrics Light OLED (CPI) Electroluminescence Sensing Mechanical - Electrochemical - Bio-sensor Conventional Power Conventional batteries Mains NFC power source Display LCD Electronic Components Si Chip Resistors Transistors Circuit PCB Flexible PCB Light LED Edge lit LED Sensing Silicon MEMS
PROJECT SCOPE Supply Chain Opportunity for Printed Electronics applying highly automated integration techniques to eventually meet target costs of <1c/NFC tag. bringing the technology supply-chain together with integrators, convertors and end users. And providing the means for end-users to find, qualify and engage partners to develop their product concepts, to prove feasibility and market appeal for products. enabling pilot-scale commercial deployment and subsequent transfer to volume production. providing a sustainable platform to develop increasingly advanced functionality for NFC enabled products, whilst also delivering recyclability of products not possible with conventional electronics.
PROJECT SCOPE Supply Chain Opportunity for Printed Electronics
Technology readiness perspective
Photonic Sintering
Roll to Roll High Speed Integration SCOPE Project will invest in new technology in 2016
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