ITC117PTR. Integrated Telecom Circuits INTEGRATED CIRCUITS DIVISION

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Transcription:

Integrated Telecom Circuits Parameter Rating Units Relay Load Voltage 3 V Relay Load Current 12 ma rms / ma DC Relay On-Resistance (max 1 Bridge Rectifier Reverse Voltage 1 V Darlington Collector Current 12 ma Darlington Current Gain 1, - Features 37V rms Input/Output Isolation 2mW Hook Switch Drive Power (Logic Compatible No Moving Parts FCC Compatible Part Full-Wave Bridge Rectifier Darlington Transistor for Electronic Inductor Dry Circuits Full Wave Current Detector for Ring Signal or Loop Current Detect JEDEC Standard Pin-Out Board Space and Cost Savings Small 1-Pin SOIC Package (PCMCIA Compatible Applications Data/Fax Modem Voice Mail Systems Telephone Sets Computer Telephony Integration Set Top Box Modems Description This Integrated Telecom Circuit combines a single-pole, normally open (1-Form-A solid state relay, a bridge rectifier, a Darlington transistor, and an optocoupler into one 1-pin SOIC package, consolidating designs and reducing component count in telecom applications. The ITC117 s optocoupler provides for full-wave detection of ringing signals. Approvals UL Recognized Component: File E727 CSA Certified Component: Certificate 139 EN/IEC 9-1 Certified Component: TUV Certificate: B 12 11 27 2 Ordering Information Part # TR Pin Configuration Description 1-Pin SOIC (/Tube 1-Pin SOIC (1/Reel (N/C LED - Form A Relay 1 2 1 1 Output Form A Output Form A/Bridge Input /+ 3 PV 1 LED - Form A Relay Darlington Base 13 (N/C (N/C (N/C Collector - Phototransistor Emitter - Phototransistor 7 ** 12 11 1 9 Darlington Emitter Bridge Output +/Darlington Collector Bridge Output LED - Phototransistor /+ LED - Phototransistor +/ Denotes full-wave detection ** Switching Characteristics of Normally Open Devices Form-A 9% I LOAD 1% t on t off DS-_R7 www.ixysic.com 1

Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Input Control Current, Relay ma Input Control Current, Detector 1 ma Total Package Dissipation 1 1 W Isolation Voltage, Input to Output 37 V rms Operational Temperature - to + C Storage Temperature - to +12 C 1 Derate linearly.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Total Power Dissipation (PD: P D =P HOOKSWITCH + P BRIDGE + P DARLINGTON + P LED P D =(R DS (on (I 2 L + 2(V F + + (V LED ( WHERE: R DS (on = Maximum relay on resistance I L = Maximum loop current V F = Maximum diode forward voltage V CE = Maximum voltage collector to emitter V LED = Maximum LED forward voltage = Maximum LED current Electrical Characteristics @2ºC: Relay Section Parameter Conditions Symbol Min Typ Max Units Output Characteristics Blocking Voltage (Peak - V L - - 3 V P Load Current Continuous - I L - - 12 ma rms / ma DC Peak t=1ms I LPK - - ma P On-Resistance I L =12mA R ON - - 1 Off-State Leakage Current V L =3V, T J =2ºC I LEAK - - 1 A Switching Speeds Turn-On t =ma, V L =1V on - - 3 ms Turn-Off t off - - 3 ms Output Capacitance V L =V, f=1mhz C OUT - 2 - pf Input Characteristics Input Control Current to Activate I L =12mA - - ma Input Voltage Drop =ma V F.9 1. V Reverse Input Voltage - V R - - V Reverse Input Current V R =V I R - - 1 A R7 2 www.ixysic.com

Electrical Characteristics @2ºC: Detector Section Parameter Conditions Symbol Min Typ Max Units Output Characteristics Phototransistor Blocking Voltage I C =1 A BV CEO 2 - V Phototransistor Dark Current V CE =V, =ma I CEO - na Saturation Voltage I C =2mA, =1mA V SAT -.3. V Current Transfer Ratio =ma, V CE =.V CTR 33 - % Input Characteristics Input Control Current I C =2mA, V CE =.V - 2 ma Input Voltage Drop =ma V F.9 1. V Input Current (Detector Must be Off I C =1 A, V CE =V 2 - A Electrical Characteristics @2ºC (Unless Otherwise Noted: Bridge Rectifier Section Parameter Conditions Symbol Min Typ Max Units Reverse Voltage - V RD - - 1 V Forward Voltage Drop D =12mA V FD - - 1. V Reverse Leakage Current T J =2ºC, V R =1V - - 1 I T RD J =ºC - - A Forward Current Continuous - - - 1 I Peak t=1ms FD - - ma Electrical Characteristics @2ºC: Darlington Transistor Section Parameter Conditions Symbol Min Typ Max Units Collector-Emitter Voltage I C =1mA DC, I B =ma V CEO - - V Collector Current, Continuous V C =3.V I C - - 12 ma Power Dissipation - P D - - mw Off-State Collector-Emitter Leakage Current V CE =1V, I B =ma I CEX - - 1 A DC Current Gain V CE =1V DC, I C =12mA h FE 1, - - - Saturation Voltage I C =12mA V CE(sat - - 1. V Total Harmonic Distortion I C =ma, f O =3Hz @ -1dBm - - - - db R7 www.ixysic.com 3

DEVICE PERFORMANCE DATA* 3 3 2 2 1 1 Typical LED Forward Voltage Drop (N=, =ma, T A =2ºC 1.17 1.19 1 3 LED Forward Voltage Drop (V LED Forward Voltage Drop (V 1. 1. 1. 1. Typical LED Forward Voltage Drop =ma =3mA =2mA =1mA =ma. - -2 2 1 12 Power Dissipation (Watts Package Power Derating 1..9.9...7 Operating Area.7.... 2 3 3 7 7 RELAY PERFORMANCE DATA* 2 Typical Turn-On Time (N=, =2mA, I L =12mA DC, T A =2ºC 2 Typical Turn-Off Time (N=, =2mA, I L =12mA DC, T A =2ºC 3 Typical On-Resistance Distribution (N=, I L =12mA DC, T A =2ºC 2 1 1 2 1 1 3 2 2 1 1. 3 1. 1.93 2.2 2.3 2.9 Turn-On Time (ms..1.1.1.22.2.3 Turn-Off Time (ms.7 9.2 9.7 1.7 On-Resistance ( 2 Typical for Switch Operation (N=, I L =12mA DC, T A =2ºC 2 Typical for Switch Dropout (N=, I L =12mA DC, T A =2ºC 3 Typical Blocking Voltage Distribution (N=, T A =2ºC 2 1 1 2 1 1 3 2 2 1 1.3.2...7.9 LED Current (ma.1.3.2...7.9 LED Current (ma 3 37 3 39 1 2 Blocking Voltage (V P * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 www.ixysic.com

RELAY PERFORMANCE DATA (cont* Turn-On Time (ms Typical Turn-On Time vs. LED Forward Current =12mA DC 2. 1. 1. 1. 1.....2 1 1 2 2 3 3 LED Forward Current (ma Turn-Off Time (ms.1.1.1.12.1.. Typical Turn-Off Time vs. LED Forward Current =12mA DC. 1 1 2 2 3 3 LED Forward Current (ma On-Resistance ( 3 2 1 - Typical On-Resistance =12mA DC, =ma -2 2 1 3. Typical Turn-On Time =12mA DC.3 Typical Turn-Off Time ( =ma, I L =12mA Load Current vs. Ambient Temperature ( =ma Turn-On Time (ms 2. 2. 1. 1.. =ma =1mA =2mA Turn-Off Time (ms.2.2.1.1. Percent of Maximum Load Rating (Typical (% 1 7 2 - -2 2 1 - -2 2 1-2 LED Current (ma 1. 1. 1. 1.....2 - Typical for Switch Operation =12mA DC -2 2 1 LED Current (ma 1. 1. 1. 1.....2 - Typical for Switch Dropout =12mA DC -2 2 1 Load Current (ma Typical Load Current vs. Load Voltage ( =ma, T A =2ºC 2 1 1 - -1-1 -2-2. -1. -1. -.. 1. 1. 2. Load Voltage (V Leakage ( A.1.9..7....3.2.1 - Typical Leakage Measured across Pins 1&1 (V L =3V -2 2 1 Blocking Voltage (V P 1 1 39 39 3 3 - Typical Blocking Voltage -2 2 1 Load Current (A 1.....2 Energy Rating Curve 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 www.ixysic.com

Collector Current (ma 2 2 2 1 12 Typical Transfer Characteristics of Single Transistor Detector 1 2 3 7 9 1 Collector Emitter Voltage PHOTOTRANSISTOR PERFORMANCE DATA* =1mA =ma =2mA =1mA Normalized CTR (% Single Transistor Normalized CTR =.V 7 3 2 1 - -2 2 1 12 Temperature (C 12 =1mA =2mA =ma =1mA =1mA =2mA Single Transistor Collector Current vs. Forward Current =.V Normalized CTR (% Single Transistor Normalized CTR vs. Forward Current =.V.. 3. 3. 2. 2. 1. 1.. 2 1 12 1 1 1 2 Forward Current (ma Collector Current (ma 1 2 2 1 12 1 1 1 2 Forward Current (ma DARLINGTON PERFORMANCE DATA* Collector Current (ma Darlington Transistor Collector Current vs. Forward Current =.V 1 1 12 1 2 2 1 12 1 1 1 2 Forward Current (ma Normalized CTR (% 2. 2. 1. 1.. Darlington Transistor Normalized CTR vs. Forward Current =.V 2 1 12 1 1 1 2 Forward Current (ma Normalized CTR (% 3. 2. 2. 1. 1.. - =1mA =2mA =ma =1mA =1mA =2mA Typical Normalized CTR =.V -2 2 1 12 Typical Transfer Characteristics of Darlington Transistor 1 V-I Characteristics for Test Circuit Collector Current (ma 1 2 I b =1A I b =A I b =A I b =A I b =2A V IN (Volts 9 7 2 1 Collector Emitter Voltage 2 1 12 I OUT (ma * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 www.ixysic.com

Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-2. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device Maximum Temperature x Time 2ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R7 www.ixysic.com 7

MECHANICAL DIMENSIONS PIN 1 1.1±.31 (.±.1.2 ±.127 (.1±. PCB Land Pattern 7.93±.127 (.29±. 1.33±.127 (.±..3 X (.2 X 1.1 TYP (. TYP 1.9 (.7 9.3 (.3 PIN 1 7 TYP (. TYP. TYP (.1 TYP.9 TYP (.3 TYP.±.11 (.2±. 2.7±.1 (.1±.2 Lead to Package Standoff: MIN:.2 (.1 MAX:.12 (.. (.2 7 (. DIMENSIONS mm (inches NOTES: 1. Coplanarity =.11 (. max. 2. Leadframe thickness does not include solder plating (1 microinch maximum. TR Tape & Reel 33.2 DIA. (13. DIA. Top Cover Tape Thickness.12 MAX. (. MAX. B =1.7 (.21 W=1 (.3 K =3.2 (.12 A =1.9 (.29 P=12. (.72 K 1 =2.7 (.1 Embossed Carrier Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 1-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-1-2 Dimensions mm (inches For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-_R7 Copyright 213, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 9/27/213